Reid; Jon
Patent Applications and Registrations
Patent applications and USPTO patent grants for Reid; Jon.The latest application filed is for "current ramping and current pulsing entry of substrates for electroplating".
- Reid; Jon - Sherwood OR
- Reid; Jon - New South Wales AU
Trademarks
| Patent | Date |
|---|---|
| Low copper electroplating solutions for fill and defect control Grant 10,214,826 - Zhou , et al. Feb | 2019-02-26 |
| Current Ramping And Current Pulsing Entry Of Substrates For Electroplating App 20140224661 - Spurlin; Tighe A. ; et al. | 2014-08-14 |
| Low Copper Electroplating Solutions For Fill And Defect Control App 20140209476 - Zhou; Jian ; et al. | 2014-07-31 |
| Deposit morphology of electroplated copper Grant 7,879,218 - Webb , et al. February 1, 2 | 2011-02-01 |
| Weatherproofed Assembly For Housing Electronic Hardware App 20080192413 - Reid; Jon ; et al. | 2008-08-14 |
| Methods for the electrochemical deposition of copper onto a barrier layer of a work piece Grant 7,405,157 - Reid , et al. July 29, 2 | 2008-07-29 |
| Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element Grant 6,402,923 - Mayer , et al. June 11, 2 | 2002-06-11 |
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