loadpatents
name:-0.0084271430969238
name:-0.0036180019378662
name:-0.0048890113830566
REDLER; Guy Patent Filings

REDLER; Guy

Patent Applications and Registrations

Patent applications and USPTO patent grants for REDLER; Guy.The latest application filed is for "on-die thermal sensing network for integrated circuits".

Company Profile
5.3.8
  • REDLER; Guy - Haifa IL
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
On-die Thermal Sensing Network For Integrated Circuits
App 20220268644 - FAYNEH; Eyal ;   et al.
2022-08-25
Integrated Circuit Degradation Estimation And Time-of-failure Prediction Using Workload And Margin Sensing
App 20220260630 - FAYNEH; Eyal ;   et al.
2022-08-18
Die-to-die Connectivity Monitoring
App 20220229107 - FAYNEH; Eyal ;   et al.
2022-07-21
Integrated Circuit I/o Integrity And Degradation Monitoring
App 20220156206 - FAYNEH; Eyal ;   et al.
2022-05-19
Die-to-die connectivity monitoring
Grant 11,293,977 - Fayneh , et al. April 5, 2
2022-04-05
Integrated circuit I/O integrity and degradation monitoring
Grant 11,275,700 - Fayneh , et al. March 15, 2
2022-03-15
Die-to-die Connectivity Monitoring
App 20210325455 - FAYNEH; Eyal ;   et al.
2021-10-21
Integrated Circuit I/o Integrity And Degradation Monitoring
App 20200371972 - FAYNEH; Eyal ;   et al.
2020-11-26
Integrated Circuit Workload, Temperature And/or Subthreshold Leakage Sensor
App 20200333393 - FAYNEH; Eyal ;   et al.
2020-10-22
Integrated circuit I/O integrity and degradation monitoring
Grant 10,740,262 - Fayneh , et al. A
2020-08-11
Integrated circuit I/O integrity and degradation monitoring
App 20200210354 - FAYNEH; Eyal ;   et al.
2020-07-02

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