Reitlinger; Claus

Patent Applications and Registrations

Patent applications and USPTO patent grants for Reitlinger; Claus.The latest application filed is for "package comprising a substrate, an integrated device, and an encapsulation layer with undercut".

Company Profile

1.6.8

Reitlinger; Claus - Wolnzach DE
Reitlinger; Claus - Munich DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Stacked modules Grant 11,239,170 - Franz , et al. February 1, 2	2022-02-01
Package Comprising A Substrate, An Integrated Device, And An Encapsulation Layer With Undercut App 20210375707 - TEIXEIRA DE QUEIROS; Alberto Jose ; et al.	2021-12-02
Integrated circuit package comprising an enhanced electromagnetic shield Grant 10,438,901 - Krefft , et al. O	2019-10-08
Module And Method For Producing A Plurality Of Modules App 20190164892 - FRANZ; Andreas ; et al.	2019-05-30
Module package and production method Grant 9,576,870 - Reitlinger , et al. February 21, 2	2017-02-21
Method for producing a plurality of electronic devices Grant 9,386,734 - Reitlinger , et al. July 5, 2	2016-07-05
Electrical Module For Being Received By Automatic Placement Machines By Means Of Generating A Vacuum App 20130343006 - Reitlinger; Claus ; et al.	2013-12-26
Module Package And Production Method App 20130168876 - Reitlinger; Claus ; et al.	2013-07-04
Method For Producing A Plurality Of Electronic Devices Having Electromagnetic Shielding And In Particular Having Heat Dissipation And Electronic Device Having Electromagnetic Shielding And In Particular Having Heat Dissipation App 20130170172 - Reitlinger; Claus ; et al.	2013-07-04

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