Rengarajan; Suraj

Patent Applications and Registrations

Patent applications and USPTO patent grants for Rengarajan; Suraj.The latest application filed is for "method and system for visualizing information on gigapixels whole slide image".

Company Profile

0.17.24

Rengarajan; Suraj - Whitefield IN
Rengarajan; Suraj - Bangalore IN
RENGARAJAN; Suraj - San Jose CA
Rengarajan; Suraj - Sunnyvale CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method And System For Visualizing Information On Gigapixels Whole Slide Image App 20220309670 - Jha; Sumit ; et al.	2022-09-29
Deposition Of Silicon-based Dielectric Films App 20220270870 - Bajaj; Geetika ; et al.	2022-08-25
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering App 20180327893 - DING; Peijun ; et al.	2018-11-15
Self-ionized and inductively-coupled plasma for sputtering and resputtering Grant 10,047,430 - Ding , et al. August 14, 2	2018-08-14
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering App 20140305802 - DING; Peijun ; et al.	2014-10-16
Self-ionized and inductively-coupled plasma for sputtering and resputtering Grant 8,696,875 - Ding , et al. April 15, 2	2014-04-15
Self-ionized and inductively-coupled plasma for sputtering and resputtering Grant 8,668,816 - Ding , et al. March 11, 2	2014-03-11
Multi-component doping of copper seed layer Grant 7,749,361 - Chen , et al. July 6, 2	2010-07-06
Metal / metal nitride barrier layer for semiconductor device applications Grant 7,687,909 - Ding , et al. March 30, 2	2010-03-30
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering App 20090233438 - DING; Peijun ; et al.	2009-09-17
Method of depositing a diffusion barrier layer which provides an improved interconnect App 20090053888 - Ding; Peijun ; et al.	2009-02-26
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering App 20080110747 - DING; Peijun ; et al.	2008-05-15
Application of PVD W/WN bilayer barrier to aluminum bondpad in wire bonding App 20080014732 - Li; Yanping ; et al.	2008-01-17
Multi-component doping of copper seed layer App 20070278089 - Chen; Jie ; et al.	2007-12-06
Metal / metal nitride barrier layer for semiconductor device applications App 20070241458 - Ding; Peijun ; et al.	2007-10-18
Method of depositing a tantalum nitride/tantalum diffusion barrier layer system Grant 7,253,109 - Ding , et al. August 7, 2	2007-08-07
Sequential sputter and reactive precleans of vias and contacts Grant 7,014,887 - Cohen , et al. March 21, 2	2006-03-21
Method of depositing low resistivity barrier layers for copper interconnects App 20050272254 - Ding, Peijun ; et al.	2005-12-08
Self-ionized and inductively-coupled plasma for sputtering and resputtering App 20050255691 - Ding, Peijun ; et al.	2005-11-17
Method of depositing a tantalum nitride / tantalum diffusion barrier layer system App 20050208767 - Ding, Peijun ; et al.	2005-09-22
Method and apparatus for process monitoring Grant 6,936,842 - Rengarajan , et al. August 30, 2	2005-08-30
Method of depositing a TaN seed layer Grant 6,911,124 - Tang , et al. June 28, 2	2005-06-28
Compensation of spacing between magnetron and sputter target App 20050133361 - Ding, Peijun ; et al.	2005-06-23
Method and apparatus for cleaning substrates Grant 6,908,865 - Kranz , et al. June 21, 2	2005-06-21
Self-ionized and inductively-coupled plasma for sputtering and resputtering App 20050006222 - Ding, Peijun ; et al.	2005-01-13
Method and apparatus for sputter deposition App 20030216035 - Rengarajan, Suraj ; et al.	2003-11-20
Precleaning process for metal plug that minimizes damage to low-.kappa. dielectric Grant 6,589,890 - Cohen , et al. July 8, 2	2003-07-08
Self-ionized and inductively-coupled plasma for sputtering and resputtering App 20030116427 - Ding, Peijun ; et al.	2003-06-26
Monitoring process for oxide removal Grant 6,579,730 - Li , et al. June 17, 2	2003-06-17
Method of depositing a TaN seed layer App 20030089597 - Tang, Xianmin ; et al.	2003-05-15
Method and apparatus for cleaning substrates App 20030062333 - Kranz, Martin ; et al.	2003-04-03
Method and apparatus for process monitoring App 20030032207 - Rengarajan, Suraj ; et al.	2003-02-13
Monitoring process for oxide removal App 20030017628 - Li, Haojiang ; et al.	2003-01-23
Method of obtaining low temperature alpha-ta thin films using wafer bias App 20020142589 - Sundarrajan, Arvind ; et al.	2002-10-03
Precleaning process for metal plug that minimizes damage to low-kappa dielectric App 20020106908 - Cohen, Barney M. ; et al.	2002-08-08
Precleaning process for metal plug that minimizes damage to low-.kappa. dielectric Grant 6,346,489 - Cohen , et al. February 12, 2	2002-02-12
Ionized metal plasma Ta, TaNx, W, and WNx liners for gate electrode applications Grant 6,313,033 - Chiang , et al. November 6, 2	2001-11-06
Barrier applications for aluminum planarization App 20010005629 - Singhvi, Shri ; et al.	2001-06-28
Barrier applications for aluminum planarization Grant 6,207,558 - Singhvi , et al. March 27, 2	2001-03-27

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