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name:-0.0099902153015137
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Ren; Huilin Patent Filings

Ren; Huilin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ren; Huilin.The latest application filed is for "high speed, high density electrical connector".

Company Profile
2.12.11
  • Ren; Huilin - Amherst NH
  • Ren; Huilin - US
  • Ren; Huilin - Nashua NH
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
High Speed, High Density Electrical Connector
App 20210336363 - Cohen; Thomas S. ;   et al.
2021-10-28
Backplane Footprint For High Speed, High Density Electrical Connectors
App 20210315102 - Cartier, JR.; Marc B. ;   et al.
2021-10-07
Backplane footprint for high speed, high density electrical connectors
Grant 11,057,995 - Cartier, Jr. , et al. July 6, 2
2021-07-06
High speed, high density electrical connector
Grant 10,958,007 - Cohen , et al. March 23, 2
2021-03-23
Backplane Footprint For High Speed, High Density Electrical Connectors
App 20190380204 - Cartier, JR.; Marc B. ;   et al.
2019-12-12
High Speed, High Density Electrical Connector
App 20190181576 - Cohen; Thomas S. ;   et al.
2019-06-13
High Speed, High Density Electrical Connector
App 20180248289 - Cohen; Thomas S. ;   et al.
2018-08-30
Method of forming an electrical connector
Grant 9,825,391 - Cohen , et al. November 21, 2
2017-11-21
High Speed, High Density Electrical Connector
App 20140335735 - Cohen; Thomas S. ;   et al.
2014-11-13
High speed, high density electrical connector
Grant 8,814,595 - Cohen , et al. August 26, 2
2014-08-26
High density electrical connector and PCB footprint
Grant 8,272,877 - Stokoe , et al. September 25, 2
2012-09-25
High Speed, High Density Electrical Connector
App 20120214344 - Cohen; Thomas S. ;   et al.
2012-08-23
High density electrical connector with variable insertion and retention force
Grant 8,182,289 - Stokoe , et al. May 22, 2
2012-05-22
High Density Electrical Connector With Variable Insertion And Retention Force
App 20110212649 - Stokoe; Philip T. ;   et al.
2011-09-01
High Density Electrical Connector And Pcb Footprint
App 20110212632 - Stokoe; Philip T. ;   et al.
2011-09-01
Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization attenuation and impedance mismatch characteristics
Grant 7,508,681 - Payne , et al. March 24, 2
2009-03-24
Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization, attenuation and impedance mismatch characteristics
App 20080030970 - Payne; Jason J. ;   et al.
2008-02-07
Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization, attenuation and impedance mismatch characteristics
Grant 7,242,592 - Payne , et al. July 10, 2
2007-07-10
Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization, attenuation and impedance mismatch characteristics
App 20040264153 - Payne, Jason J. ;   et al.
2004-12-30
High speed, high density electrical connector and connector assembly
Grant 6,814,619 - Stokoe , et al. November 9, 2
2004-11-09
High speed, high density electrical connector
Grant 6,780,059 - Payne , et al. August 24, 2
2004-08-24
High speed, high density electrical connector
Grant 6,776,659 - Stokoe , et al. August 17, 2
2004-08-17

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