loadpatents
name:-0.032593011856079
name:-0.012363910675049
name:-0.00049877166748047
Ramanathan; Sivakami Patent Filings

Ramanathan; Sivakami

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ramanathan; Sivakami.The latest application filed is for "dense oxide coated component of a plasma processing chamber and method of manufacture thereof".

Company Profile
0.12.20
  • Ramanathan; Sivakami - Fremont CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Dense oxide coated component of a plasma processing chamber and method of manufacture thereof
Grant 9,546,432 - Shih , et al. January 17, 2
2017-01-17
Method of wet cleaning aluminum chamber parts
Grant 9,387,521 - Shih , et al. July 12, 2
2016-07-12
Corrosion resistant aluminum coating on plasma chamber components
Grant 9,337,002 - Daugherty , et al. May 10, 2
2016-05-10
Dense Oxide Coated Component Of A Plasma Processing Chamber And Method Of Manufacture Thereof
App 20150337450 - SHIH; Hong ;   et al.
2015-11-26
Dense oxide coated component of a plasma processing chamber and method of manufacture thereof
Grant 9,123,651 - Shih , et al. September 1, 2
2015-09-01
Dense Oxide Coated Component Of A Plasma Processing Chamber And Method Of Manufacture Thereof
App 20140295670 - Shih; Hong ;   et al.
2014-10-02
Corrosion Resistant Aluminum Coating On Plasma Chamber Components
App 20140272459 - Daugherty; John ;   et al.
2014-09-18
Method Of Wet Cleaning Aluminum Chamber Parts
App 20140150819 - Shih; Hong ;   et al.
2014-06-05
Method of cleaning aluminum plasma chamber parts
Grant 8,545,639 - Shih , et al. October 1, 2
2013-10-01
Method Of Cleaning Aluminum Plasma Chamber Parts
App 20130104930 - Shih; Hong ;   et al.
2013-05-02
Post rinse to improve selective deposition of electroless cobalt on copper for ULSI application
App 20050136185 - Ramanathan, Sivakami ;   et al.
2005-06-23
Electroless deposition method
Grant 6,905,622 - Padhi , et al. June 14, 2
2005-06-14
Electroless deposition method
Grant 6,899,816 - Padhi , et al. May 31, 2
2005-05-31
Method and apparatus for reducing organic depletion during non-processing time periods
Grant 6,878,245 - Gandikota , et al. April 12, 2
2005-04-12
Electroless deposition method over sub-micron apertures
Grant 6,824,666 - Gandikota , et al. November 30, 2
2004-11-30
Post rinse to improve selective deposition of electroless cobalt on copper for ULSI application
Grant 6,821,909 - Ramanathan , et al. November 23, 2
2004-11-23
Method and apparatus for improved electroplating fill of an aperture
Grant 6,797,620 - Lewis , et al. September 28, 2
2004-09-28
Post rinse to improve selective deposition of electroless cobalt on copper for ULSI application
App 20040087141 - Ramanathan, Sivakami ;   et al.
2004-05-06
Planarization by chemical polishing for ULSI applications
App 20030209523 - Padhi, Deenesh ;   et al.
2003-11-13
Method and apparatus for improved electroplating fill of an aperture
App 20030194850 - Lewis, John S. ;   et al.
2003-10-16
Homogeneous copper-tin alloy plating for enhancement of electro-migration resistance in interconnects
App 20030188974 - Padhi, Deenesh ;   et al.
2003-10-09
Electroless deposition method
App 20030189026 - Padhi, Deenesh ;   et al.
2003-10-09
Electroless deposition method
App 20030190812 - Padhi, Deenesh ;   et al.
2003-10-09
Electroless deposition method
App 20030190426 - Padhi, Deenesh ;   et al.
2003-10-09
Method and apparatus for reducing organic depletion during non-processing time periods
App 20030159936 - Gandikota, Srinivas ;   et al.
2003-08-28
Method to reduce the depletion of organics in electroplating baths
App 20030159937 - Gandikota, Srinivas ;   et al.
2003-08-28
Method for forming copper interconnects
App 20030146102 - Ramanathan, Sivakami ;   et al.
2003-08-07
Electroless deposition method over sub-micron apertures
App 20030140988 - Gandikota, Srinivas ;   et al.
2003-07-31
Method of depositing a catalytic layer
App 20030143837 - Gandikota, Srinivas ;   et al.
2003-07-31
Process window for gap-fill on very high aspect ratio structures using additives in low acid copper baths
App 20020112964 - Gandikota, Srinivas ;   et al.
2002-08-22

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