RAZDAN; Sandeep
Patent Applications and Registrations
Patent applications and USPTO patent grants for RAZDAN; Sandeep.The latest application filed is for "thermal packaging with fan out wafer level processing".
Company Profile
10.27.36
- RAZDAN; Sandeep - Burlingame CA
- Razdan; Sandeep - Chandler AZ
- Razdan; Sandeep - Millbrae CA
- Razdan; Sandeep - Cohoes NY
Patent Activity
| Patent | Date |
|---|---|
| Thermal Packaging With Fan Out Wafer Level Processing App 20220278022 - ERICKSON; Ashley J.M. ; et al. | 2022-09-01 |
| Wafer-scale fabrication of optical apparatus Grant 11,391,888 - Razdan , et al. July 19, 2 | 2022-07-19 |
| Thermal packaging with fan out wafer level processing Grant 11,373,930 - Erickson , et al. June 28, 2 | 2022-06-28 |
| Periscope optical assembly Grant 11,226,450 - Traverso , et al. January 18, 2 | 2022-01-18 |
| Connection features for electronic and optical packaging Grant 11,215,775 - Maker , et al. January 4, 2 | 2022-01-04 |
| Low temperature solder in a photonic device Grant 11,181,689 - Razdan , et al. November 23, 2 | 2021-11-23 |
| Thermal Packaging With Fan Out Wafer Level Processing App 20210305128 - ERICKSON; Ashley J.M. ; et al. | 2021-09-30 |
| Integrated Circuit Bridge For Photonics And Electrical Chip Integration App 20210280568 - TRAVERSO; Matthew J. ; et al. | 2021-09-09 |
| Integrated circuit bridge for photonics and electrical chip integration Grant 11,043,478 - Traverso , et al. June 22, 2 | 2021-06-22 |
| Frame lid for in-package optics Grant 11,029,475 - Patel , et al. June 8, 2 | 2021-06-08 |
| Wafer-scale Fabrication Of Optical Apparatus App 20210141154 - RAZDAN; Sandeep ; et al. | 2021-05-13 |
| Passive fiber to chip coupling using post-assembly laser patterned waveguides Grant 10,962,719 - Razdan , et al. March 30, 2 | 2021-03-30 |
| Low Temperature Solder In A Photonic Device App 20210088722 - RAZDAN; Sandeep ; et al. | 2021-03-25 |
| Periscope Optical Assembly App 20210072461 - TRAVERSO; Matthew J. ; et al. | 2021-03-11 |
| Connection Features For Electronic And Optical Packaging App 20210055489 - MAKER; Ashley J. ; et al. | 2021-02-25 |
| Periscope optical assembly Grant 10,877,219 - Traverso , et al. December 29, 2 | 2020-12-29 |
| Frame Lid For In-package Optics App 20200319416 - PATEL; Vipulkumar K. ; et al. | 2020-10-08 |
| Passive Fiber To Chip Coupling Using Post-assembly Laser Patterned Waveguides App 20200241207 - RAZDAN; Sandeep ; et al. | 2020-07-30 |
| Optoelectronic device module having a silicon interposer Grant 10,727,368 - Yim , et al. | 2020-07-28 |
| Photonic integrated circuit bonded with interposer Grant 10,564,352 - Razdan , et al. Feb | 2020-02-18 |
| Integrated Circuit Bridge For Photonics And Electrical Chip Integration App 20190326266 - TRAVERSO; Matthew J. ; et al. | 2019-10-24 |
| Photonic integrated circuit bonded with interposer Grant 10,393,959 - Razdan , et al. A | 2019-08-27 |
| Optoelectronic Device Module Having A Silicon Interposer App 20190006549 - YIM; Myung Jin ; et al. | 2019-01-03 |
| Wafer level optical probing structures for silicon photonics Grant 10,145,758 - Traverso , et al. De | 2018-12-04 |
| Interconnect structures with polymer core Grant 10,128,225 - Razdan , et al. November 13, 2 | 2018-11-13 |
| Wafer Level Optical Probing Structures For Silicon Photonics App 20180313718 - TRAVERSO; Matthew J. ; et al. | 2018-11-01 |
