| Patent | Date |
|---|
Methods of utilizing low temperature solder assisted mounting techniques for package structures
Grant 11,417,592 - Karhade , et al. August 16, 2 | 2022-08-16 |
Multi-chip packages and sinterable paste for use with thermal interface materials
Grant 11,404,349 - Raravikar , et al. August 2, 2 | 2022-08-02 |
Heat Spreader Edge Standoffs For Managing Bondline Thickness In Microelectronic Packages
App 20210305118 - Thanu; Dinesh P. R. ; et al. | 2021-09-30 |
Methods Of Utilizing Low Temperature Solder Assisted Mounting Techniques For Package Structures
App 20210287974 - Karhade; Omkar G. ; et al. | 2021-09-16 |
Heat spreader edge standoffs for managing bondline thickness in microelectronic packages
Grant 11,062,970 - Thanu , et al. July 13, 2 | 2021-07-13 |
Varied Ball Ball-grid-array (bga) Packages
App 20210082798 - LU; Xiao ; et al. | 2021-03-18 |
Method and materials for warpage thermal and interconnect solutions
Grant 10,672,626 - Karhade , et al. | 2020-06-02 |
Systems and methods for electromagnetic interference shielding
Grant 10,615,128 - Dias , et al. | 2020-04-07 |
Systems, methods, and apparatuses for implementing a thermal solution for 3D packaging
Grant 10,607,909 - Muthur Srinath , et al. | 2020-03-31 |
LPS solder paste based low cost fine pitch pop interconnect solutions
Grant 10,586,779 - Raravikar , et al. | 2020-03-10 |
Sintered solder for fine pitch first-level interconnect (FLI) applications
Grant 10,515,914 - Oka , et al. Dec | 2019-12-24 |
Semiconductor package with electromagnetic interference shielding
Grant 10,461,007 - Dias , et al. Oc | 2019-10-29 |
Multi-chip Packages And Sinterable Paste For Use With Thermal Interface Materials
App 20190267306 - RARAVIKAR; Nachiket R. ; et al. | 2019-08-29 |
Sintered Solder For Fine Pitch First-level Interconnect (fli) Applications
App 20190157225 - OKA; Mihir A. ; et al. | 2019-05-23 |
Compressible Media Applicator, Application System And Methods For Same
App 20190099776 - Hackenberg; Ken P. ; et al. | 2019-04-04 |
Compressible Media Applicator, Application System And Methods For Same
App 20190099777 - Hackenberg; Ken P. ; et al. | 2019-04-04 |
Sintered solder for fine pitch first-level interconnect (FLI) applications
Grant 10,224,299 - Oka , et al. | 2019-03-05 |
Heat Spreader Edge Standoffs For Managing Bondline Thickness In Microelectronic Packages
App 20190067153 - Thanu; Dinesh P. R. ; et al. | 2019-02-28 |
Systems, Methods, And Apparatuses For Implementing A Thermal Solution For 3d Packaging
App 20190043772 - MUTHUR SRINATH; Purushotham Kaushik ; et al. | 2019-02-07 |
Computing system with a thermal interface comprising magnetic particles
Grant 10,181,432 - Limaye , et al. Ja | 2019-01-15 |
Electromagnetic interference shielding for system-in-package technology
Grant 10,163,810 - Li , et al. Dec | 2018-12-25 |
Semiconductor Package With Electromagnetic Interference Shielding
App 20180323128 - Dias; Rajendra C. ; et al. | 2018-11-08 |
Adhesive Polymer Thermal Interface Material With Sintered Fillers For Thermal Conductivity In Micro-electronic Packaging
App 20180323130 - LIU; Boxi ; et al. | 2018-11-08 |
Computing System With A Thermal Interface Comprising Magnetic Particles
App 20180269128 - Limaye; Ameya ; et al. | 2018-09-20 |
Systems And Methods For Electromagnetic Interference Shielding
App 20180226358 - Dias; Rajendra C. ; et al. | 2018-08-09 |
Sintered Solder For Fine Pitch First-level Interconnect (fli) Applications
App 20180190604 - OKA; Mihir A. ; et al. | 2018-07-05 |
Systems and methods for electromagnetic interference shielding
Grant 9,953,929 - Dias , et al. April 24, 2 | 2018-04-24 |
Space transformer with perforated metallic plate for electrical die test
Grant 9,941,652 - Raravikar , et al. April 10, 2 | 2018-04-10 |
Energy Storage Material For Thermal Management And Associated Techniques And Configurations
App 20180068926 - KRAJNIAK; JAN ; et al. | 2018-03-08 |
Lps Solder Paste Based Low Cost Fine Pitch Pop Interconnect Solutions
