Rayssac; Olivier

Patent Applications and Registrations

Patent applications and USPTO patent grants for Rayssac; Olivier.The latest application filed is for "fabrication of substrates with a useful layer of monocrystalline semiconductor material".

Company Profile

0.52.52

Rayssac; Olivier - Grenoble N/A FR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fabrication of substrates with a useful layer of monocrystalline semiconductor material Grant 10,002,763 - Letertre , et al. June 19, 2	2018-06-19
Substrate cutting device and method Grant 8,991,673 - Rayssac , et al. March 31, 2	2015-03-31
Fabrication of substrates with a useful layer of monocrystalline semiconductor material Grant 8,507,361 - Letertre , et al. August 13, 2	2013-08-13
Fabrication of substrates with a useful layer of monocrystalline semiconductor material Grant 8,252,664 - Letertre , et al. August 28, 2	2012-08-28
Fabrication Of Substrates With A Useful Layer Of Monocrystalline Semiconductor Material App 20120058621 - Letertre; Fabrice ; et al.	2012-03-08
Substrate Cutting Device And Method App 20120048906 - Rayssac; Olivier ; et al.	2012-03-01
Fabrication Of Substrates With A Useful Layer Of Monocrystalline Semiconductor Material App 20120012048 - Letertre; Fabrice ; et al.	2012-01-19
Methods for forming an assembly for transfer of a useful layer using a peripheral recess area to facilitate transfer Grant 8,093,687 - Letertre , et al. January 10, 2	2012-01-10
Substrate cutting device and method Grant 8,083,115 - Rayssac , et al. December 27, 2	2011-12-27
Method Of Fabricating A Release Substrate App 20110233733 - Rayssac; Olivier ; et al.	2011-09-29
Method of fabricating a release substrate Grant 8,012,289 - Rayssac , et al. September 6, 2	2011-09-06
Fabrication Of Substrates With A Useful Layer Of Monocrystalline Semiconductor Material App 20110171812 - Letertre; Fabrice ; et al.	2011-07-14
Transfer method with a treatment of a surface to be bonded Grant 7,972,939 - Kerdiles , et al. July 5, 2	2011-07-05
Methods for making substrates and substrates formed therefrom Grant 7,939,428 - Boussagol , et al. May 10, 2	2011-05-10
Detachable substrate with controlled mechanical strength and method of producing same Grant 7,902,038 - Aspar , et al. March 8, 2	2011-03-08
Device and method for cutting an assembly Grant 7,892,946 - Rayssac , et al. February 22, 2	2011-02-22
Methods For Making Substrates And Substrates Formed Therefrom App 20110039368 - Boussagol; Alice ; et al.	2011-02-17
Fabrication of substrates with a useful layer of monocrystalline semiconductor material Grant 7,888,235 - Letertre , et al. February 15, 2	2011-02-15
Methods for making substrates and substrates formed therefrom Grant 7,839,001 - Boussagol , et al. November 23, 2	2010-11-23
Detachable substrate or detachable structure and method for the production thereof Grant 7,713,369 - Aspar , et al. May 11, 2	2010-05-11
Method for direct bonding two semiconductor substrates Grant 7,670,929 - Bourdelle , et al. March 2, 2	2010-03-02
Transfer Method With A Treatment Of A Surface To Be Bonded App 20100015780 - KERDILES; Sebastien ; et al.	2010-01-21
Methods For Making Substrates And Substrates Formed Therefrom App 20090289332 - Boussagol; Alice ; et al.	2009-11-26
Methods for making substrates and substrates formed therefrom Grant 7,615,468 - Boussagol , et al. November 10, 2	2009-11-10
Transfer method with a treatment of a surface to be bonded Grant 7,615,464 - Kerdiles , et al. November 10, 2	2009-11-10
Method of fabricating a hybrid substrate Grant 7,575,988 - Bourdelle , et al. August 18, 2	2009-08-18
Method Of Fabricating A Release Substrate App 20090179299 - RAYSSAC; Olivier ; et al.	2009-07-16
Method of fabricating chips and an associated support Grant 7,544,586 - Ghyselen , et al. June 9, 2	2009-06-09
Method of fabricating a release substrate Grant 7,544,265 - Rayssac, legal representative , et al. June 9, 2	2009-06-09
Embrittled substrate and method for making same Grant 7,498,245 - Aspar , et al. March 3, 2	2009-03-03
