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Patent applications and USPTO patent grants for Reddy; Srinivasa N..The latest application filed is for "creation of lead-free solder joint with intermetallics".
Patent | Date |
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Creation of lead-free solder joint with intermetallics Grant 8,268,716 - Arvin , et al. September 18, 2 | 2012-09-18 |
Creation Of Lead-free Solder Joint With Intermetallics App 20120083113 - Arvin; Charles L. ;   et al. | 2012-04-05 |
Multilayer ceramic substrate with single via anchored pad and method of forming Grant 6,987,316 - Reddy , et al. January 17, 2 | 2006-01-17 |
Multilayer Ceramic Substrate With Single Via Anchored Pad And Method Of Forming App 20050151241 - Reddy, Srinivasa N. ;   et al. | 2005-07-14 |
Module input-output pad having stepped set-back Grant 5,483,105 - Kaja , et al. January 9, 1 | 1996-01-09 |
Method and means for co-sintering ceramic/metal MLC substrates Grant 5,130,067 - Flaitz , et al. July 14, 1 | 1992-07-14 |
Multilayered ceramic substrate having solid non-porous metal conductors Grant 4,879,156 - Herron , et al. November 7, 1 | 1989-11-07 |
Process for forming multilayered ceramic substrate having solid metal conductors Grant 4,753,694 - Herron , et al. June 28, 1 | 1988-06-28 |
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