loadpatents
name:-0.012271165847778
name:-0.0081498622894287
name:-0.0097370147705078
Rawlings; Brandon Patent Filings

Rawlings; Brandon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Rawlings; Brandon.The latest application filed is for "zero-misalignment two-via structures".

Company Profile
10.6.12
  • Rawlings; Brandon - Chandler AZ
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Waveguide connector having a curved array of waveguides configured to connect a package to excitation elements
Grant 11,394,094 - Kamgaing , et al. July 19, 2
2022-07-19
Zero-misalignment two-via structures using photoimageable dielectric film buildup film, and transparent substrate with electroless plating
Grant 11,328,996 - Strong , et al. May 10, 2
2022-05-10
Zero-misalignment Two-via Structures
App 20220084931 - STRONG; Veronica ;   et al.
2022-03-17
Zero-misalignment two-via structures
Grant 11,222,836 - Strong , et al. January 11, 2
2022-01-11
High-density Interconnects For Integrated Circuit Packages
App 20210358855 - Strong; Veronica ;   et al.
2021-11-18
Interconnection Structure Fabrication Using Grayscale Lithography
App 20210343635 - Swan; Johanna ;   et al.
2021-11-04
High-density interconnects for integrated circuit packages
Grant 11,133,263 - Strong , et al. September 28, 2
2021-09-28
Interconnection structure fabrication using grayscale lithography
Grant 11,101,205 - Swan , et al. August 24, 2
2021-08-24
Organic interposers for integrated circuit packages
Grant 10,998,272 - Aleksov , et al. May 4, 2
2021-05-04
High-density Interconnects For Integrated Circuit Packages
App 20210082825 - Strong; Veronica ;   et al.
2021-03-18
Organic Interposers For Integrated Circuit Packages
App 20210082822 - Aleksov; Aleksandar ;   et al.
2021-03-18
Dual Sided Thermal Management Solutions For Integrated Circuit Packages
App 20210080500 - Braunisch; Henning ;   et al.
2021-03-18
Interconnection Structure Fabrication Using Grayscale Lithography
App 20210074620 - Swan; Johanna ;   et al.
2021-03-11
Zero-misalignment Two-via Structures
App 20200294901 - STRONG; Veronica ;   et al.
2020-09-17
Zero-misalignment Two-via Structures Using Photoimageable Dielectric, Buildup Film, And Electrolytic Plating
App 20200258839 - A1
2020-08-13
Zero-misalignment Two-via Structures Using Photoimageable Dielectric Film Buildup Film, And Transparent Substrate With Electrole
App 20200219814 - STRONG; Veronica ;   et al.
2020-07-09
Millimeter Wave Waveguide Connector With Integrated Waveguide Structuring
App 20190190106 - KAMGAING; TELESPHOR ;   et al.
2019-06-20

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed