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Patent applications and USPTO patent grants for Relis; Joseph.The latest application filed is for "use of immersion tin and tin alloys as a bonding medium for multilayer circuits".
Patent | Date |
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Use of immersion tin and tin alloys as a bonding medium for multilayer circuits Grant 4,882,202 - Holtzman , et al. November 21, 1 | 1989-11-21 |
Use of immersion tin and alloys as a bonding medium for multilayer circuits Grant 4,816,070 - Holtzman , et al. March 28, 1 | 1989-03-28 |
Selective plating process for the electrolytic coating of circuit boards without an electroless metal coating Grant 4,790,912 - Holtzman , et al. December 13, 1 | 1988-12-13 |
Use of immersion tin and tin alloys as a bonding medium for multilayer circuits Grant 4,715,894 - Holtzman , et al. December 29, 1 | 1987-12-29 |
Use of immersion tin coating as etch resist Grant 4,657,632 - Holtzman , et al. April 14, 1 | 1987-04-14 |
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