Restaino; Darryl D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Restaino; Darryl D..The latest application filed is for "metrology management".

Company Profile

0.29.29

Restaino; Darryl D. - Modena NY US
Restaino; Darryl D. - Hopewell Junction NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Metrology management Grant 9,652,729 - Hoffman, Jr. , et al. May 16, 2	2017-05-16
Metrology Management App 20130110448 - Hoffman, JR.; William K. ; et al.	2013-05-02
Low k dielectric CVD film formation process with in-situ imbedded nanolayers to improve mechanical properties Grant 7,998,880 - Nguyen , et al. August 16, 2	2011-08-16
Method for preventing backside defects in dielectric layers formed on semiconductor substrates Grant 7,910,484 - Dziobkowski , et al. March 22, 2	2011-03-22
Structures with improved interfacial strength of SiCOH dielectrics and method for preparing the same Grant 7,888,741 - Edelstein , et al. February 15, 2	2011-02-15
BEOL interconnect structures with improved resistance to stress Grant 7,847,402 - Restaino , et al. December 7, 2	2010-12-07
Structure to improve adhesion between top CVD low-K dielectric and dielectric capping layer Grant 7,820,559 - Clevenger , et al. October 26, 2	2010-10-26
Embedded nano UV blocking and diffusion barrier for improved reliability of copper/ultra low K interlevel dielectric electronic devices Grant 7,749,892 - Bonilla , et al. July 6, 2	2010-07-06
Methods of forming metal interconnect structures on semiconductor substrates using oxygen-removing plasmas and interconnect structures formed thereby Grant 7,737,029 - Kim , et al. June 15, 2	2010-06-15
Void-free damascene copper deposition process and means of monitoring thereof Grant 7,678,258 - Andricacos , et al. March 16, 2	2010-03-16
LOW k DIELECTRIC CVD FILM FORMATION PROCESS WITH IN-SITU IMBEDDED NANOLAYERS TO IMPROVE MECHANICAL PROPERTIES App 20100028695 - Nguyen; Son V. ; et al.	2010-02-04
STRUCTURE AND METHOD FOR SiCOH INTERFACES WITH INCREASED MECHANICAL STRENGTH App 20100009161 - Edelstein; Daniel C. ; et al.	2010-01-14
Structure and method for porous SiCOH dielectric layers and adhesion promoting or etch stop layers having increased interfacial and mechanical strength Grant 7,615,482 - Edelstein , et al. November 10, 2	2009-11-10
Methods of Forming Metal Interconnect Structures on Semiconductor Substrates Using Oxygen-Removing Plasmas and Interconnect Structures Formed Thereby App 20090239374 - Kim; Jae hak ; et al.	2009-09-24
Method For Preventing Backside Defects In Dielectric Layers Formed On Semiconductor Substrates App 20090181544 - Dziobkowski; Chester T. ; et al.	2009-07-16
Advanced low dielectric constant organosilicon plasma chemical vapor deposition films Grant 7,494,938 - Nguyen , et al. February 24, 2	2009-02-24
Methods of forming dual-damascene interconnect structures using adhesion layers having high internal compressive stresses Grant 7,459,388 - Kim , et al. December 2, 2	2008-12-02
Structure To Improve Adhesion Between Top Cvd Low-k Dielectric And Dielectric Capping Layer App 20080254643 - Clevenger; Lawrence A. ; et al.	2008-10-16
STRUCTURE AND METHOD FOR SiCOH INTERFACES WITH INCREASED MECHANICAL STRENGTH App 20080233366 - Edelstein; Daniel C. ; et al.	2008-09-25
Beol Interconnect Structures With Improved Resistance To Stress App 20080197513 - Restaino; Darryl D. ; et al.	2008-08-21
Manufacturable CoWP metal cap process for copper interconnects Grant 7,407,605 - Restaino , et al. August 5, 2	2008-08-05
Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer Grant 7,402,532 - Clevenger , et al. July 22, 2	2008-07-22
Embedded Nano Uv Blocking Barrier For Improved Reliability Of Copper/ultra Low K Interlevel Dielectric Electronic Devices App 20080122103 - Bonilla; Griselda ; et al.	2008-05-29
Methods of Forming Dual-Damascene Interconnect Structures Using Adhesion Layers Having High Internal Compressive Stress and Structures Formed Thereby App 20080057697 - Kim; Jaehak ; et al.	2008-03-06
MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS App 20070215842 - Restaino; Darryl D. ; et al.	2007-09-20
