Raorane; Digvijay

Patent Applications and Registrations

Patent applications and USPTO patent grants for Raorane; Digvijay.The latest application filed is for "dummy die structures of a packaged integrated circuit device".

Company Profile

5.7.15

Raorane; Digvijay - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Dummy Die Structures Of A Packaged Integrated Circuit Device App 20220102242 - Modi; Mitul ; et al.	2022-03-31
Dummy Die In A Recessed Mold Structure Of A Packaged Integrated Circuit Device App 20220102231 - Modi; Mitul ; et al.	2022-03-31
Die with embedded communication cavity Grant 11,239,186 - Raorane , et al. February 1, 2	2022-02-01
Semiconductor package with electromagnetic interference shielding using metal layers and vias Grant 11,189,573 - Nair , et al. November 30, 2	2021-11-30
Method to achieve variable dielectric thickness in packages for better electrical performance Grant 11,145,583 - Raorane , et al. October 12, 2	2021-10-12
Open Cavity Bridge Power Delivery Architectures And Processes App 20210305133 - KARHADE; Omkar ; et al.	2021-09-30
Open Cavity Bridge Co-planar Placement Architectures And Processes App 20210305132 - KARHADE; Omkar ; et al.	2021-09-30
Die with embedded communication cavity Grant 11,128,029 - Nair , et al. September 21, 2	2021-09-21
Ic Package Including Multi-chip Unit With Bonded Integrated Heat Spreader App 20210242104 - Mallik; Debendra ; et al.	2021-08-05
IC package including multi-chip unit with bonded integrated heat spreader Grant 11,011,448 - Mallik , et al. May 18, 2	2021-05-18
Ic Package Including Multi-chip Unit With Bonded Integrated Heat Spreader App 20210035881 - Mallik; Debendra ; et al.	2021-02-04
Nested Architectures For Enhanced Heterogeneous Integration App 20200286814 - MAHAJAN; Ravindranath ; et al.	2020-09-10
Microelectronic Assemblies App 20200006166 - Raorane; Digvijay ; et al.	2020-01-02
Package Stiffening Magnetic Core App 20200006250 - Hill; Michael J. ; et al.	2020-01-02
Method To Achieve Variable Dielectric Thickness In Packages For Better Electrical Performance App 20190341342 - RAORANE; Digvijay ; et al.	2019-11-07
Semiconductor Package With Electromagnetic Interference Shielding Using Metal Layers And Vias App 20190019764 - NAIR; Vijay K. ; et al.	2019-01-17
Electronic package with corner supports Grant 9,721,906 - Dubey , et al. August 1, 2	2017-08-01
Electronic Package With Corner Supports App 20170062356 - Dubey; Manish ; et al.	2017-03-02
Method of forming a deep trench in a substrate Grant 8,158,522 - Sirajuddin , et al. April 17, 2	2012-04-17
Method Of Filling A Deep Trench In A Substrate App 20110217832 - Raorane; Digvijay ; et al.	2011-09-08
Method Of Forming A Deep Trench In A Substrate App 20110201205 - Sirajuddin; Khalid M. ; et al.	2011-08-18

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