Redeker; Fritz C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Redeker; Fritz C..The latest application filed is for "processes and systems for engineering a barrier surface for copper deposition".

Company Profile

0.51.53

Redeker; Fritz C. - Fremont CA US
Redeker; Fritz C. - US
Redeker; Fritz C. - Palo Alto CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus and method for atomic layer deposition Grant 9,359,673 - Yoon , et al. June 7, 2	2016-06-07
Method and apparatus for wafer electroless plating Grant 9,287,110 - Thie , et al. March 15, 2	2016-03-15
Controlled ambient system for interface engineering Grant 9,117,860 - Boyd , et al. August 25, 2	2015-08-25
Processes And Systems For Engineering A Barrier Surface For Copper Deposition App 20150214093 - Dordi; Yezdi ; et al.	2015-07-30
Process integration scheme to lower overall dielectric constant in BEoL interconnect structures Grant 9,076,844 - Bright , et al. July 7, 2	2015-07-07
Apparatus For Barrier Interface Preparation Of Copper Interconnect App 20150128861 - Yoon; Hyungsuk Alexander ; et al.	2015-05-14
Methods For Barrier Interface Preparation Of Copper Interconnect App 20150132946 - Yoon; Hyungsuk Alexander ; et al.	2015-05-14
Method for barrier interface preparation of copper interconnect Grant 8,916,232 - Yoon , et al. December 23, 2	2014-12-23
Processes And Systems For Engineering A Copper Surface For Selective Metal Deposition App 20140322446 - Dordi; Yezdi ; et al.	2014-10-30
Fluid handling system for wafer electroless plating and associated methods Grant 8,844,461 - Thie , et al. September 30, 2	2014-09-30
Processes and systems for engineering a copper surface for selective metal deposition Grant 8,771,804 - Dordi , et al. July 8, 2	2014-07-08
Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicide Grant 8,747,960 - Dordi , et al. June 10, 2	2014-06-10
Method for removing material from semiconductor wafer and apparatus for performing the same Grant 8,691,027 - Korolik , et al. April 8, 2	2014-04-08
Methods for atomic layer deposition Grant 8,623,456 - Yoon , et al. January 7, 2	2014-01-07
Simultaneous electroless plating of two substrates Grant 8,622,020 - Thie , et al. January 7, 2	2014-01-07
Method and Apparatus for Wafer Electroless Plating App 20130280917 - Thie; William ; et al.	2013-10-24
Substrate Cleaning Technique Employing Multi-phase Solution App 20130206182 - Freer; Erik M. ; et al.	2013-08-15
Method and apparatus for wafer electroless plating Grant 8,485,120 - Thie , et al. July 16, 2	2013-07-16
Method and apparatus for particle removal Grant 8,480,810 - Freer , et al. July 9, 2	2013-07-09
Substrate preparation using stabilized fluid solutions and methods for making stable fluid solutions Grant 8,475,599 - Freer , et al. July 2, 2	2013-07-02
Method For Removing Material From Semiconductor Wafer And Apparatus For Performing The Same App 20130061887 - Korolik; Mikhail ; et al.	2013-03-14
Substrate cleaning technique employing multi-phase solution Grant 8,388,762 - Freer , et al. March 5, 2	2013-03-05
Methods For Atomic Layer Deposition App 20130040460 - Yoon; Hyungsuk Alexander ; et al.	2013-02-14
Method for removing material from semiconductor wafer and apparatus for performing the same Grant 8,323,420 - Korolik , et al. December 4, 2	2012-12-04
Wafer electroless plating system and associated methods Grant 8,314,027 - Thie , et al. November 20, 2	2012-11-20
Processes and Systems for Engineering a Barrier Surface for Copper Deposition App 20120269987 - Dordi; Yezdi ; et al.	2012-10-25
Apparatus and method for atomic layer deposition Grant 8,287,647 - Yoon , et al. October 16, 2	2012-10-16
Apparatus And Method For Atomic Layer Deposition App 20120248219 - Yoon; Hyungsuk Alexander ; et al.	2012-10-04
