| Patent | Date |
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Wafer level package structure with internal conductive layer
Grant 11,424,209 - Albers , et al. August 23, 2 | 2022-08-23 |
Package Stacking Using Chip To Wafer Bonding
App 20220108976 - SEIDEMANN; Georg ; et al. | 2022-04-07 |
Package stacking using chip to wafer bonding
Grant 11,239,199 - Seidemann , et al. February 1, 2 | 2022-02-01 |
Optoelectronic component and method of producing an optoelectronic component
Grant 10,937,932 - Nagel , et al. March 2, 2 | 2021-03-02 |
Semiconductor die package with more than one hanging die
Grant 10,854,590 - Albers , et al. December 1, 2 | 2020-12-01 |
Optoelectronic Component And Method For Producing An Optoelectronic Component
App 20200373470 - REINGRUBER; Klaus ; et al. | 2020-11-26 |
Integrated circuit packages including an optical redistribution layer
Grant 10,816,742 - Seidemann , et al. October 27, 2 | 2020-10-27 |
Wafer Level Package Structure With Internal Conductive Layer
App 20200273832 - ALBERS; Sven ; et al. | 2020-08-27 |
Electronic components having three-dimensional capacitors in a metallization stack
Grant 10,741,486 - Reingruber , et al. A | 2020-08-11 |
Integrated circuit package assemblies including a chip recess
Grant 10,714,455 - Seidemann , et al. | 2020-07-14 |
Method For Producing Optoelectronic Semiconductor Components, And Optoelectronic Semiconductor Component
App 20200212271 - Reingruber; Klaus ; et al. | 2020-07-02 |
Method of producing a lighting device
Grant 10,680,147 - Nagel , et al. | 2020-06-09 |
Semiconductor Die Package With More Than One Hanging Die
App 20200176436 - ALBERS; Sven ; et al. | 2020-06-04 |
Wafer level package structure with internal conductive layer
Grant 10,672,731 - Albers , et al. | 2020-06-02 |
Interposer with conductive routing exposed on sidewalls
Grant 10,651,102 - Reingruber , et al. | 2020-05-12 |
Package Devices Having A Ball Grid Array With Side Wall Contact Pads
App 20200066692 - WOLTER; Andreas ; et al. | 2020-02-27 |
Component Terminations For Semiconductor Packages
App 20200068711 - Wolter; Andreas ; et al. | 2020-02-27 |
Electrical device and a method for forming an electrical device
Grant 10,522,485 - Geissler , et al. Dec | 2019-12-31 |
Packages Of Stacking Integrated Circuits
App 20190393191 - REINGRUBER; Klaus ; et al. | 2019-12-26 |
Vertical wire connections for integrated circuit package
Grant 10,490,527 - Geissler , et al. Nov | 2019-11-26 |
Interconnect Structure For A Microelectronic Device
App 20190333886 - Reingruber; Klaus ; et al. | 2019-10-31 |
Advanced node cost reduction by ESD interposer
Grant 10,446,541 - Seidemann , et al. Oc | 2019-10-15 |
Microelectronic package with illuminated backside exterior
Grant 10,411,000 - Dittes , et al. Sept | 2019-09-10 |
System-in-package devices and methods for forming system-in-package devices
Grant 10,403,609 - Geissler , et al. Sep | 2019-09-03 |
Optoelectronic Component And Method Of Producing An Optoelectronic Component
App 20190267519 - Nagel; Peter ; et al. | 2019-08-29 |
Interconnect structure for a microelectronic device
Grant 10,366,968 - Reingruber , et al. July 30, 2 | 2019-07-30 |
Systems, Methods, And Apparatuses For Implementing Reduced Height Semiconductor Packages For Mobile Electronics
App 20190214369 - SEIDEMANN; Georg ; et al. | 2019-07-11 |
Eplb/ewlb Based Pop For Hbm Or Customized Package Stack
App 20190206833 - MEYER; Thorsten ; et al. | 2019-07-04 |
Method Of Producing A Lighting Device
App 20190189871 - Nagel; Peter ; et al. | 2019-06-20 |
Optical Fiber Connection On Package Edge
App 20190121041 - Albers; Sven ; et al. | 2019-04-25 |
Integrated Circuit Package Assemblies Including A Chip Recess
App 20190109120 - Seidemann; Georg ; et al. | 2019-04-11 |
Flexible band wearable electronic device
Grant 10,228,725 - Albers , et al. | 2019-03-12 |
Integrated Circuit Packages Including An Optical Redistribution Layer
App 20190072732 - Seidemann; Georg ; et al. | 2019-03-07 |
Integrated circuit packages including an optical redistribution layer
Grant 10,209,466 - Seidemann , et al. Feb | 2019-02-19 |
