| Patent | Date |
|---|
High throughput insulation of 3D in-silicon high volumetric energy and power dense energy storage devices
Grant 11,316,154 - Collins , et al. April 26, 2 | 2022-04-26 |
Sacrificial Material Facilitating Protection Of A Substrate In A Qubit Device
App 20220123195 - Adiga; Vivekananda P. ; et al. | 2022-04-21 |
Additive core subtractive liner for metal cut etch processes
Grant 11,276,767 - Bao , et al. March 15, 2 | 2022-03-15 |
Metal Surface Protection
App 20210394229 - Afzali-Ardakani; Ali ; et al. | 2021-12-23 |
Additive core subtractive liner for metal cut etch processes
Grant 11,152,489 - Bao , et al. October 19, 2 | 2021-10-19 |
Transmon qubits with self defined junctions
Grant 11,094,873 - Adiga , et al. August 17, 2 | 2021-08-17 |
Additive core subtractive liner for metal cut etch processes
Grant 11,075,281 - Bao , et al. July 27, 2 | 2021-07-27 |
Microfabricated Air Bridges For Quantum Circuits
App 20210217947 - Adiga; Vivekananda P. ; et al. | 2021-07-15 |
High Throughput Insulation Of 3d In-silicon High Volumetric Energy And Power Dense Energy Storage Devices
App 20210167370 - Collins; John ; et al. | 2021-06-03 |
Selective etch formulation for silicon oxide
Grant 11,024,512 - Afzali-Ardakani , et al. June 1, 2 | 2021-06-01 |
Transmon Qubits With Self Defined Junctions
App 20210151659 - Adiga; Vivekananda ; et al. | 2021-05-20 |
Low Aspect Ratio Interconnect
App 20200328156 - Briggs; Benjamin D. ; et al. | 2020-10-15 |
Low aspect ratio interconnect
Grant 10,672,707 - Briggs , et al. | 2020-06-02 |
Interconnect structures with fully aligned vias
Grant 10,607,933 - Edelstein , et al. | 2020-03-31 |
Additive core subtractive liner for metal cut etch processes
Grant 10,600,884 - Bao , et al. | 2020-03-24 |
Additive Core Subtractive Liner For Metal Cut Etch Processes
App 20200083350 - Bao; Ruqiang ; et al. | 2020-03-12 |
Additive Core Subtractive Liner For Metal Cut Etch Processes
App 20200083349 - Bao; Ruqiang ; et al. | 2020-03-12 |
Interconnect Structures With Fully Aligned Vias
App 20190157201 - Edelstein; Daniel C. ; et al. | 2019-05-23 |
Low Aspect Ratio Interconnect
App 20190148296 - Briggs; Benjamin D. ; et al. | 2019-05-16 |
Wet etch removal of Ru selective to other metals
Grant 10,242,909 - Briggs , et al. | 2019-03-26 |
Low aspect ratio interconnect
Grant 10,211,153 - Briggs , et al. Feb | 2019-02-19 |
Interconnect structures with fully aligned vias
Grant 10,204,856 - Edelstein , et al. Feb | 2019-02-12 |
Processes for uniform metal semiconductor alloy formation for front side contact metallization and photovoltaic device formed therefrom
Grant 10,170,644 - Fisher , et al. J | 2019-01-01 |
WET ETCH REMOVAL OF Ru SELECTIVE TO OTHER METALS
App 20180323151 - Briggs; Benjamin D. ; et al. | 2018-11-08 |
Semiconductor device formed by wet etch removal of Ru selective to other metals
Grant 10,090,247 - Briggs , et al. October 2, 2 | 2018-10-02 |
Additive Core Subtractive Liner For Metal Cut Etch Processes
App 20180269306 - Bao; Ruqiang ; et al. | 2018-09-20 |
Additive Core Subtractive Liner For Metal Cut Etch Processes
App 20180269305 - Bao; Ruqiang ; et al. | 2018-09-20 |
Self aligned contact structure
Grant 10,074,562 - Orozco-Teran , et al. September 11, 2 | 2018-09-11 |
Patterning magnetic films using self-stop electro-etching
Grant 10,049,802 - O'Sullivan , et al. August 14, 2 | 2018-08-14 |
Enhanced defect reduction for heteroepitaxy by seed shape engineering
Grant 10,043,663 - Cheng , et al. August 7, 2 | 2018-08-07 |
Selective and non-selective barrier layer wet removal
Grant 10,002,831 - Briggs , et al. June 19, 2 | 2018-06-19 |
Barrier Planarization For Interconnect Metallization
App 20180114718 - Briggs; Benjamin D. ; et al. | 2018-04-26 |
