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Religieux; Laurianne Patent Filings

Religieux; Laurianne

Patent Applications and Registrations

Patent applications and USPTO patent grants for Religieux; Laurianne.The latest application filed is for "copper electrodeposition solution and process for high aspect ratio patterns".

Company Profile
1.3.3
  • Religieux; Laurianne - Paris FR
  • Religieux; Laurianne - Chatenay Malabry FR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Copper electrodeposition solution and process for high aspect ratio patterns
Grant 10,883,185 - Religieux , et al. January 5, 2
2021-01-05
Electrolyte and process for electroplating copper onto a barrier layer
Grant 10,472,726 - Mevellec , et al. Nov
2019-11-12
Copper Electrodeposition Solution And Process For High Aspect Ratio Patterns
App 20180363158 - RELIGIEUX; Laurianne ;   et al.
2018-12-20
Copper electrodeposition bath containing an electrochemically inert cation
Grant 10,011,914 - Religieux , et al. July 3, 2
2018-07-03
Electrolyte And Process For Electroplating Copper Onto A Barrier Layer
App 20150218724 - Mevellec; Vincent ;   et al.
2015-08-06
Copper Electrodeposition Bath Containing An Electrochemically Inert Cation
App 20150159291 - RELIGIEUX; Laurianne ;   et al.
2015-06-11

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