Rand; Rick A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Rand; Rick A..The latest application filed is for "through board stacking of multiple lga-connected components".

Company Profile

0.5.4

Rand; Rick A. - Somers NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Through board stacking of multiple LGA-connected components Grant 8,278,745 - Coteus , et al. October 2, 2	2012-10-02
Through board stacking of multiple LGA-connected components Grant 8,174,106 - Coteus , et al. May 8, 2	2012-05-08
Digital measuring system and method for integrated circuit chip operating parameters Grant 7,813,815 - Ainspan , et al. October 12, 2	2010-10-12
Through Board Stacking Of Multiple Lga-connected Components App 20090315168 - Coteus; Paul W. ; et al.	2009-12-24
Through board stacking of multiple LGA-connected components App 20080054430 - Coteus; Paul W. ; et al.	2008-03-06
Digital Measuring System And Method For Integrated Circuit Chip Operating Parameters App 20070101227 - Ainspan; Herschel ; et al.	2007-05-03
Digital measuring system and method for integrated circuit chip operating parameters Grant 7,168,853 - Ainspan , et al. January 30, 2	2007-01-30
Digital measuring system and method for integrated circuit chip operating parameters App 20040136436 - Ainspan, Herschel ; et al.	2004-07-15
Exposure compensation for a line scan camera Grant 4,920,429 - Jaffe , et al. April 24, 1	1990-04-24

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