Barrier Planarization For Interconnect Metallization
App 20180114719 - Briggs; Benjamin D. ; et al. | 2018-04-26 |
Patterning Magnetic Films Using Self-stop Electro-etching
App 20180102207 - O'Sullivan; Eugene J. ; et al. | 2018-04-12 |
Interconnect Structures With Fully Aligned Vias
App 20180102317 - Edelstein; Daniel C. ; et al. | 2018-04-12 |
Interconnect structures with fully aligned vias
Grant 9,911,690 - Edelstein , et al. March 6, 2 | 2018-03-06 |
Low Aspect Ratio Interconnect
App 20180061761 - Briggs; Benjamin D. ; et al. | 2018-03-01 |
Barrier planarization for interconnect metallization
Grant 9,881,833 - Briggs , et al. January 30, 2 | 2018-01-30 |
Selective And Non-selective Barrier Layer Wet Removal
App 20170317026 - Briggs; Benjamin D. ; et al. | 2017-11-02 |
Selective and non-selective barrier layer wet removal
Grant 9,806,023 - Briggs , et al. October 31, 2 | 2017-10-31 |
Selective And Non-selective Barrier Layer Wet Removal
App 20170301624 - Briggs; Benjamin D. ; et al. | 2017-10-19 |
Patterning magnetic films using self-stop electro-etching
Grant 9,735,224 - O'Sullivan , et al. August 15, 2 | 2017-08-15 |
Processes For Uniform Metal Semiconductor Alloy Formation For Front Side Contact Metallization And Photovoltaic Device Formed Therefrom
App 20170200838 - Fisher; Kathryn C. ; et al. | 2017-07-13 |
Selective and non-selective barrier layer wet removal
Grant 9,685,406 - Briggs , et al. June 20, 2 | 2017-06-20 |
Enhanced Defect Reduction For Heteroepitaxy By Seed Shape Engineering
App 20170140919 - Cheng; Cheng-Wei ; et al. | 2017-05-18 |
Processes for uniform metal semiconductor alloy formation for front side contact metallization and photovoltaic device formed therefrom
Grant 9,608,134 - Fisher , et al. March 28, 2 | 2017-03-28 |
Enhanced defect reduction for heteroepitaxy by seed shape engineering
Grant 9,564,494 - Cheng , et al. February 7, 2 | 2017-02-07 |
Self-aligned contact structure
Grant 9,548,244 - Orozco-Teran , et al. January 17, 2 | 2017-01-17 |
Self Aligned Contact Structure
App 20160336266 - Orozco-Teran; Rosa A. ; et al. | 2016-11-17 |
Interconnect Structures With Fully Aligned Vias
App 20160163640 - Edelstein; Daniel C. ; et al. | 2016-06-09 |
Interconnect structures with fully aligned vias
Grant 9,324,650 - Edelstein , et al. April 26, 2 | 2016-04-26 |
Multimetal Interlayer Interconnects
App 20160071791 - Huang; Elbert E. ; et al. | 2016-03-10 |
Interconnect Structures With Fully Aligned Vias
App 20160049364 - Edelstein; Daniel C. ; et al. | 2016-02-18 |
Self-aligned contact structure
Grant 9,252,053 - Orozco-Teran , et al. February 2, 2 | 2016-02-02 |
Self-aligned Contact Structure
App 20150371948 - Orozco-Teran; Rosa A. ; et al. | 2015-12-24 |
Selective Etch Chemistry For Gate Electrode Materials
App 20150275376 - Fitzsimmons; John A. ; et al. | 2015-10-01 |
Self-aligned Contact Structure
App 20150200137 - Orozco-Teran; Rosa A. ; et al. | 2015-07-16 |
Selective etch chemistry for gate electrode materials
Grant 9,070,625 - Fitzsimmons , et al. June 30, 2 | 2015-06-30 |
Processes For Uniform Metal Semiconductor Alloy Formation For Front Side Contact Metallization And Photovoltaic Device Formed Therefrom
App 20150136228 - Fisher; Kathryn C. ; et al. | 2015-05-21 |
Processes for uniform metal semiconductor alloy formation for front side contact metallization and photovoltaic device formed therefrom
Grant 8,969,122 - Fisher , et al. March 3, 2 | 2015-03-03 |
Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formed
Grant 8,927,087 - Chen , et al. January 6, 2 | 2015-01-06 |
Titanium-Nitride Removal
App 20140312265 - Chen; Shyng-Tsong ; et al. | 2014-10-23 |
Self-aligned contacts
