loadpatents
Patent applications and USPTO patent grants for Ramaswamy; Chandrashekhar.The latest application filed is for "input/output package architectures, and methods of using same".
Patent | Date |
---|---|
Input/output package architectures Grant 8,188,594 - Ganesan , et al. May 29, 2 | 2012-05-29 |
Substrate package with through holes for high speed I/O flex cable Grant 7,888,784 - Gurumurthy , et al. February 15, 2 | 2011-02-15 |
Input/output package architectures, and methods of using same Grant 7,705,447 - Ganesan , et al. April 27, 2 | 2010-04-27 |
Input/output package architectures, and methods of using same App 20100096743 - Ganesan; Sanka ;   et al. | 2010-04-22 |
Input/output Package Architectures, And Methods Of Using Same App 20100078781 - Ganesan; Sanka ;   et al. | 2010-04-01 |
Substrate Package With Through Holes For High Speed I/o Flex Cable App 20100078826 - Gurumurthy; Charan ;   et al. | 2010-04-01 |
Providing variable sized contacts for coupling with a semiconductor device Grant 7,530,814 - Ramaswamy , et al. May 12, 2 | 2009-05-12 |
Providing variable sized contacts for coupling with a semiconductor device App 20090081889 - Ramaswamy; Chandrashekhar ;   et al. | 2009-03-26 |
Multiple power density chip structure Grant 7,193,318 - Colgan , et al. March 20, 2 | 2007-03-20 |
Compliant interconnects for semiconductors and micromachines App 20060087032 - Muthukumar; Sriram ;   et al. | 2006-04-27 |
Multiple Power Density Chip Structure App 20060038281 - Colgan; Evan G. ;   et al. | 2006-02-23 |
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