Processes and systems for engineering a barrier surface for copper deposition Grant 8,241,701 - Dordi , et al. August 14, 2	2012-08-14
Wafer Electroless Plating System and Associated Methods App 20120045897 - Thie; William ; et al.	2012-02-23
Interconnect Structure And Method Of Manufacturing A Damascene Structure App 20110306203 - Dordi; Yezdi ; et al.	2011-12-15
Wafer electroless plating system and associated methods Grant 8,069,813 - Thie , et al. December 6, 2	2011-12-06
Interconnect structure and method of manufacturing a damascene structure Grant 8,026,605 - Dordi , et al. September 27, 2	2011-09-27
Substrate proximity drying using in-situ local heating of substrate Grant 8,011,116 - Mikhaylichenko , et al. September 6, 2	2011-09-06
Thermal methods for cleaning post-CMP wafers Grant 7,884,017 - Wang , et al. February 8, 2	2011-02-08
Electroless Plating Method and Apparatus App 20110011335 - Thie; William ; et al.	2011-01-20
Substrate Preparation Using Megasonic Coupling Fluid Meniscus App 20100319726 - Boyd; John M. ; et al.	2010-12-23
Substrate Proximity Drying Using In-situ Local Heating Of Substrate App 20100313443 - Mikhaylichenko; Katrina ; et al.	2010-12-16
Electroless plating method and apparatus Grant 7,829,152 - Thie , et al. November 9, 2	2010-11-09
Substrate preparation using megasonic coupling fluid meniscus and methods, apparatus, and systems for implementing the same Grant 7,810,513 - Boyd , et al. October 12, 2	2010-10-12
Substrate proximity drying using in-situ local heating of substrate and substrate carrier point of contact, and methods, apparatus, and systems for implementing the same Grant 7,806,126 - Mikhaylichenko , et al. October 5, 2	2010-10-05
Apparatus for Applying a Plating Solution for Electroless Deposition App 20100239767 - Dordi; Yezdi ; et al.	2010-09-23
Apparatus for applying a plating solution for electroless deposition Grant 7,752,996 - Dordi , et al. July 13, 2	2010-07-13
Thermal Methods For Cleaning Post-cmp Wafers App 20100136788 - Wang; Zhonghui Alex ; et al.	2010-06-03
Thermal methods for cleaning post-CMP wafers Grant 7,709,400 - Wang , et al. May 4, 2	2010-05-04
Apparatus and method for semiconductor wafer electroplanarization Grant 7,648,616 - Boyd , et al. January 19, 2	2010-01-19
Apparatus For Integrated Surface Treatment And Deposition For Copper Interconnect App 20090320749 - Yoon; Hyungsuk Alexander ; et al.	2009-12-31
Self assembled monolayer for improving adhesion between copper and barrier layer App 20090304914 - Nalla; Praveen ; et al.	2009-12-10
Apparatus and method for integrated surface treatment and deposition for copper interconnect Grant 7,615,486 - Yoon , et al. November 10, 2	2009-11-10
Apparatus and method for confined area planarization Grant 7,598,175 - Boyd , et al. October 6, 2	2009-10-06
Process Integration Scheme To Lower Overall Dielectric Constant In Beol Interconnect Structures App 20090134520 - Bright; Nicolas ; et al.	2009-05-28
Apparatus for developing photoresist and method for operating the same Grant 7,520,284 - Boyd , et al. April 21, 2	2009-04-21
Process integration scheme to lower overall dielectric constant in BEoL interconnect structures Grant 7,521,358 - Bright , et al. April 21, 2	2009-04-21
Thermal methods for cleaning post-CMP wafers App 20080280456 - Wang; Zhonghui Alex ; et al.	2008-11-13
Substrate cleaning technique employing multi-phase solution App 20080271749 - Freer; Erik M. ; et al.	2008-11-06
Apparatus And Method For Pre And Post Treatment Of Atomic Layer Deposition App 20080260963 - Yoon; Hyungsuk Alexander ; et al.	2008-10-23
Apparatus And Method For Integrated Surface Treatment And Deposition For Copper Interconnect App 20080260940 - Yoon; Hyungsuk Alexander ; et al.	2008-10-23
