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Patent applications and USPTO patent grants for Raytech Innovative Solutions, LLC.The latest application filed is for "gradient polishing pad made from paper-making fibers for use in chemical/mechanical planarization of wafers".
Patent | Date |
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Gradient polishing pad made from paper-making fibers for use in chemical/mechanical planarization of wafers Grant 7,025,668 - Petroski , et al. April 11, 2 | 2006-04-11 |
Retaining ring with wear pad for use in chemical mechanical planarization Grant 6,979,256 - Cooper , et al. December 27, 2 | 2005-12-27 |
Method for securing a polishing pad to a platen for use in chemical-mechanical polishing of wafers Grant 6,964,601 - Petroski , et al. November 15, 2 | 2005-11-15 |
Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making Grant 6,945,846 - Petroski , et al. September 20, 2 | 2005-09-20 |
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