| Patent | Date |
|---|
Verifying structural integrity of materials
Grant 11,371,952 - Yungers , et al. June 28, 2 | 2022-06-28 |
Data Communication Apparatus, System, And Method
App 20220141554 - Rodriguez, JR.; Ernesto M. ; et al. | 2022-05-05 |
Verifying structural integrity of materials
Grant 11,255,807 - Chinnock , et al. February 22, 2 | 2022-02-22 |
Temperature-independent verifying of structural integrity of materials using electrical properties
Grant 11,181,498 - Redinger , et al. November 23, 2 | 2021-11-23 |
Verifying structural integrity of materials using electrical properties
Grant 11,150,209 - Yungers , et al. October 19, 2 | 2021-10-19 |
Suppressing Thermally Induced Voltages For Verifying Structural Integrity Of Materials
App 20210293736 - Redinger; David H. ; et al. | 2021-09-23 |
Verifying structural integrity of materials
Grant 11,112,374 - Yungers , et al. September 7, 2 | 2021-09-07 |
Verifying structural integrity of materials using reference impedance
Grant 11,105,762 - Yungers , et al. August 31, 2 | 2021-08-31 |
Temperature-corrected Control Data For Verifying Of Structural Integrity Of Materials
App 20210239640 - Redinger; David H. | 2021-08-05 |
Suppressing thermally induced voltages for verifying structural integrity of materials
Grant 11,060,993 - Redinger , et al. July 13, 2 | 2021-07-13 |
Electrode Placement For Verifying Structural Intergrity Of Materials
App 20210208094 - Redinger; David H. ; et al. | 2021-07-08 |
Temperature-corrected control data for verifying of structural integrity of materials
Grant 11,016,047 - Redinger May 25, 2 | 2021-05-25 |
Electrode placement for verifying structural integrity of materials
Grant 10,983,081 - Redinger , et al. April 20, 2 | 2021-04-20 |
Data Communication Apparatus, System, And Method
App 20210105546 - Rodriguez, JR.; Ernesto M. ; et al. | 2021-04-08 |
Verifying Structural Integrity Of Materials
App 20210048403 - Yungers; Christopher R. ; et al. | 2021-02-18 |
Data communication apparatus, system, and method
Grant 10,873,792 - Rodriguez, Jr. , et al. December 22, 2 | 2020-12-22 |
Verifying structural integrity of materials
Grant 10,816,495 - Yungers , et al. October 27, 2 | 2020-10-27 |
Temperature-corrected Control Data For Verifying Of Structural Integrity Of Materials
App 20200225182 - Redinger; David H. | 2020-07-16 |
Verifying Structural Integrity Of Materials Using Electrical Properties
App 20200116661 - Yungers; Christopher R. ; et al. | 2020-04-16 |
Fuel injectors with improved coefficient of fuel discharge
Grant 10,590,899 - Schnobrich , et al. | 2020-03-17 |
Abrading Tool For Sensing Vibration
App 20200030936 - Knudson; Orlin B. ; et al. | 2020-01-30 |
Abrasive Product For Communication With Abrading Tool
App 20200030938 - Knudson; Orlin B. ; et al. | 2020-01-30 |
Verifying Structural Integrity Of Materials
App 20200011826 - Yungers; Christopher R. ; et al. | 2020-01-09 |
Data Communication Apparatus, System, And Method
App 20200007964 - Rodriguez, JR.; Ernesto M. ; et al. | 2020-01-02 |
Verifying Structural Integrity Of Materials Using Reference Impedance
App 20190383763 - Yungers; Christopher R. ; et al. | 2019-12-19 |
Electrode Placement For Verifying Structural Intergrity Of Materials
App 20190346395 - Redinger; David H. ; et al. | 2019-11-14 |
Temperature-independent Verifying Of Structural Integrity Of Materials Using Electrical Properties
App 20190346394 - Redinger; David H. ; et al. | 2019-11-14 |
Verifying Structural Integrity Of Materials
App 20190346393 - Chinnock; Eric M. ; et al. | 2019-11-14 |
Suppressing Thermally Induced Voltages For Verifying Structural Integrity Of Materials
App 20190346396 - Redinger; David H. ; et al. | 2019-11-14 |
Verifying Structural Integrity Of Materials
App 20190323980 - Yungers; Christopher R. ; et al. | 2019-10-24 |
Data communication apparatus, system, and method
Grant 10,412,471 - Rodriguez, Jr. , et al. Sept | 2019-09-10 |
Data Communication Apparatus, System, And Method
App 20180249230 - Rodriguez, Jr.; Ernesto M. ; et al. | 2018-08-30 |
Data communication appratus, system, and method
Grant 9,961,418 - Rodriguez, Jr. , et al. May 1, 2 | 2018-05-01 |
Data Communication Appratus, System, And Method
App 20170127156 - Rodriguez, Jr.; Ernesto M. ; et al. | 2017-05-04 |
Injection Molded Nozzle Preform With Undercut Micro Features
App 20160207240 - Kuduva Raman Thanumoorthy; Ramasubramani ; et al. | 2016-07-21 |
Method Of Making A Nozzle Including Injection Molding
App 20150328686 - Martinson; Paul A. ; et al. | 2015-11-19 |
Photoresists containing polymer-tethered nanoparticles
Grant 9,104,100 - Redinger , et al. August 11, 2 | 2015-08-11 |
Fuel Injectors With Non-coined Three-dimensional Nozzle Outlet Face
App 20150219051 - Carpenter; Barry S. ; et al. | 2015-08-06 |
Fuel Injectors With Non-coined Three-dimensional Nozzle Inlet Face
App 20150211461 - Shirk; Ryan C. ; et al. | 2015-07-30 |
Targeting Of Fuel Output By Off-axis Directing Of Nozzle Output Streams
App 20150211458 - Carpenter; Barry S. ; et al. | 2015-07-30 |
Fuel Injector Nozzles With At Least One Multiple Inlet Port And/or Multiple Outlet Port
App 20150211462 - Schnobrich; Scott M. ; et al. | 2015-07-30 |
Fuel Injectors With Improved Coefficient Of Fuel Discharge
App 20150204291 - Schnobrich; Scott M. ; et al. | 2015-07-23 |
Assembly and electronic devices including the same
Grant 8,835,915 - Clough , et al. September 16, 2 | 2014-09-16 |
Photoresists Containing Polymer-tethered Nanoparticles
App 20140080061 - Redinger; David H. ; et al. | 2014-03-20 |
Stability enhancements in metal oxide semiconductor thin film transistors
Grant 8,610,119 - Theiss , et al. December 17, 2 | 2013-12-17 |
Assembly And Electronic Devices Including The Same
App 20130256640 - Clough; Robert S. ; et al. | 2013-10-03 |
Mixed solvent systems for deposition of organic semiconductors
Grant 8,232,550 - Clough , et al. July 31, 2 | 2012-07-31 |
Stability Enhancements in Metal Oxide Semiconductor Thin Film Transistors
App 20110253998 - Theiss; Steven D. ; et al. | 2011-10-20 |
Mixed Solvent Systems for Deposition of Organic Semiconductors
App 20110092015 - Clough; Robert S. ; et al. | 2011-04-21 |
| 