Low k dielectric CVD film formation process with in-situ imbedded nanolayers to improve mechanical properties Grant 7,265,437 - Nguyen , et al. September 4, 2	2007-09-04
Manufacturable CoWP metal cap process for copper interconnects Grant 7,253,106 - Restaino , et al. August 7, 2	2007-08-07
Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer App 20070148958 - Clevenger; Lawrence A. ; et al.	2007-06-28
Advanced Low Dielectric Constant Organosilicon Plasma Chemical Vapor Deposition Films App 20070128882 - Nguyen; Son V. ; et al.	2007-06-07
Advanced low dielectric constant organosilicon plasma chemical vapor deposition films Grant 7,202,564 - Nguyen , et al. April 10, 2	2007-04-10
LOW k DIELECTRIC CVD FILM FORMATION PROCESS WITH IN-SITU IMBEDDED NANOLAYERS TO IMPROVE MECHANICAL PROPERTIES App 20060202311 - Nguyen; Son V. ; et al.	2006-09-14
Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer Grant 7,102,232 - Clevenger , et al. September 5, 2	2006-09-05
Structures with improved interfacial strength of SiCOH dielectrics and method for preparing the same App 20060189153 - Edelstein; Daniel C. ; et al.	2006-08-24
Advanced Low Dielectric Constant Organosilicon Plasma Chemical Vapor Deposition Films App 20060183345 - Nguyen; Son ; et al.	2006-08-17
Structures with improved interfacial strength of SiCOH dielectrics and method for preparing the same Grant 7,067,437 - Edelstein , et al. June 27, 2	2006-06-27
MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS App 20060134911 - Restaino; Darryl D. ; et al.	2006-06-22
Structure to improve adhesion between top CVD low-k dielectiric and dielectric capping layer App 20050230831 - Clevenger, Lawrence A. ; et al.	2005-10-20
Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof Grant 6,939,797 - Barth , et al. September 6, 2	2005-09-06
Process for removing impurities from low dielectric constant films disposed on semiconductor devices App 20050087490 - Chace, Mark S. ; et al.	2005-04-28
Structures with improved interfacial strength of SiCOH dielectrics and method for preparing the same App 20050059258 - Edelstein, Daniel C. ; et al.	2005-03-17
Method for reworking low-k polymers used in semiconductor structures Grant 6,864,180 - Restaino , et al. March 8, 2	2005-03-08
Void-free damascene copper deposition process and means of monitoring thereof App 20050006242 - Andricacos, Panayotis ; et al.	2005-01-13
Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof App 20040173908 - Barth, Edward ; et al.	2004-09-09
Diffusion barrier layer and semiconductor device containing same Grant 6,784,485 - Cohen , et al. August 31, 2	2004-08-31
Method of forming planar Cu interconnects without chemical mechanical polishing App 20040094511 - Seo, Soon-Cheon ; et al.	2004-05-20
Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof Grant 6,737,747 - Barth , et al. May 18, 2	2004-05-18
Laminated diffusion barrier Grant 6,726,996 - Barth , et al. April 27, 2	2004-04-27
Film planarization for low-k polymers used in semiconductor structures Grant 6,638,878 - Restaino , et al. October 28, 2	2003-10-28
Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof App 20030132510 - Barth, Edward ; et al.	2003-07-17
Method for reworking low-K polymers used in semiconductor structures App 20030062336 - Restaino, Darryl D. ; et al.	2003-04-03
Film planarization for low-k polymers used in semiconductor structures App 20030064605 - Restaino, Darryl D. ; et al.	2003-04-03
Laminated diffusion barrier App 20020172811 - Barth, Edward Paul ; et al.	2002-11-21
Metal deposition process for metal lines over topography App 20020017726 - Dave, Parth P. ; et al.	2002-02-14
Radio-frequency coil for use in an ionized physical vapor deposition apparatus Grant 6,238,532 - Rossnagel , et al. May 29, 2	2001-05-29
Wafer clamp ring for use in an ionized physical vapor deposition apparatus Grant 6,176,931 - Restaino , et al. January 23, 2	2001-01-23
Borophosphosilicate glass incorporated with fluorine for low thermal budget gap fill Grant 6,159,870 - Chakravarti , et al. December 12, 2	2000-12-12

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