loadpatents
name:-0.42098093032837
name:-0.021666049957275
name:-0.00053000450134277
Reid; Jason S. Patent Filings

Reid; Jason S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Reid; Jason S..The latest application filed is for "integrated circuits having organic-inorganic dielectric materials and methods for forming such integrated circuits".

Company Profile
0.13.18
  • Reid; Jason S. - San Jose CA
  • Reid; Jason S. - Los Gatos CA
  • Reid, Jason S. - LosGatos CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Ovonic threshold switch film composition for TSLAGS material
Grant 8,148,707 - Ovshinsky , et al. April 3, 2
2012-04-03
Forming a carbon passivated ovonic threshold switch
Grant 7,939,815 - Lee , et al. May 10, 2
2011-05-10
Integrated circuits having organic-inorganic dielectric materials and methods for forming such integrated circuits
App 20100215839 - Rantala; Juha T. ;   et al.
2010-08-26
Forming A Carbon Passivated Ovonic Threshold Switch
App 20100163818 - Lee; Jinwook ;   et al.
2010-07-01
Thin films and methods for the preparation thereof
Grant 7,479,462 - Rantala , et al. January 20, 2
2009-01-20
Poly(organosiloxane) materials and methods for hybrid organic-inorganic dielectrics for integrated circuit applications
Grant 7,473,650 - Rantala , et al. January 6, 2
2009-01-06
Forming ovonic threshold switches with reduced deposition chamber gas pressure
App 20070227878 - Hamamjy; Roger ;   et al.
2007-10-04
Materials and methods for forming hybrid organic-inorganic anti-stiction materials for micro-electromechanical systems
Grant 7,256,467 - Reid , et al. August 14, 2
2007-08-14
Poly(organosiloxane) materials and methods for hybrid organic-inorganic dielectrics for integrated circuit applications
App 20070077779 - Rantala; Juha T. ;   et al.
2007-04-05
Poly(organosiloxane) materials and methods for hybrid organic-inorganic dielectrics for integrated circuit applications
Grant 7,144,827 - Rantala , et al. December 5, 2
2006-12-05
Integrated circuits having organic-inorganic dielectric materials and methods for forming such integrated circuits
App 20060258146 - Rantala; Juha T. ;   et al.
2006-11-16
MEMS with flexible portions made of novel materials
Grant 7,071,520 - Reid July 4, 2
2006-07-04
Materials and methods for forming hybrid organic-inorganic dielectric materials for integrated circuit applications
App 20060131753 - Rantala; Juha T. ;   et al.
2006-06-22
Materials and methods for forming hybrid organic-inorganic dielectric materials for integrated circuit applications
Grant 7,060,634 - Rantala , et al. June 13, 2
2006-06-13
Transition metal dielectric alloy materials for MEMS
Grant 7,057,246 - Reid June 6, 2
2006-06-06
MEMS device made of transition metal-dielectric oxide materials
Grant 7,057,251 - Reid June 6, 2
2006-06-06
Thin films and methods for the preparation thereof
App 20060057801 - Rantala; Juha T. ;   et al.
2006-03-16
Semiconductor device
Grant 6,974,970 - Rantala , et al. December 13, 2
2005-12-13
Methods for forming and releasing microelectromechanical structures
Grant 6,960,305 - Doan , et al. November 1, 2
2005-11-01
Method for removing a sacrificial material with a compressed fluid
Grant 6,958,123 - Reid , et al. October 25, 2
2005-10-25
Method for removing a sacrificial material with a compressed fluid
App 20050164127 - Reid, Jason S. ;   et al.
2005-07-28
Poly(organosiloxane) materials and methods for hybrid organic-inorganic dielectrics for integrated circuit applications
App 20040188713 - Rantala, Juha T. ;   et al.
2004-09-30
Methods for forming and releasing microelectromechanical structures
App 20040035821 - Doan, Jonathan C. ;   et al.
2004-02-26
Materials and methods for forming hybrid organic-inorganic anti-stiction materials for micro-electromechanical systems
App 20040012061 - Reid, Jason S. ;   et al.
2004-01-22
Materials and methods for forming hybrid organic-inorganic dielectric materials for integrated circuit applications
App 20040012089 - Rantala, Juha T. ;   et al.
2004-01-22
Integrated circuits having organic-inorganic dielectric materials and methods for forming such integrated circuits
App 20040002617 - Rantala, Juha T. ;   et al.
2004-01-01
Thin films and methods for the preparation thereof
App 20030186494 - Rantala, Juha T. ;   et al.
2003-10-02
Method for removing a sacrificial material with a compressed fluid
App 20030047533 - Reid, Jason S. ;   et al.
2003-03-13
MEMS device made of transition metal-dielectric oxide materials
App 20030036215 - Reid, Jason S.
2003-02-20
MEMS with flexible portions made of novel materials
App 20020185699 - Reid, Jason S.
2002-12-12
Transition metal dielectric alloy materials for MEMS
App 20020047172 - Reid, Jason S.
2002-04-25

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