Apparatus And Method For Atomic Layer Deposition App 20080261412 - Yoon; Hyungsuk Alexander ; et al.	2008-10-23
Apparatus And Method For Integrated Surface Treatment And Film Deposition App 20080260967 - Yoon; Hyungsuk Alexander ; et al.	2008-10-23
Method and Apparatus for Wafer Electroless Plating App 20080254225 - Thie; William ; et al.	2008-10-16
Wafer Electroless Plating System and Associated Methods App 20080254621 - Thie; William ; et al.	2008-10-16
Fluid Handling System for Wafer Electroless Plating and Associated Methods App 20080251148 - Thie; William ; et al.	2008-10-16
Method for cleaning semiconductor wafer surfaces by applying periodic shear stress to the cleaning solution App 20080245390 - Freer; Erik M. ; et al.	2008-10-09
Apparatus and Method for Confined Area Planarization App 20080227369 - Boyd; John M. ; et al.	2008-09-18
Apparatus and method for confined area planarization Grant 7,396,430 - Boyd , et al. July 8, 2	2008-07-08
Self-limiting plating method App 20080152823 - Boyd; John ; et al.	2008-06-26
Method and apparatus for drying substrates using a surface tensions reducing gas App 20080148595 - de Larios; John M. ; et al.	2008-06-26
Process integration scheme to lower overall dielectric constant in BEoL interconnect structures App 20080150138 - Bright; Nicolas ; et al.	2008-06-26
Interconnect structure and method of manufacturing a damascene structure App 20080142971 - Dordi; Yezdi ; et al.	2008-06-19
Electroless Plating Method And Apparatus App 20080085370 - Thie; William ; et al.	2008-04-10
Methods and apparatus for barrier interface preparation of copper interconnect App 20080057198 - Yoon; Hyungsuk Alexander ; et al.	2008-03-06
Method For Gap Fill In Controlled Ambient System App 20080057182 - Boyd; John ; et al.	2008-03-06
Controlled ambient system for interface engineering App 20080057221 - Boyd; John ; et al.	2008-03-06
Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicide App 20070292615 - Dordi; Yezdi ; et al.	2007-12-20
Processes and systems for engineering a copper surface for selective metal deposition App 20070292604 - Dordi; Yezdi ; et al.	2007-12-20
Processes and systems for engineering a barrier surface for copper deposition App 20070292603 - Dordi; Yezdi ; et al.	2007-12-20
Apparatus For Applying A Plating Solution For Electroless Deposition App 20070264436 - Dordi; Yezdi ; et al.	2007-11-15
Apparatus and method for confined area planarization App 20070227656 - Boyd; John M. ; et al.	2007-10-04
Method and apparatus for particle removal App 20070151583 - Freer; Erik M. ; et al.	2007-07-05
Substrate preparation using stabilized fluid solutions and methods for making stable fluid solutions App 20070155640 - Freer; Erik M. ; et al.	2007-07-05
Method for removing material from semiconductor wafer and apparatus for performing the same App 20070000518 - Korolik; Mikhail ; et al.	2007-01-04
Apparatus for developing photoresist and method for operating the same App 20060269877 - Boyd; John M. ; et al.	2006-11-30
Non-contact discrete removal of substrate surface contaminants/coatings, and method, apparatus, and system for implementing the same App 20060131268 - Mikhaylichenko; Katrina ; et al.	2006-06-22
Brush scrubbing-high frequency resonating substrate processing system Grant 7,032,269 - Mikhaylichenko , et al. April 25, 2	2006-04-25
Brush scrubbing-high frequency resonating substrate processing system App 20060016029 - Mikhaylichenko; Katrina ; et al.	2006-01-26
Brush scrubbing-high frequency resonating wafer processing system and methods for making and implementing the same Grant 6,951,042 - Mikhaylichenko , et al. October 4, 2	2005-10-04
Selective damascene chemical mechanical polishing Grant 6,261,157 - Bajaj , et al. July 17, 2	2001-07-17

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