Renfro; Tim
Patent Applications and Registrations
Patent applications and USPTO patent grants for Renfro; Tim.The latest application filed is for "metallic solder thermal interface material layer and application of the same".
- Renfro; Tim - Mesa AZ
| Patent | Date |
|---|---|
| Metallic solder thermal interface material layer and application of the same Grant 7,347,354 - Hurley , et al. March 25, 2 | 2008-03-25 |
| Socket for having the same conductor inserts for signal, power and ground Grant 7,077,661 - Renfro , et al. July 18, 2 | 2006-07-18 |
| Metallic solder thermal interface material layer and application of the same App 20050211752 - Hurley, Edward ; et al. | 2005-09-29 |
| Socket For A Microelectronic Component App 20050181639 - Renfro, Tim ; et al. | 2005-08-18 |
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