App 20180047693 - RARAVIKAR; Nachiket R. ; et al. | 2018-02-15 |
LPS solder paste based low cost fine pitch pop interconnect solutions
Grant 9,831,206 - Raravikar , et al. November 28, 2 | 2017-11-28 |
Electronic Assembly Components With Corner Adhesive For Warpage Reduction During Thermal Processing
App 20170287873 - Sankarasubramanian; Santosh ; et al. | 2017-10-05 |
Systems And Methods For Eloectromagnetic Interference Shielding
App 20170271270 - Dias; Rajendra C. ; et al. | 2017-09-21 |
Novel Method And Materials For Warpage Thermal And Interconnect Solutions
App 20170200621 - KARHADE; Omkar G. ; et al. | 2017-07-13 |
Electromagnetic interference shielding for system-in-package technology
App 20170186699 - Li; Eric J. ; et al. | 2017-06-29 |
Space Transformer Including A Perforated Mold Preform For Electrical Die Test
App 20170176496 - Mathkar; Akshay ; et al. | 2017-06-22 |
Space Transformer With Perforated Metallic Plate For Electrical Die Test
App 20170176518 - Raravikar; Nachiket R. ; et al. | 2017-06-22 |
Adhesive With Tunable Adhesion For Handling Ultra-thin Wafer
App 20170140971 - RARAVIKAR; NACHIKET R. ; et al. | 2017-05-18 |
Method and materials for warpage thermal and interconnect solutions
Grant 9,607,964 - Karhade , et al. March 28, 2 | 2017-03-28 |
Flexible underfill compositions for enhanced reliability
Grant 9,458,283 - Xu , et al. October 4, 2 | 2016-10-04 |
Flexible Underfill Compositions For Enhanced Reliability
App 20150284503 - XU; Dingying ; et al. | 2015-10-08 |
Novel Method And Materials For Warpage Thermal And Interconnect Solutions
App 20150279805 - KARHADE; Omkar G. ; et al. | 2015-10-01 |
Lps Solder Paste Based Low Cost Fine Pitch Pop Interconnect Solutions
App 20150279804 - RARAVIKAR; Nachiket R. ; et al. | 2015-10-01 |
Integrated microelectronic package temperature sensor
Grant 9,028,142 - Raravikar , et al. May 12, 2 | 2015-05-12 |
Epoxy-amine underfill materials for semiconductor packages
Grant 8,916,981 - Xiu , et al. December 23, 2 | 2014-12-23 |
Epoxy-amine Underfill Materials For Semiconductor Packages
App 20140332966 - Xiu; Yonghao ; et al. | 2014-11-13 |
Electronic Packages and Components Thereof Formed by Co-Deposited Carbon Nanotubes
App 20140231265 - Wakharkar; Vijay S. ; et al. | 2014-08-21 |
Nanolithographic method of manufacturing an embedded passive device for a microelectronic application, and microelectronic device containing same
Grant 8,724,290 - Raravikar , et al. May 13, 2 | 2014-05-13 |
Deflection Sensor For In-situ Deflection Measurement In Semiconductor Devices
App 20140013855 - FARAHANI; Mohammad M. ; et al. | 2014-01-16 |
Stress sensor for in-situ measurement of package-induced stress in semiconductor devices
Grant 8,586,393 - Farahani , et al. November 19, 2 | 2013-11-19 |
Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die
Grant 8,569,108 - Xu , et al. October 29, 2 | 2013-10-29 |
Method for reducing contact resistance of a thermally and electrically conductive structure comprising carbon nanotube
Grant 8,409,665 - Shekhawat , et al. April 2, 2 | 2013-04-02 |
Coating For A Microelectronic Device, Treatment Comprising Same,and Method Of Managing A Thermal Profile Of A Microelectronic Die
App 20130017650 - Xu; Dingying ; et al. | 2013-01-17 |
Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die
Grant 8,287,996 - Xu , et al. October 16, 2 | 2012-10-16 |
Integrated Microelectronic Package Temperature Sensor
App 20120199830 - Raravikar; Nachiket R. ; et al. | 2012-08-09 |
Stress Sensor For In-situ Measurement Of Package-induced Stress In Semiconductor Devices
App 20120193734 - Farahani; Mohammad M. ; et al. | 2012-08-02 |
Thermally And Electrically Conductive Structure, Method Of Applying A Carbon Coating To Same, And Method Of Reducing A Contact Resistance Of Same
App 20120141664 - Shekhawat; Linda A. ; et al. | 2012-06-07 |
Stress sensor for in-situ measurement of package-induced stress in semiconductor devices
Grant 8,174,084 - Farahani , et al. May 8, 2 | 2012-05-08 |
