Reiss; Werner
Patent Applications and Registrations
Patent applications and USPTO patent grants for Reiss; Werner.The latest application filed is for "soldering a conductor to an aluminum metallization".
- Reiss; Werner - Raubling DE
- Reiss; Werner - Bad Feilnbach DE
| Patent | Date |
|---|---|
| Soldering a conductor to an aluminum metallization Grant 11,450,642 - Riedl , et al. September 20, 2 | 2022-09-20 |
| Soldering A Conductor To An Aluminum Metallization App 20210118843 - Riedl; Edmund ; et al. | 2021-04-22 |
| Soldering a conductor to an aluminum metallization Grant 10,896,893 - Riedl , et al. January 19, 2 | 2021-01-19 |
| Soldering a conductor to an aluminum metallization Grant 10,892,247 - Riedl , et al. January 12, 2 | 2021-01-12 |
| Semiconductor package with air cavity Grant 10,777,536 - Chiang , et al. Sept | 2020-09-15 |
| Soldering A Conductor To An Aluminum Metallization App 20200243480 - Riedl; Edmund ; et al. | 2020-07-30 |
| Soldering A Conductor To An Aluminum Metallization App 20200219841 - Riedl; Edmund ; et al. | 2020-07-09 |
| Semiconductor Package Having a Laser-Activatable Mold Compound App 20200185293 - Schmalzl; Stefan ; et al. | 2020-06-11 |
| Soldering a conductor to an aluminum metallization Grant 10,615,145 - Riedl , et al. | 2020-04-07 |
| Radio frequency device packages and methods of formation thereof Grant 10,505,255 - Baheti , et al. Dec | 2019-12-10 |
| Semiconductor Package with Air Cavity App 20190181120 - Chiang; Chau Fatt ; et al. | 2019-06-13 |
| Soldering A Conductor To An Aluminum Metallization App 20190035764 - Riedl; Edmund ; et al. | 2019-01-31 |
| Radio Frequency Device Packages and Methods of Formation Thereof App 20180219272 - Baheti; Ashutosh ; et al. | 2018-08-02 |
| Radio frequency device packages and methods of formation thereof Grant 9,935,065 - Baheti , et al. April 3, 2 | 2018-04-03 |
| Integrated Device App 20110162204 - Reiss; Werner ; et al. | 2011-07-07 |
| Plasma Cleaning Of Wire Strands App 20110079242 - REISS; Werner | 2011-04-07 |
| Integrated Device App 20080064232 - Reiss; Werner ; et al. | 2008-03-13 |
| Stackable single package and stacked multi-chip assembly Grant 7,265,441 - Reiss , et al. September 4, 2 | 2007-09-04 |
| Integrated chip device in a package App 20070090527 - Thomas; Jochen ; et al. | 2007-04-26 |
| Stackable single package and stacked multi-chip assembly App 20070035006 - Reiss; Werner ; et al. | 2007-02-15 |
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