loadpatents
name:-0.0050160884857178
name:-0.0088651180267334
name:-0.00049901008605957
Reddy; Srinivasa N. Patent Filings

Reddy; Srinivasa N.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Reddy; Srinivasa N..The latest application filed is for "creation of lead-free solder joint with intermetallics".

Company Profile
0.6.2
  • Reddy; Srinivasa N. - LeGrangeville NY
  • Reddy; Srinivasa N. - LaGrangeville NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Creation of lead-free solder joint with intermetallics
Grant 8,268,716 - Arvin , et al. September 18, 2
2012-09-18
Creation Of Lead-free Solder Joint With Intermetallics
App 20120083113 - Arvin; Charles L. ;   et al.
2012-04-05
Multilayer ceramic substrate with single via anchored pad and method of forming
Grant 6,987,316 - Reddy , et al. January 17, 2
2006-01-17
Multilayer Ceramic Substrate With Single Via Anchored Pad And Method Of Forming
App 20050151241 - Reddy, Srinivasa N. ;   et al.
2005-07-14
Module input-output pad having stepped set-back
Grant 5,483,105 - Kaja , et al. January 9, 1
1996-01-09
Method and means for co-sintering ceramic/metal MLC substrates
Grant 5,130,067 - Flaitz , et al. July 14, 1
1992-07-14
Multilayered ceramic substrate having solid non-porous metal conductors
Grant 4,879,156 - Herron , et al. November 7, 1
1989-11-07
Process for forming multilayered ceramic substrate having solid metal conductors
Grant 4,753,694 - Herron , et al. June 28, 1
1988-06-28

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