Grant 8,853,076 - Fan , et al. October 7, 2 | 2014-10-07 |
Titanium-nitride removal
Grant 8,835,326 - Fitzsimmons , et al. September 16, 2 | 2014-09-16 |
Bonding Of Substrates Including Metal-dielectric Patterns With Metal Raised Above Dielectric And Structures So Formed
App 20140097543 - Chen; Kuan-Neng ; et al. | 2014-04-10 |
Self-aligned Contacts
App 20140070282 - Fan; Su Chen ; et al. | 2014-03-13 |
Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formed
Grant 8,617,689 - Chen , et al. December 31, 2 | 2013-12-31 |
Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formed
Grant 08617689 - | 2013-12-31 |
Bonding Of Substrates Including Metal-dielectric Patterns With Metal Raised Above Dielectric And Structures So Formed
App 20130307139 - Chen; Kuan-Neng ; et al. | 2013-11-21 |
Titanium Nitride Removal
App 20130200040 - Fitzsimmons; John A. ; et al. | 2013-08-08 |
Selective Etch Chemistry For Gate Electrode Materials
App 20130203231 - Fitzsimmons; John A. ; et al. | 2013-08-08 |
Homogeneous porous low dielectric constant materials
Grant 8,492,239 - Bruce , et al. July 23, 2 | 2013-07-23 |
Titanium-Nitride Removal
App 20130171829 - Fitzsimmons; John A. ; et al. | 2013-07-04 |
Homogeneous Porous Low Dielectric Constant Materials
App 20120329273 - Bruce; Robert L. ; et al. | 2012-12-27 |
Processes For Uniform Metal Semiconductor Alloy Formation For Front Side Contact Metallization And Photovoltaic Device Formed Therefrom
App 20120318341 - Fisher; Kathryn C. ; et al. | 2012-12-20 |
Capping of copper interconnect lines in integrated circuit devices
Grant 8,298,948 - Bonilla , et al. October 30, 2 | 2012-10-30 |
Bonding of substrates including metal-dielectric patterns with metal raised above dielectric
Grant 8,241,995 - Chen , et al. August 14, 2 | 2012-08-14 |
Method For Patterning Magnetic Films
App 20110272287 - Duch; Elizabeth A. ; et al. | 2011-11-10 |
Air gap structure having protective metal silicide pads on a metal feature
Grant 8,003,520 - Bonilla , et al. August 23, 2 | 2011-08-23 |
Method for fabricating self-aligned nanostructure using self-assembly block copolymers, and structures fabricated therefrom
Grant 7,993,816 - Black , et al. August 9, 2 | 2011-08-09 |
Gap free anchored conductor and dielectric structure and method for fabrication thereof
Grant 7,985,928 - Bolom , et al. July 26, 2 | 2011-07-26 |
Method for kinetically controlled etching of copper
Grant 7,976,723 - Rath , et al. July 12, 2 | 2011-07-12 |
Conductor-dielectric structure and method for fabricating
Grant 7,960,276 - Ponoth , et al. June 14, 2 | 2011-06-14 |
Capping of Copper Interconnect Lines in Integrated Circuit Devices
App 20110108990 - Bonilla; Griselda ; et al. | 2011-05-12 |
Air Gap Structure Having Protective Metal Silicide Pads On A Metal Feature
App 20110092067 - Bonilla; Griselda ; et al. | 2011-04-21 |
Air gap structure having protective metal silicide pads on a metal feature
Grant 7,884,477 - Bonilla , et al. February 8, 2 | 2011-02-08 |
Bonding Of Substrates Including Metal-dielectric Patterns With Metal Raised Above Dielectric
App 20100255262 - Chen; Kuan-Neng ; et al. | 2010-10-07 |
Oxidant and passivant composition and method for use in treating a microelectronic structure
Grant 7,670,497 - Fitzsimmons , et al. March 2, 2 | 2010-03-02 |
Method For Fabricating Self-aligned Nanostructure Using Self-assembly Block Copolymers, And Structures Fabricated Therefrom
App 20090233236 - Black; Charles T. ; et al. | 2009-09-17 |
Gap Free Anchored Conductor And Dielectric Structure And Method For Fabrication Thereof
App 20090151981 - Bolom; Tibor ; et al. | 2009-06-18 |
Air Gap Structure Having Protective Metal Silicide Pads On A Metal Feature
App 20090140428 - Bonilla; Griselda ; et al. | 2009-06-04 |
