READ; Matthew S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for READ; Matthew S..The latest application filed is for "packaged radio-frequency module having wirebond shielding".

Company Profile

0.7.7

READ; Matthew S. - Rancho Santa Margarita CA
Read; Matthew S. - Santa Margarita CA US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Packaged Radio-frequency Module Having Wirebond Shielding App 20150255402 - HOANG; Dinhphuoc V. ; et al.	2015-09-10
Methods Related To Fabrication Of Shielded Radio-frequency Module App 20150255403 - HOANG; Dinhphuoc V. ; et al.	2015-09-10
Methods for fabricating an overmolded semiconductor package with wirebonds for electromagnetic shielding Grant 9,054,115 - Hoang , et al. June 9, 2	2015-06-09
Overmolded semiconductor package with wirebonds for electromagnetic shielding Grant 9,041,168 - Hoang , et al. May 26, 2	2015-05-26
Overmolded semiconductor package with a wirebond cage for EMI shielding Grant 8,399,972 - Hoang , et al. March 19, 2	2013-03-19
Overmolded Semiconductor Package With Wirebonds For Electromagnetic Shielding App 20120146178 - Hoang; Dinhphuoc V. ; et al.	2012-06-14
Methods For Fabricating An Overmolded Semiconductor Package With Wirebonds For Electromagnetic Shielding App 20120137514 - Hoang; Dinhphuoc V. ; et al.	2012-06-07
Overmolded semiconductor package with a wirebond cage for EMI shielding Grant 8,071,431 - Hoang , et al. December 6, 2	2011-12-06
Overmolded Semiconductor Package With A Wirebond Cage For Emi Shielding App 20110084368 - Hoang; Dinphuoc V. ; et al.	2011-04-14
Overmolded semiconductor package with a wirebond cage for EMI shielding App 20070241440 - Hoang; Dinhphuoc V. ; et al.	2007-10-18
Saw alignment technique for array device singulation App 20020114507 - Lynch, Mark ; et al.	2002-08-22

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