Ranganathan; Ramaswamy
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ranganathan; Ramaswamy.The latest application filed is for "testing access policies".
- Ranganathan; Ramaswamy - Bellevue WA US
- Ranganathan; Ramaswamy - Saratoga CA
- Ranganathan; Ramaswamy - Cupertino CA
| Patent | Date |
|---|---|
| Scoped resource authorization policies Grant 9,208,332 - Leach , et al. December 8, 2 | 2015-12-08 |
| Testing access policies Grant 8,813,170 - Novak , et al. August 19, 2 | 2014-08-19 |
| Testing Access Policies App 20130125199 - Novak; Mark F. ; et al. | 2013-05-16 |
| Scoped Resource Authorization Policies App 20120167158 - Leach; Paul ; et al. | 2012-06-28 |
| Enhanced pad design for solder attach devices Grant 8,163,643 - Othieno , et al. April 24, 2 | 2012-04-24 |
| Eliminate IMC cracking in post wirebonded dies: macro level stress reduction by modifying dielectric/metal film stack in be layers during Cu/Low-K processing Grant 7,531,442 - Pallinti , et al. May 12, 2 | 2009-05-12 |
| Eliminate IMC cracking in post wirebonded dies: macro level stress reduction by modifying dielectric/metal film stack in be layers during Cu/Low-K processing App 20070123024 - Pallinti; Jayanthi ; et al. | 2007-05-31 |
| Test structure for detecting bonding-induced cracks Grant 6,998,638 - Low , et al. February 14, 2 | 2006-02-14 |
| Insulated bonding wire tool for microelectronic packaging Grant 6,991,147 - Chia , et al. January 31, 2 | 2006-01-31 |
| Dielectric stack Grant 6,963,138 - Low , et al. November 8, 2 | 2005-11-08 |
| Buffer metal layer Grant 6,861,343 - Chia , et al. March 1, 2 | 2005-03-01 |
| Test structure Grant 6,861,748 - Low , et al. March 1, 2 | 2005-03-01 |
| Slotted bonding pad Grant 6,825,563 - Ranganathan , et al. November 30, 2 | 2004-11-30 |
| Test structure for detecting bonding-induced cracks App 20040217487 - Low, Qwai H. ; et al. | 2004-11-04 |
| Bonding pad for low k dielectric Grant 6,798,035 - Low , et al. September 28, 2 | 2004-09-28 |
| Insulated bonding wire tool for microelectronic packaging App 20040182911 - Chia, Chok J. ; et al. | 2004-09-23 |
| Wire bonding to full array bonding pads on active circuitry App 20040178498 - Low, Qwai H. ; et al. | 2004-09-16 |
| Test structure for detecting bonding-induced cracks Grant 6,781,150 - Low , et al. August 24, 2 | 2004-08-24 |
| Dielectric stack App 20040150069 - Low, Qwai H. ; et al. | 2004-08-05 |
| Bonding pad isolation Grant 6,743,979 - Berman , et al. June 1, 2 | 2004-06-01 |
| Test structure App 20040096995 - Low, Qwai H. ; et al. | 2004-05-20 |
| Buffer metal layer App 20040072414 - Chia, Chok J. ; et al. | 2004-04-15 |
| Controlled impedance for wire bonding interconnects App 20040070065 - Thurairajaratnam, Aritharan ; et al. | 2004-04-15 |
| Test structure App 20040043656 - Low, Qwai H. ; et al. | 2004-03-04 |
| Insulated bonding wire for microelectronic packaging Grant 6,670,214 - Chia , et al. December 30, 2 | 2003-12-30 |
| Process for manufacturing a semiconductor device having a stiffener member Grant 6,020,221 - Lim , et al. February 1, 2 | 2000-02-01 |
| Embedded features for registration measurement in electronics manufacturing Grant 5,385,289 - Bloch , et al. January 31, 1 | 1995-01-31 |
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