| Fan-out wafer level integration for photonic chips Grant 9,964,719 - Razdan , et al. May 8, 2 | 2018-05-08 |
| Interposer with separable interface Grant 9,791,640 - Bowen , et al. October 17, 2 | 2017-10-17 |
| Optoelectronic Transceiver Assemblies App 20170288780 - Yim; Myung Jin ; et al. | 2017-10-05 |
| Interposer With Separable Interface App 20170261703 - Bowen; Terry Patrick ; et al. | 2017-09-14 |
| Interconnect Structures With Polymer Core App 20170229438 - Razdan; Sandeep ; et al. | 2017-08-10 |
| Optical Test Port Based Upon Nanocrystal-in-glass-material App 20170195043 - ZHANG; HAIPENG ; et al. | 2017-07-06 |
| Interconnect structures with polymer core Grant 9,613,934 - Razdan , et al. April 4, 2 | 2017-04-04 |
| Fluxing-encapsulant Material For Microelectronic Packages Assembled Via Thermal Compression Bonding Process App 20170042043 - NAGARAJAN; SIVAKUMAR ; et al. | 2017-02-09 |
| Methods And Devices For Securing And Transporting Singulated Die In High Volume Manufacturing App 20170032991 - JOHNSON; John C. ; et al. | 2017-02-02 |
| Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding process Grant 9,504,168 - Nagarajan , et al. November 22, 2 | 2016-11-22 |
| Methods And Devices For Securing And Transporting Singulated Die In High Volume Manufacturing App 20160172222 - JOHNSON; John C. ; et al. | 2016-06-16 |
| Optoelectronics structures Grant 9,335,494 - Razdan , et al. May 10, 2 | 2016-05-10 |
| Mode size converters and methods of fabricating the same Grant 9,310,555 - Sun , et al. April 12, 2 | 2016-04-12 |
| Mode Size Converters And Optical Assemblies App 20160062039 - Zhang; Haipeng ; et al. | 2016-03-03 |
| Optoelectronics Structures App 20150331204 - Razdan; Sandeep ; et al. | 2015-11-19 |
| Mode Size Converters And Methods Of Fabricating The Same App 20150331189 - Sun; Jibin ; et al. | 2015-11-19 |
| Optical Assembly App 20150212267 - Bowen; Terry Patrick ; et al. | 2015-07-30 |
| Methods And Devices For Securing And Transporting Singulated Die In High Volume Manufacturing App 20150187622 - JOHNSON; John C. ; et al. | 2015-07-02 |
| Interconnect Structures With Polymer Core App 20150162313 - Razdan; Sandeep ; et al. | 2015-06-11 |
| Interconnect structures with polymer core Grant 8,987,918 - Razdan , et al. March 24, 2 | 2015-03-24 |
| Techniques and configurations for surface treatment of an integrated circuit substrate Grant 8,895,365 - Ramalingam , et al. November 25, 2 | 2014-11-25 |
| Interconnect Structures With Polymer Core App 20140264910 - Razdan; Sandeep ; et al. | 2014-09-18 |
| Techniques And Configurations For Surface Treatment Of An Integrated Circuit Substrate App 20140061902 - Ramalingam; Suriyakala ; et al. | 2014-03-06 |
| Fluxing-encapsulant Material For Microelectronic Packages Assembled Via Thermal Compression Bonding Process App 20130263446 - Nagarajan; Sivakumar ; et al. | 2013-10-10 |
| Flip chip package containing novel underfill materials Grant 8,377,550 - Swaminathan , et al. February 19, 2 | 2013-02-19 |
| Nanocomposite polymers Grant 8,143,339 - Warner , et al. March 27, 2 | 2012-03-27 |
| Flip chip package containing novel underfill materials App 20110159228 - Swaminathan; Rajasekaran ; et al. | 2011-06-30 |
| Protective coating for semiconductor substrates App 20100155935 - Prack; Ed ; et al. | 2010-06-24 |
| Nanocomposite Polymers App 20080249228 - Warner; Steven B. ; et al. | 2008-10-09 |
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