Ratell; Joseph M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ratell; Joseph M..The latest application filed is for "liquid cooled power electronic circuit comprising stacked direct die cooled packages".

Company Profile

0.5.3

Ratell; Joseph M. - Indianapolis IN
Ratell; Joseph M. - Fremont CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Liquid cooled power electronic circuit comprising stacked direct die cooled packages Grant 7,608,924 - Myers , et al. October 27, 2	2009-10-27
Electronic enclosure with continuous ground contact surface Grant 7,563,992 - Lawlyes , et al. July 21, 2	2009-07-21
Liquid cooled power electronic circuit comprising stacked direct die cooled packages App 20080272485 - Myers; Bruce A. ; et al.	2008-11-06
Electronic enclosure with continuous ground contact surface App 20080066956 - Lawlyes; Daniel A. ; et al.	2008-03-20
Method of making thick film pressure and temperature sensors on a stainless steel diaphragm Grant 6,725,514 - Moyer , et al. April 27, 2	2004-04-27
Method of making thick film pressure and temperature sensors on a stainless steel diaphragm App 20030221302 - Moyer, James I. ; et al.	2003-12-04
Novel designs for packaging circuit protection devices Grant 4,647,894 - Ratell March 3, 1	1987-03-03
Materials for packaging circuit protection devices Grant 4,647,896 - Ratell March 3, 1	1987-03-03

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