Redding; Gary D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Redding; Gary D..The latest application filed is for "surface treated additive manufacturing printhead nozzles and methods for the same".

Company Profile

14.39.35

Redding; Gary D. - Victor NY
Redding; Gary D. - Dansville NY
Redding; Gary D. - Victory NY
Redding; Gary D - Victor NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Filament heaters configured to facilitate thermal treatment of filaments for extruder heads in three-dimensional object printers Grant 11,383,417 - Mantell , et al. July 12, 2	2022-07-12
Plurality of linear sensor arrays comprising plural process direction widths and photosites with submicron y-axis alignment between arrays Grant 11,025,796 - Casey , et al. June 1, 2	2021-06-01
Surface Treated Additive Manufacturing Printhead Nozzles And Methods For The Same App 20210069972 - Badesha; Santokh S. ; et al.	2021-03-11
Surface Treated Additive Manufacturing Printhead Nozzles And Methods For The Same App 20210069778 - Redding; Gary D. ; et al.	2021-03-11
Method of fabricating a plurality of linear arrays with submicron y-axis alignment Grant 10,943,895 - Redding , et al. March 9, 2	2021-03-09
Filament Heaters Configured To Facilitate Thermal Treatment Of Filaments For Extruder Heads In Three-dimensional Object Printers App 20200398476 - Mantell; David A. ; et al.	2020-12-24
Filament heaters configured to facilitate thermal treatment of filaments for extruder heads in three-dimensional object printers Grant 10,814,544 - Mantell , et al. October 27, 2	2020-10-27
Imaging Blanket And Variable Data Lithography System Employing The Imaging Blanket App 20200282759 - Sambhy; Varun ; et al.	2020-09-10
Plurality Of Linear Sensor Arrays With Submicron Y-axis Alignment Between Arrays App 20200228674 - Casey; Joseph F. ; et al.	2020-07-16
Method Of Fabricating A Plurality Of Linear Arrays With Submicron Y-axis Alignment App 20200227399 - Redding; Gary D. ; et al.	2020-07-16
Extrusion printheads for three-dimensional object printers Grant 10,625,466 - Mandel , et al.	2020-04-21
System and method for cooling digital mirror devices Grant 10,629,515 - Leighton , et al.	2020-04-21
Lead-free piezo printhead using thinned bulk material Grant 10,421,277 - Nystrom , et al. Sept	2019-09-24
Lead-free Piezo Printhead Using Thinned Bulk Material App 20190232658 - Nystrom; Peter J. ; et al.	2019-08-01
Lead-free piezo printhead using thinned bulk material Grant 10,252,525 - Nystrom , et al.	2019-04-09
Method of forming piezo driver electrodes Grant 10,166,777 - Redding , et al. J	2019-01-01
Lead-free Piezo Printhead Using Thinned Bulk Material App 20180345670 - Nystrom; Peter J. ; et al.	2018-12-06
Method Of Forming Two-dimensional And Three-dimensional Semiconductor Chip Arrays App 20180337208 - Casey; Joseph F. ; et al.	2018-11-22
Method of forming two-dimensional and three-dimensional semiconductor chip arrays Grant 10,134,793 - Casey , et al. November 20, 2	2018-11-20
System And Method For Cooling Digital Mirror Devices App 20180177076 - Leighton; Roger G. ; et al.	2018-06-21
Filament Heaters Configured To Facilitate Thermal Treatment Of Filaments For Extruder Heads In Three-dimensional Object Printers App 20180111308 - Mantell; David A. ; et al.	2018-04-26
Raised fluid pass-through structure in print heads Grant 9,931,843 - Brick , et al. April 3, 2	2018-04-03
Raised Fluid Pass-through Structure In Print Heads App 20180022094 - BRICK; JONATHAN R. ; et al.	2018-01-25
Raised fluid pass-through structure in print heads Grant 9,802,408 - Brick , et al. October 31, 2	2017-10-31
Method Of Forming Piezo Driver Electrodes App 20170305159 - Redding; Gary D. ; et al.	2017-10-26
Pin-actuated printhead Grant 9,757,900 - Nystrom , et al. September 12, 2	2017-09-12
Extrusion Printheads For Three-dimensional Object Printers App 20170157844 - Mandel; Barry P. ; et al.	2017-06-08
Pin-actuated Printhead App 20160339635 - Nystrom; Peter J. ; et al.	2016-11-24
Raised Fluid Pass-through Structure In Print Heads App 20160243828 - BRICK; JONATHAN R. ; et al.	2016-08-25