Integrated circuit package assemblies including a chip recess
Grant 10,186,499 - Seidemann , et al. Ja | 2019-01-22 |
Package on package architecture and method for making
Grant 10,170,409 - Ganesan , et al. J | 2019-01-01 |
Vertical Wire Connections For Integrated Circuit Package
App 20180374819 - Geissler; Christian ; et al. | 2018-12-27 |
Wafer Level Package Structure With Internal Conductive Layer
App 20180358317 - ALBERS; Sven ; et al. | 2018-12-13 |
Interposer With Conductive Routing Exposed On Sidewalls
App 20180342431 - Reingruber; Klaus ; et al. | 2018-11-29 |
Electrical device and a method for forming an electrical device
App 20180331053 - GEISSLER; Christian ; et al. | 2018-11-15 |
Package Stacking Using Chip To Wafer Bonding
App 20180331070 - SEIDEMANN; Georg ; et al. | 2018-11-15 |
System-in-Package Devices and Methods for Forming System-in-Package Devices
App 20180331080 - Geissler; Christian ; et al. | 2018-11-15 |
Cooler for semiconductor devices
Grant 10,121,726 - Albers , et al. November 6, 2 | 2018-11-06 |
Electronic Package With Coil Formed On Core
App 20180226185 - Albers; Sven ; et al. | 2018-08-09 |
Advanced Node Cost Reduction By Esd Interposer
App 20180204831 - SEIDEMANN; Georg ; et al. | 2018-07-19 |
Wearable Computing Device
App 20180150156 - Albers; Sven ; et al. | 2018-05-31 |
Interconnect Structure For A Microelectronic Device
App 20180096970 - Reingruber; Klaus ; et al. | 2018-04-05 |
Flexible Band Wearable Electronic Device
App 20180095426 - Albers; Sven ; et al. | 2018-04-05 |
Flexible Band Wearable Electronic Device
App 20180092443 - Albers; Sven ; et al. | 2018-04-05 |
Wearable computing device
Grant 9,921,694 - Albers , et al. March 20, 2 | 2018-03-20 |
Redistribution Layer Lines
App 20180068939 - Reingruber; Klaus ; et al. | 2018-03-08 |
Electronic package with coil formed on core
Grant 9,865,387 - Albers , et al. January 9, 2 | 2018-01-09 |
Integrated Circuit Package Assemblies Including A Chip Recess
App 20180005991 - Seidemann; Georg ; et al. | 2018-01-04 |
Microelectronic Package with Illuminated Backside Exterior
App 20170284636 - Dittes; Marc Stephan ; et al. | 2017-10-05 |
Integrated Circuit Packages Including An Optical Redistribution Layer
App 20170285280 - Seidemann; Georg ; et al. | 2017-10-05 |
Microelectronic Interconnect Adaptor
App 20170278778 - Geissler; Christian ; et al. | 2017-09-28 |
Electronic Components Having Three-dimensional Capacitors In A Metallization Stack
App 20170256480 - Reingruber; Klaus ; et al. | 2017-09-07 |
Redistribution Layer Lines
App 20170243815 - Reingruber; Klaus ; et al. | 2017-08-24 |
Redistribution layer lines
Grant 9,741,651 - Reingruber , et al. August 22, 2 | 2017-08-22 |
Three dimensional structures within mold compound
Grant 9,711,492 - Albers , et al. July 18, 2 | 2017-07-18 |
Electronic Package With Coil Formed On Core
App 20170162314 - Albers; Sven ; et al. | 2017-06-08 |
Method of manufacturing a semiconductor device including removing a relief layer from back surface of semiconductor chip
Grant 9,646,856 - Meyer , et al. May 9, 2 | 2017-05-09 |
Cooler For Semiconductor Devices
App 20170062306 - Albers; Sven ; et al. | 2017-03-02 |
Three Dimensional Structures Within Mold Compound
App 20160358897 - ALBERS; Sven ; et al. | 2016-12-08 |
Stacked Semiconductor Device Package With Improved Interconnect Bandwidth
App 20160329272 - GEISSLER; Christian ; et al. | 2016-11-10 |
Package On Package Architecture And Method For Making
App 20160284642 - GANESAN; Sanka ; et al. | 2016-09-29 |
Microelectronic Interconnect Adaptor
App 20160240435 - Geissler; Christian ; et al. | 2016-08-18 |
Wearable Computing Device
App 20160224148 - ALBERS; Sven ; et al. | 2016-08-04 |
Semiconductor Device And Method Of Manufacturing A Semiconductor Device Including Grinding Sets
App 20150262844 - Meyer; Thorsten ; et al. | 2015-09-17 |
Chip with encapsulated sides and exposed surface
Grant 9,064,883 - Meyer , et al. June 23, 2 | 2015-06-23 |
Semiconductor Device and Method of Manufacturing a Semiconductor Device Including Grinding Steps
App 20130049205 - Meyer; Thorsten ; et al. | 2013-02-28 |
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