Method for isotropic etching of copper
Grant 7,537,709 - Cooper , et al. May 26, 2 | 2009-05-26 |
Interconnect Structure And Method Of Making Same
App 20090127711 - Bonilla; Griselda ; et al. | 2009-05-21 |
Structure and method of chemically formed anchored metallic vias
Grant 7,517,736 - Mehta , et al. April 14, 2 | 2009-04-14 |
Oxidant And Passivant Composition And Method For Use In Treating A Microelectronic Structure
App 20090008361 - Fitzsimmons; John A. ; et al. | 2009-01-08 |
Method For Kinetically Controlled Etching Of Copper
App 20080286701 - Rath; David L. ; et al. | 2008-11-20 |
Structure And Method Of Chemically Formed Anchored Metallic Vias
App 20080012142 - Mehta; Sanjay C. ; et al. | 2008-01-17 |
Maintaining uniform CMP hard mask thickness
Grant 7,253,098 - Chen , et al. August 7, 2 | 2007-08-07 |
Post-etch removal of fluorocarbon-based residues from a hybrid dielectric structure
App 20070059922 - Clevenger; Lawrence A. ; et al. | 2007-03-15 |
Method for isotropic etching of copper
App 20060183056 - Cooper; Emanuel I. ; et al. | 2006-08-17 |
Copper recess process with application to selective capping and electroless plating
Grant 7,064,064 - Chen , et al. June 20, 2 | 2006-06-20 |
Material and process for etched structure filling and planarizing
App 20060089000 - Della Guardia; Ronald A. ; et al. | 2006-04-27 |
Maintaining Uniform Cmp Hard Mask Thickness
App 20060043590 - Chen; Steven Shyng-Tsong T. ; et al. | 2006-03-02 |
Copper recess process with application to selective capping and electroless plating
Grant 6,975,032 - Chen , et al. December 13, 2 | 2005-12-13 |
Self-aligned mask to reduce cell layout area
Grant 6,974,770 - Costrini , et al. December 13, 2 | 2005-12-13 |
Copper recess process with application to selective capping and electroless plating
App 20050158985 - Chen, Shyng-Tsong ; et al. | 2005-07-21 |
Stabilization of fluorine-containing dielectric materials in a metal insulator wiring structure
Grant 6,911,378 - Conti , et al. June 28, 2 | 2005-06-28 |
Method for isotropic etching of copper
App 20050056616 - Cooper, Emanuel I. ; et al. | 2005-03-17 |
Stabilization Of Fluorine-containing Dielectric Materials In A Metal Insulator Wiring Structure
App 20040266140 - Conti, Richard A. ; et al. | 2004-12-30 |
Self-aligned mask to reduce cell layout area
App 20040259358 - Costrini, Gregory ; et al. | 2004-12-23 |
Copper recess process with application to selective capping and electroless plating
App 20040113279 - Chen, Shyng-Tsong ; et al. | 2004-06-17 |
Apparatus and method for wet cleaning
Grant 6,584,989 - Taft , et al. July 1, 2 | 2003-07-01 |
Apparatus and method for wet cleaning
App 20020148485 - Taft, Charles J. ; et al. | 2002-10-17 |
Removal of dielectric oxides
Grant 6,200,891 - Jagannathan , et al. March 13, 2 | 2001-03-13 |
Removal of silicon oxide
Grant 6,117,796 - Gale , et al. September 12, 2 | 2000-09-12 |
Etching of silicon nitride
Grant 6,066,267 - Rath , et al. May 23, 2 | 2000-05-23 |
Method for cleaning semiconductor devices
Grant 5,962,384 - Cooper , et al. October 5, 1 | 1999-10-05 |
Control of gas content in process liquids for improved megasonic cleaning of semiconductor wafers and microelectronics substrates
Grant 5,800,626 - Cohen , et al. September 1, 1 | 1998-09-01 |
Inductive head lamination with layer of magnetic quenching material
Grant 5,576,099 - Canaperi , et al. * November 19, 1 | 1996-11-19 |
Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate
Grant 5,074,969 - Brewer , et al. December 24, 1 | 1991-12-24 |
Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate
Grant 5,038,195 - Brewer , et al. August 6, 1 | 1991-08-06 |
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