loadpatents
name:-0.008120059967041
name:-0.0070109367370605
name:-0.00061583518981934
Ratchkov; Radoslav Patent Filings

Ratchkov; Radoslav

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ratchkov; Radoslav.The latest application filed is for "donut power mesh scheme for flip chip package".

Company Profile
0.5.5
  • Ratchkov; Radoslav - Santa Clara CA
  • Ratchkov; Radoslav - San Jose CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Bowtie and T-shaped structures of L-shaped mesh implementation
Grant 6,835,972 - Ratchkov , et al. December 28, 2
2004-12-28
Donut power mesh scheme for flip chip package
Grant 6,781,228 - Ishikawa , et al. August 24, 2
2004-08-24
Donut power mesh scheme for flip chip package
App 20040135263 - Ishikawa, Hiroshi ;   et al.
2004-07-15
Bowtie and T-shaped structures of L-shaped mesh implementation
App 20040129955 - Ratchkov, Radoslav ;   et al.
2004-07-08
Termination Ring For Integrated Circuit
App 20040124521 - Al-Dabagh, Maad ;   et al.
2004-07-01
Termination ring for integrated circuit
Grant 6,747,349 - Al-Dabagh , et al. June 8, 2
2004-06-08
Interleaved termination ring
Grant 6,744,081 - Ratchkov , et al. June 1, 2
2004-06-01
Interleaved Termination Ring
App 20040085099 - Ratchkov, Radoslav ;   et al.
2004-05-06
Wire bond package with core ring formed over I/O cells
Grant 6,674,176 - Ratchkov January 6, 2
2004-01-06
Wire bond package with core ring formed over I/O cells
App 20030155633 - Ratchkov, Radoslav
2003-08-21

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