Method of manufacturing ink jet printheads including electrostatic actuators Grant 9,421,772 - Nystrom , et al. August 23, 2	2016-08-23
Membrane bond alignment for electrostatic ink jet printhead Grant 9,375,926 - Nystrom , et al. June 28, 2	2016-06-28
Wafer Level Fabrication And Bonding Of Membranes For Electrostatic Printheads App 20160159091 - Nystrom; Peter J. ; et al.	2016-06-09
Electrostatic actuator with short circuit protection and process Grant 9,321,265 - Nystrom , et al. April 26, 2	2016-04-26
Printhead configured to refill nozzle areas with high viscosity materials Grant 9,302,472 - Mantell , et al. April 5, 2	2016-04-05
Flex Circuit Board With Topographical Structures To Facilitate Fluid Flow Through The Layer App 20160039205 - Nystrom; Peter J. ; et al.	2016-02-11
Flex circuit board with topographical structures to facilitate fluid flow through the layer Grant 9,238,365 - Nystrom , et al. January 19, 2	2016-01-19
Multi-layer electroformed nozzle plate with attenuation pockets Grant 9,168,747 - Redding , et al. October 27, 2	2015-10-27
Print head transducer dicing directly on diaphragm Grant 9,139,004 - Redding , et al. September 22, 2	2015-09-22
Electrostatic Actuator With Short Circuit Protection And Process App 20150246539 - Nystrom; Peter J. ; et al.	2015-09-03
Printhead layer design for compatibility with wet adhesive application processes Grant 9,073,321 - Redding , et al. July 7, 2	2015-07-07
Electrostatic device improved membrane bonding Grant 9,073,322 - Nystrom , et al. July 7, 2	2015-07-07
Multi-layer Electroformed Nozzle Plate With Attenuation Pockets App 20150097897 - Redding; Gary D. ; et al.	2015-04-09
Printhead fabrication using additive manufacturing techniques Grant 8,984,752 - Redding , et al. March 24, 2	2015-03-24
High density three-dimensional electrical interconnections Grant 8,888,254 - Wen , et al. November 18, 2	2014-11-18
Structure and method to fabricate tooling for bumping thin flex circuits Grant 8,845,907 - Nystrom , et al. September 30, 2	2014-09-30
Polymer film as an interstitial fill for PZT printhead fabrication Grant 8,814,328 - Redding , et al. August 26, 2	2014-08-26
Structure And Method To Fabricate Tooling For Bumping Thin Flex Circuits App 20140178644 - Nystrom; Peter J. ; et al.	2014-06-26
Method for protecting piezoelectric transducer Grant 8,708,465 - Cellura , et al. April 29, 2	2014-04-29
High Density Three-dimensional Electrical Interconnections App 20140071208 - Wen; Xuejin ; et al.	2014-03-13
Interstitial Material To Enable Robust Electrical Interconnect For High Density Piezoelectric Arrays App 20140043400 - DOLAN; Bryan R. ; et al.	2014-02-13
Interstitial material to enable robust electrical interconnect for high density piezoelectric arrays Grant 8,646,881 - Dolan , et al. February 11, 2	2014-02-11
Process for adding thermoset layer to piezoelectric printhead Grant 8,608,293 - Redding , et al. December 17, 2	2013-12-17
Printhead Fabrication Using Additive Manufacturing Techniques App 20130328975 - Redding; Gary D. ; et al.	2013-12-12
High density electrical interconnect for printing devices using flex circuits and dielectric underfill Grant 8,585,187 - Nystrom , et al. November 19, 2	2013-11-19
Method for interstitial polymer planarization using a flexible flat plate Grant 8,556,611 - Dolan , et al. October 15, 2	2013-10-15
Print Head Transducer Dicing Directly On Diaphragm App 20130227826 - Redding; Gary D. ; et al.	2013-09-05
Polymer Film As An Interstitial Fill For Pzt Printhead Fabrication App 20130147881 - Redding; Gary D. ; et al.	2013-06-13
Process for Adding Thermoset Layer to Piezoelectric Printhead App 20130100212 - Redding; Gary D. ; et al.	2013-04-25
Method For Interstitial Polymer Planarization Using A Flexible Flat Plate App 20120328784 - Dolan; Bryan R. ; et al.	2012-12-27
High Density Electrical Interconnect For Printing Devices Using Flex Circuits And Dielectric Underfill App 20120274708 - Nystrom; Peter J. ; et al.	2012-11-01

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