Thermally and electrically conductive structure comprising a carbon nanotube and a carbon coating, and method of reducing a contact resistance of same
Grant 8,133,585 - Shekhawat , et al. March 13, 2 | 2012-03-13 |
Nanolithographic method of manufacturing an embedded passive device for a microelectronic application, and microelectronic device containing same
Grant 8,068,328 - Raravikar , et al. November 29, 2 | 2011-11-29 |
Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die
App 20110151624 - Xu; Dingying ; et al. | 2011-06-23 |
Self-healing Thermal Interface Materials For Semiconductor Packages
App 20100264536 - Shankar; Ravi ; et al. | 2010-10-21 |
Method to fabricate self-healing material
Grant 7,799,849 - Raravikar , et al. September 21, 2 | 2010-09-21 |
In-situ functionalization of carbon nanotubes
Grant 7,700,943 - Raravikar , et al. April 20, 2 | 2010-04-20 |
Through-die metal vias with a dispersed phase of graphitic structures of carbon for reduced thermal expansion and increased electrical conductance
Grant 7,666,768 - Raravikar , et al. February 23, 2 | 2010-02-23 |
Thermally and electrically conductive structure, method of applying a carbon coating to same, and method of reducing a contact resistance of same
App 20100035063 - Shekhawat; Linda A. ; et al. | 2010-02-11 |
Self-healing Thermal Interface Materials For Semiconductor Packages
App 20090321922 - Shankar; Ravi ; et al. | 2009-12-31 |
Thermally and electrically conductive structure, method of applying a carbon coating to same, and method of reducing a contact resistance of same
Grant 7,618,679 - Shekhawat , et al. November 17, 2 | 2009-11-17 |
Nanolithographic Method Of Manufacturing An Embedded Passive Device For A Microelectronic Application, And Microelectronic Device Containing Same
App 20090231777 - Raravikar; Nachiket R. ; et al. | 2009-09-17 |
Carbon nanotube-based stress sensor
Grant 7,553,681 - Raravikar , et al. June 30, 2 | 2009-06-30 |
Thermally And Electrically Conductive Structure, Method Of Applying A Carbon Coating To Same, And Method Of Reducing A Contact Resistance Of Same
App 20090061125 - Shekhawat; Linda A. ; et al. | 2009-03-05 |
Method To Fabricate Self-healing Material
App 20090005486 - Raravikar; Nachiket R. ; et al. | 2009-01-01 |
In-situ functionalization of carbon nanotubes
Grant 7,465,605 - Raravikar , et al. December 16, 2 | 2008-12-16 |
In-situ Functionalization Of Carbon Nanotubes
App 20080305321 - Raravikar; Nachiket R. ; et al. | 2008-12-11 |
Microelectronic die having nano-particle containing passivation layer and package including same
App 20080237822 - Raravikar; Nachiket R. ; et al. | 2008-10-02 |
Nanostructure-Based Package Interconnect
App 20080185718 - Suh; Daewoong ; et al. | 2008-08-07 |
Nanostructure-based package interconnect
Grant 7,371,674 - Suh , et al. May 13, 2 | 2008-05-13 |
Through-die metal vias with a dispersed phase of graphitic structures of carbon for reduced thermal expansion and increased electrical conductance
App 20080081386 - Raravikar; Nachiket R. ; et al. | 2008-04-03 |
Stress sensor for in-situ measurement of package-induced stress in semiconductor devices
App 20080067619 - Farahani; Mohammad M. ; et al. | 2008-03-20 |
Integrated microelectronic package temperature sensor
App 20080002755 - Raravikar; Nachiket R. ; et al. | 2008-01-03 |
Integrated microelectronic package stress sensor
App 20070298525 - Raravikar; Nachiket R. ; et al. | 2007-12-27 |
Carbon nanotube-based stress sensor
App 20070222472 - Raravikar; Nachiket R. ; et al. | 2007-09-27 |
Nanostructure-based package interconnect
App 20070148949 - Suh; Daewoong ; et al. | 2007-06-28 |
In-situ functionalization of carbon nanotubes
App 20070134599 - Raravikar; Nachiket R. ; et al. | 2007-06-14 |
Ultrafast all-optical switch using carbon nanotube polymer composites
Grant 6,782,154 - Zhao , et al. August 24, 2 | 2004-08-24 |
Ultrafast all-optical switch using carbon nanotube polymer composites
App 20020176650 - Zhao, Yiping ; et al. | 2002-11-28 |
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