Rapp; Robert J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Rapp; Robert J..The latest application filed is for "essential element management".

Company Profile

4.6.12

Rapp; Robert J. - San Jose CA US
Rapp; Robert J - San Jose CA
Rapp; Robert J. - Davie FL
Rapp; Robert J - Lake Forest CA
Rapp; Robert J. - Lake Forest CA
Rapp; Robert J. - Hospodor; Andrew D.
Rapp, Robert J. - Simpsonville SC

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Essential Element Management App 20210077557 - Hospodor; Andrew D.	2021-03-18
Essential element management Grant 10,849,949 - Hospodor , et al. December 1, 2	2020-12-01
Essential Element Management App 20190030100 - Hospodor; Andrew D ; et al.	2019-01-31
Social Media Ecosystem App 20180181986 - Rapp; Robert J. ; et al.	2018-06-28
Essential element management Grant 9,155,767 - Hospodor , et al. October 13, 2	2015-10-13
Essential Element Management App 20140113010 - Hospodor; Andrew D. ; et al.	2014-04-24
Electronic package whereby an electronic assembly is packaged within an enclosure that is designed to act as a heat pipe Grant 7,679,911 - Rapp March 16, 2	2010-03-16
3 dimensional layered flex circuit electronic assembly designed to maximize the cooling of electronics that are contained within the assembly such that the component density within said electronic assembly can be maximized Grant 7,626,817 - Rapp December 1, 2	2009-12-01
Electronic package whereby an electronic assembly is packaged within an enclosure that is designed to act as a heat pipe App 20090073657 - Rapp; Robert J.	2009-03-19
Computer or digital device data encryption/decryption performed by using a random analog source App 20080025504 - Rapp; Robert James ; et al.	2008-01-31
3 dimensional layered flex circuit electronic assembly designed to maximize the cooling of electronics that are contained within the assembly such that the component density within said electronic assembly can be maximized App 20060273814 - Rapp; Robert J.	2006-12-07
Electronic package whereby an electronic assembly is packaged within an enclosure that is designed to act as a heat pipe App 20060274502 - Rapp; Robert J.	2006-12-07
Packaging methodology for adding functionality to a data storage device (disk drive, tape drive, other storage device, or storage subsystem) while maintaining the same form factor, standard size, or allocated size; or by increasing the overall package size to a larger form factor, standard size, or App 20060075414 - Rapp; Robert James ; et al.	2006-04-06
Seal cover for shaft assembly App 20020004975 - Rapp, Robert J.	2002-01-17

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