| Patent | Date |
|---|
Fault monitoring for a complex computing unit
Grant 10,963,357 - Reichenbach March 30, 2 | 2021-03-30 |
Laser resealing with stress-reducing prestructuring
Grant 10,556,789 - Reichenbach , et al. Feb | 2020-02-11 |
Fault Monitoring for a Complex Computing Unit
App 20190243738 - Reichenbach; Frank | 2019-08-08 |
Laser reseal including a protective structure
Grant 10,183,861 - Breitling , et al. Ja | 2019-01-22 |
Micromechanical component including a diffusion stop channel
Grant 10,029,911 - Breitling , et al. July 24, 2 | 2018-07-24 |
Structures for reducing and avoiding stresses on the seal bottom side during laser reseal
Grant 10,023,460 - Breitling , et al. July 17, 2 | 2018-07-17 |
Structures for reducing and preventing stress and tensions during processing of silicon with the aid of melting by a laser
Grant 10,017,375 - Reichenbach , et al. July 10, 2 | 2018-07-10 |
Structures and process for preventing a projection of the laser resealing structure beyond the wafer surface
Grant 10,000,375 - Reichenbach , et al. June 19, 2 | 2018-06-19 |
Sensor apparatus, production method for a sensor apparatus having at least one magnetic core and method for determining a field strength of a magnetic field in at least one spatial direction
Grant 9,927,497 - Reichenbach , et al. March 27, 2 | 2018-03-27 |
Method for manufacturing a micromechanical component
Grant 9,890,035 - Breitling , et al. February 13, 2 | 2018-02-13 |
Method For Manufacturing A Micromechanical Component
App 20170203956 - Breitling; Achim ; et al. | 2017-07-20 |
Micromechanical Component Including A Diffusion Stop Channel
App 20170203957 - Breitling; Achim ; et al. | 2017-07-20 |
Laser Reseal Including A Protective Structure
App 20170158497 - Breitling; Achim ; et al. | 2017-06-08 |
Additional Surface For Stabilizing The Internal Cavity Pressure Over The Lifetime
App 20170158489 - Breitling; Achim ; et al. | 2017-06-08 |
Laser Reseal Including Different Cap Materials
App 20170158495 - Breitling; Achim ; et al. | 2017-06-08 |
Laser Reseal Including Stress Compensation Layer
App 20170158492 - Breitling; Achim ; et al. | 2017-06-08 |
Laser Resealing With Stress-reducing Prestructuring
App 20170113923 - Reichenbach; Frank ; et al. | 2017-04-27 |
Structures For Reducing And Preventing Stress And Tensions During Processing Of Silicon With The Aid Of Melting By A Laser
App 20170113919 - Reichenbach; Frank ; et al. | 2017-04-27 |
Structures For Reducing And Avoiding Stresses On The Seal Bottom Side During Laser Reseal
App 20170113921 - Breitling; Achim ; et al. | 2017-04-27 |
Structures And Process For Preventing A Projection Of The Laser Resealing Structure Beyond The Wafer Surface
App 20170113920 - Reichenbach; Frank ; et al. | 2017-04-27 |
Multicore processor fault detection for safety critical software applications
Grant 9,632,860 - Reichenbach , et al. April 25, 2 | 2017-04-25 |
Sensor Apparatus, Production Method For A Sensor Apparatus Having At Least One Magnetic Core And Method For Determining A Field Strength Of A Magnetic Field In At Least One Spatial Direction
App 20160363636 - REICHENBACH; Frank ; et al. | 2016-12-15 |
Multicore Processor Fault Detection For Safety Critical Software Applications
App 20160117210 - Reichenbach; Frank ; et al. | 2016-04-28 |
Method for reassigning the role of a wireless node in a wireless network
Grant 9,277,586 - Orten , et al. March 1, 2 | 2016-03-01 |
Symmetric Multi-Processor Arrangement, Safety Critical System, And Method Therefor
App 20150254123 - Loekstad; Trond ; et al. | 2015-09-10 |
Method and node for localizing a node in a wireless network
Grant 8,963,777 - Reichenbach , et al. February 24, 2 | 2015-02-24 |
Method And Node For Localizing A Node In A Wireless Network
App 20140118193 - Reichenbach; Frank ; et al. | 2014-05-01 |
Semiconductor component having a micromechanical microphone structure
Grant 8,698,255 - Reichenbach , et al. April 15, 2 | 2014-04-15 |
Component having a micromechanical microphone structure, and method for its production
Grant 8,637,945 - Reichenbach , et al. January 28, 2 | 2014-01-28 |
Magnetic Field Sensor
App 20130320969 - REICHENBACH; Frank ; et al. | 2013-12-05 |
Method For Reassigning The Role Of A Wireless Node In A Wireless Network
App 20130182558 - Orten; Pal ; et al. | 2013-07-18 |
Method For Producing A Capping Wafer For A Sensor
App 20130061674 - REICHENBACH; Frank ; et al. | 2013-03-14 |
Method for producing a capping wafer for a sensor
Grant 8,329,555 - Reichenbach , et al. December 11, 2 | 2012-12-11 |
Component Having A Micromechanical Microphone Structure, And Method For Its Production
App 20120091544 - Reichenbach; Frank ; et al. | 2012-04-19 |
Semiconductor Component Having A Micromechanical Microphone Structure
App 20120091545 - Reichenbach; Frank ; et al. | 2012-04-19 |
Method for producing a capping wafer for a sensor
App 20110012248 - Reichenbach; Frank ; et al. | 2011-01-20 |
Micromechanical component and corresponding method for its manufacture
Grant 7,834,409 - Reichenbach , et al. November 16, 2 | 2010-11-16 |
Microstructured sensor
Grant 7,564,033 - Reichenbach , et al. July 21, 2 | 2009-07-21 |
Micromechanical component
Grant 7,495,328 - Reichenbach , et al. February 24, 2 | 2009-02-24 |
Micromechanical component and corresponding method for its manufacture
App 20090026561 - Reichenbach; Frank ; et al. | 2009-01-29 |
Micromechanical component having a monolithically integrated circuit and method for manufacturing a component
App 20080093690 - Reichenbach; Frank ; et al. | 2008-04-24 |
Microstructured Infrared Sensor
App 20080061237 - Franz; Jochen ; et al. | 2008-03-13 |
Microstructured Sensor
App 20080053254 - Reichenbach; Frank ; et al. | 2008-03-06 |
Sensor with at least one micromechanical structure, and method for producing it
Grant 7,273,764 - Reichenbach , et al. September 25, 2 | 2007-09-25 |
Micromechanical component
App 20070040230 - Reichenbach; Frank ; et al. | 2007-02-22 |
Sensor with at least one micromechanical structure, and method for producing it
App 20050230708 - Reichenbach, Frank ; et al. | 2005-10-20 |
Method for joining a silicon plate to a second plate
Grant 6,955,975 - Reichenbach , et al. October 18, 2 | 2005-10-18 |
Sensor with at least one micromechanical structure and method for production thereof
Grant 6,936,902 - Reichenbach , et al. August 30, 2 | 2005-08-30 |
Method for joining a silicon plate to a second plate
App 20040082145 - Reichenbach, Frank ; et al. | 2004-04-29 |
Sensor with at least one micromechanical structure and method for production thereof
App 20040065932 - Reichenbach, Frank ; et al. | 2004-04-08 |
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