Atomic implantation and thermal treatment of a semiconductor layer Grant 7,449,394 - Akatsu , et al. November 11, 2	2008-11-11
Methods For Forming An Assembly For Transfer Of A Useful Layer App 20080258265 - Letertre; Fabrice ; et al.	2008-10-23
Methods for producing a semiconductor entity Grant 7,439,160 - Le Vaillant , et al. October 21, 2	2008-10-21
Substrate layer cutting device and method Grant 7,406,994 - Martinez , et al. August 5, 2	2008-08-05
Methods for forming an assembly for transfer of a useful layer Grant 7,404,870 - Letertre , et al. July 29, 2	2008-07-29
Substrate for stressed systems and method of making same Grant 7,405,135 - Letertre , et al. July 29, 2	2008-07-29
Semiconductor structure and method of making same Grant 7,391,094 - Rayssac , et al. June 24, 2	2008-06-24
Method For Direct Bonding Two Semiconductor Substrates App 20080014712 - Bourdelle; Konstantin ; et al.	2008-01-17
Method Of Fabricating A Hybrid Substrate App 20080014714 - BOURDELLE; Konstantin ; et al.	2008-01-17
Methods For Making Substrates And Substrates Formed Therefrom App 20070287273 - Boussagol; Alice ; et al.	2007-12-13
Fabrication Of Substrates With A Useful Layer Of Monocrystalline Semiconductor Material App 20070269960 - Letertre; Fabrice ; et al.	2007-11-22
Substrate assembly for stressed systems Grant 7,279,779 - Letertre , et al. October 9, 2	2007-10-09
Methods for forming a semiconductor structure Grant 7,276,428 - Daval , et al. October 2, 2	2007-10-02
Fabrication of substrates with a useful layer of monocrystalline semiconductor material Grant 7,265,029 - Letertre , et al. September 4, 2	2007-09-04
Methods for preparing a semiconductor assembly Grant 7,256,101 - Letertre , et al. August 14, 2	2007-08-14
Device And Method For Cutting An Assembly App 20070148915 - Rayssac; Olivier ; et al.	2007-06-28
Method for bonding semiconductor structures together Grant 7,235,461 - Maleville , et al. June 26, 2	2007-06-26
Device and method for cutting an assembly Grant 7,232,738 - Rayssac , et al. June 19, 2	2007-06-19
Substrate Layer Cutting Device And Method App 20070122926 - Martinez; Muriel ; et al.	2007-05-31
Substrate Cutting Device And Method App 20070119893 - Rayssac; Olivier ; et al.	2007-05-31
Methods For Producing A Semiconductor Entity App 20070104240 - Le Vaillant; Yves Matthieu ; et al.	2007-05-10
Method of fabricating a release substrate App 20070077729 - Rayssac; Olivier ; et al.	2007-04-05
Substrate layer cutting device and method Grant 7,189,304 - Martinez , et al. March 13, 2	2007-03-13
Substrate cutting device and method Grant 7,182,234 - Rayssac , et al. February 27, 2	2007-02-27
Methods for producing a semiconductor entity Grant 7,176,554 - Le Vaillant , et al. February 13, 2	2007-02-13
Preventive treatment method for a multilayer semiconductor structure Grant 7,169,683 - Ghyselen , et al. January 30, 2	2007-01-30
Substrate for stressed systems and method of making same Grant 7,163,873 - Letertre , et al. January 16, 2	2007-01-16
Substrate for stressed systems and method of making same Grant 7,145,214 - Letertre , et al. December 5, 2	2006-12-05
Transfer method with a treatment of a surface to be bonded App 20060270187 - Kerdiles; Sebastien ; et al.	2006-11-30
Methods for forming an assembly for transfer of a useful layer App 20060231203 - Letertre; Fabrice ; et al.	2006-10-19
Methods for forming an assembly for transfer of a useful layer Grant 7,122,095 - Letertre , et al. October 17, 2	2006-10-17
Substrate for stressed systems and method of making same App 20060216849 - Letertre; Fabrice ; et al.	2006-09-28
Substrate assembly for stressed systems App 20060192269 - Letertre; Fabrice ; et al.	2006-08-31
Substrate assembly for stressed systems Grant 7,067,393 - Letertre , et al. June 27, 2	2006-06-27
Layer transfer method Grant 7,060,590 - Bressot , et al. June 13, 2	2006-06-13
Method for ion treating a semiconductor material for subsequent bonding Grant 7,056,809 - Rayssac June 6, 2	2006-06-06
Process for manufacturing a substrate and associated substrate Grant 7,041,577 - Rayssac , et al. May 9, 2	2006-05-09
