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Patent applications and USPTO patent grants for Religieux; Laurianne.The latest application filed is for "copper electrodeposition solution and process for high aspect ratio patterns".
Patent | Date |
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Copper electrodeposition solution and process for high aspect ratio patterns Grant 10,883,185 - Religieux , et al. January 5, 2 | 2021-01-05 |
Electrolyte and process for electroplating copper onto a barrier layer Grant 10,472,726 - Mevellec , et al. Nov | 2019-11-12 |
Copper Electrodeposition Solution And Process For High Aspect Ratio Patterns App 20180363158 - RELIGIEUX; Laurianne ;   et al. | 2018-12-20 |
Copper electrodeposition bath containing an electrochemically inert cation Grant 10,011,914 - Religieux , et al. July 3, 2 | 2018-07-03 |
Electrolyte And Process For Electroplating Copper Onto A Barrier Layer App 20150218724 - Mevellec; Vincent ;   et al. | 2015-08-06 |
Copper Electrodeposition Bath Containing An Electrochemically Inert Cation App 20150159291 - RELIGIEUX; Laurianne ;   et al. | 2015-06-11 |
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