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Patent applications and USPTO patent grants for Ratchkov; Radoslav.The latest application filed is for "donut power mesh scheme for flip chip package".
Patent | Date |
---|---|
Bowtie and T-shaped structures of L-shaped mesh implementation Grant 6,835,972 - Ratchkov , et al. December 28, 2 | 2004-12-28 |
Donut power mesh scheme for flip chip package Grant 6,781,228 - Ishikawa , et al. August 24, 2 | 2004-08-24 |
Donut power mesh scheme for flip chip package App 20040135263 - Ishikawa, Hiroshi ;   et al. | 2004-07-15 |
Bowtie and T-shaped structures of L-shaped mesh implementation App 20040129955 - Ratchkov, Radoslav ;   et al. | 2004-07-08 |
Termination Ring For Integrated Circuit App 20040124521 - Al-Dabagh, Maad ;   et al. | 2004-07-01 |
Termination ring for integrated circuit Grant 6,747,349 - Al-Dabagh , et al. June 8, 2 | 2004-06-08 |
Interleaved termination ring Grant 6,744,081 - Ratchkov , et al. June 1, 2 | 2004-06-01 |
Interleaved Termination Ring App 20040085099 - Ratchkov, Radoslav ;   et al. | 2004-05-06 |
Wire bond package with core ring formed over I/O cells Grant 6,674,176 - Ratchkov January 6, 2 | 2004-01-06 |
Wire bond package with core ring formed over I/O cells App 20030155633 - Ratchkov, Radoslav | 2003-08-21 |
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