Semiconductor structure and method of making same App 20060086949 - Rayssac; Olivier ; et al.	2006-04-27
Substrate for stressed systems and method of making same App 20060079070 - Letertre; Fabrice ; et al.	2006-04-13
Substrate for stressed systems and method of making same App 20060076649 - Letertre; Fabrice ; et al.	2006-04-13
Surface treatment for multi-layer wafers formed from layers of materials chosen from among semiconducting materials Grant 6,991,944 - Rayssac , et al. January 31, 2	2006-01-31
Semiconductor structure and method of making same Grant 6,989,314 - Rayssac , et al. January 24, 2	2006-01-24
Thermal treatment of a semiconductor layer App 20060014363 - Daval; Nicolas ; et al.	2006-01-19
Atomic implantation and thermal treatment of a semiconductor layer App 20050245049 - Akatsu, Takeshi ; et al.	2005-11-03
Method of fabricating chips, and an associated support App 20050236700 - Ghyselen, Bruno ; et al.	2005-10-27
Methods for forming a semiconductor structure App 20050196937 - Daval, Nicolas ; et al.	2005-09-08
Methods for producing a semiconductor entity App 20050191779 - Le Vaillant, Yves Mathieu ; et al.	2005-09-01
Method for transferring elements between substrates App 20050178495 - Aspar, Bernard ; et al.	2005-08-18
Layer transfer methods Grant 6,913,971 - Aspar , et al. July 5, 2	2005-07-05
Surface treatment for multi-layer wafers formed from layers of materials chosen from among semiconducting materials App 20050130429 - Rayssac, Olivier ; et al.	2005-06-16
Process for manufacturing a substrate and associated substrate App 20050112885 - Rayssac, Olivier ; et al.	2005-05-26
Detachable substrate or detachable structure and method for the production thereof App 20050029224 - Aspar, Bernard ; et al.	2005-02-10
Semiconductor-on-insulator structure having high-temperature elastic constraints App 20050023610 - Ghyselen, Bruno ; et al.	2005-02-03
Preventive treatment method for a multilayer semiconductor structure App 20050026391 - Ghyselen, Bruno ; et al.	2005-02-03
Methods for preparing a semiconductor assembly App 20050020031 - Letertre, Fabrice ; et al.	2005-01-27
Device and method for cutting an assembly App 20050009297 - Rayssac, Olivier ; et al.	2005-01-13
Substrate cutting device and method App 20050000649 - Rayssac, Olivier ; et al.	2005-01-06
Method for bonding semiconductor structures together App 20040248379 - Maleville, Christophe ; et al.	2004-12-09
Fabrication of substrates with a useful layer of monocrystalline semiconductor material App 20040235268 - Letertre, Fabrice ; et al.	2004-11-25
Method for separating two elements and a device therefor Grant 6,821,376 - Rayssac , et al. November 23, 2	2004-11-23
Detachable substrate with controlled mechanical hold and method for production thereof App 20040222500 - Aspar, Bernard ; et al.	2004-11-11
Methods for forming an assembly for transfer of a useful layer App 20040206444 - Letertre, Fabrice ; et al.	2004-10-21
Semiconductor structure and method of making same App 20040178448 - Rayssac, Olivier ; et al.	2004-09-16
Method of obtaining a self-supported thin semiconductor layer for electronic circuits App 20040175902 - Rayssac, Olivier ; et al.	2004-09-09
Layer transfer method App 20040166649 - Bressot, Severine ; et al.	2004-08-26
Substrate layer cutting device and method App 20040144487 - Martinez, Muriel ; et al.	2004-07-29
Multilayer structure with controlled internal stresses and making same Grant 6,756,285 - Moriceau , et al. June 29, 2	2004-06-29
Method for treating a semiconductor material for subsequent bonding App 20040092084 - Rayssac, Olivier	2004-05-13
Layer transfer methods App 20040082147 - Aspar, Bernard ; et al.	2004-04-29
Fabrication of substrates with a useful layer of monocrystalline semiconductor material App 20030232487 - Letertre, Fabrice ; et al.	2003-12-18
Embrittled substrate and method for making same App 20030077885 - Aspar, Bernard ; et al.	2003-04-24
Selective transfer of elements from one support to another support Grant 6,204,079 - Aspar , et al. March 20, 2	2001-03-20