RENAVIKAR; Mukul

Patent Applications and Registrations

Patent applications and USPTO patent grants for RENAVIKAR; Mukul.The latest application filed is for "bga stim package architecture for high performance systems".

Company Profile

3.9.9

RENAVIKAR; Mukul - Hillsboro OR US
RENAVIKAR; Mukul - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Bga Stim Package Architecture For High Performance Systems App 20190393121 - SWAMINATHAN; Rajasekaran ; et al.	2019-12-26
Transmissive Composite Film For Application To The Backside Of A Microelectronic Device App 20190057936 - GUPTA; Mohit ; et al.	2019-02-21
Solder deposition and thermal processing of thin-die thermal interface material Grant 8,733,620 - Renavikar , et al. May 27, 2	2014-05-27
Solder joint reliability in microelectronic packaging Grant 8,436,470 - Suh , et al. May 7, 2	2013-05-07
Forming a semiconductor package including a thermal interface material Grant 8,409,929 - Renavikar , et al. April 2, 2	2013-04-02
Forming A Semiconductor Package Including A Thermal Interface Material App 20110312131 - Renavikar; Mukul ; et al.	2011-12-22
Forming a semiconductor package including a thermal interface material Grant 8,030,757 - Renavikar , et al. October 4, 2	2011-10-04
Solder joint reliability in microelectronic packaging Grant 8,018,063 - Suh , et al. September 13, 2	2011-09-13
Solder Joint Reliability In Microelectronic Packaging App 20110051376 - Suh; Daewoong ; et al.	2011-03-03
Solder joint reliability in microelectronic packaging Grant 7,700,476 - Suh , et al. April 20, 2	2010-04-20
Solder Joint Reliability In Microelectronic Packaging App 20100044848 - Suh; Daewoong ; et al.	2010-02-25
Forming a semiconductor package including a thermal interface material App 20090001557 - Renavikar; Mukul ; et al.	2009-01-01
Solder joint reliability in microelectronic packaging App 20080115968 - Suh; Daewoong ; et al.	2008-05-22
Solder deposition and thermal processing of thin-die thermal interface material App 20070131737 - Renavikar; Mukul ; et al.	2007-06-14

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