| Patent | Date |
|---|
Porous Perovskite Nickelates With Enhanced Electrochromic Properties And Systems Thereof
App 20220229339 - SUN; Yifei ; et al. | 2022-07-21 |
Electric field sensing devices and systems and method of making the same
Grant 11,385,376 - Ramanathan , et al. July 12, 2 | 2022-07-12 |
Ultralow Concentration Sensing Of Bio-matter With Perovskite Nickelate Devices And Arrays
App 20220025425 - Zhang; Haitian ; et al. | 2022-01-27 |
Multi-layer Optical Materials Systems And Methods Of Making The Same
App 20210255518 - SUN; YIFEI ; et al. | 2021-08-19 |
Dopant-driven phase transitions in correlated metal oxides
Grant 10,600,959 - Shi , et al. | 2020-03-24 |
Electric Field Sensing Devices And Systems And Method Of Making The Same
App 20200025966 - Ramanathan; Shriram ; et al. | 2020-01-23 |
Solid-state Ionic Conductors And Methods Of Making The Same
App 20190140312 - Ramanathan; Shriram ; et al. | 2019-05-09 |
Tunable Electronic Nanocomposites With Phase Change Materials And Controlled Disorder
App 20180190436 - Duwel; Amy Elizabeth ; et al. | 2018-07-05 |
Catalyst material for fuel cell
Grant 9,755,245 - Ramanathan , et al. September 5, 2 | 2017-09-05 |
Solid oxide fuel cell with reinforced electrolyte membrane
Grant 9,620,803 - Ramanathan , et al. April 11, 2 | 2017-04-11 |
Phase transition devices and smart capacitive devices
Grant 9,515,256 - Ramanathan , et al. December 6, 2 | 2016-12-06 |
Microelectronic package having direct contact heat spreader and method of manufacturing same
Grant 9,508,675 - Lu , et al. November 29, 2 | 2016-11-29 |
Dopant-driven Phase Transitions In Correlated Metal Oxides
App 20160248006 - Shi; Jian ; et al. | 2016-08-25 |
Electrically-driven phase transitions in functional oxide heterostructures
Grant 9,343,206 - Zhou , et al. May 17, 2 | 2016-05-17 |
Phase Transition Devices And Smart Capacitive Devices
App 20150340607 - RAMANATHAN; Shriram ; et al. | 2015-11-26 |
Solid Oxide Fuel Cell With Reinforced Electrolyte Membrane
App 20150188176 - RAMANATHAN; Shriram ; et al. | 2015-07-02 |
Electrically-driven Phase Transitions In Functional Oxide Heterostructures
App 20140375417 - Zhou; You ; et al. | 2014-12-25 |
Vanadium oxide thin films
Grant 8,864,957 - Ramanathan , et al. October 21, 2 | 2014-10-21 |
Micro-scale energy conversion devices and methods
Grant 8,815,466 - Ramanathan , et al. August 26, 2 | 2014-08-26 |
Catalyst Material For Fuel Cell
App 20140051008 - Ramanathan; Shriram ; et al. | 2014-02-20 |
Device, Method, And System For Separation And Detection Of Biomolecules And Cells
App 20140008281 - RAMANATHAN; Shriram ; et al. | 2014-01-09 |
Microelectronic Package Having Direct Contact Heat Spreader And Method Of Manufacturing Same
App 20130344659 - Lu; Daoqiang ; et al. | 2013-12-26 |
Electrochemically Functional Membranes
App 20130256122 - Ramanathan; Shriram ; et al. | 2013-10-03 |
Microelectronic package having direct contact heat spreader and method of manufacturing same
Grant 8,541,876 - Lu , et al. September 24, 2 | 2013-09-24 |
Device, method, and system for separation and detection of biomolecules and cells
Grant 8,512,559 - Ramanathan , et al. August 20, 2 | 2013-08-20 |
Three-dimensional stacked substrate arrangements
Grant 8,421,225 - Ramanathan , et al. April 16, 2 | 2013-04-16 |
Three-dimensional Stacked Substrate Arrangements
App 20120280387 - Ramanathan; Shriram ; et al. | 2012-11-08 |
Three-dimensional stacked substrate arrangements
Grant 8,203,208 - Ramanathan , et al. June 19, 2 | 2012-06-19 |
Electrodes For Fuel Cells
App 20120009504 - Ramanathan; Shriram ; et al. | 2012-01-12 |
Electric field induced phase transitions and dynamic tuning of the properties of oxide structures
Grant 8,076,662 - Ramanathan , et al. December 13, 2 | 2011-12-13 |
Three-dimensional Stacked Substrate Arrangements
App 20110260319 - Ramanathan; Shriram ; et al. | 2011-10-27 |
Metal-metal bonding of compliant interconnect
Grant 8,030,782 - Ramanathan , et al. October 4, 2 | 2011-10-04 |
Phase Transition Devices And Smart Capacitive Devices
App 20110181345 - Ramanathan; Shriram | 2011-07-28 |
Electric Field Induced Phase Transitions And Dynamic Tuning Of The Properties Of Oxide Structures
App 20110175047 - Ramanathan; Shriram ; et al. | 2011-07-21 |
Three-dimensional stacked substrate arrangements
Grant 7,973,407 - Ramanathan , et al. July 5, 2 | 2011-07-05 |
Vanadium Oxide Thin Films
App 20110120855 - Ramanathan; Shriram ; et al. | 2011-05-26 |
Nano-scale Gas Separation Device Utilizing Thin Film Structures For Hydrogen Production
App 20100316918 - Ramanathan; Shriram ; et al. | 2010-12-16 |
Photo-activation Of Solid Oxide Fuel Cells And Gas Separation Devices
App 20100255387 - Ramanathan; Shriram ; et al. | 2010-10-07 |
Three-dimensional integrated circuit for analyte detection
App 20100248209 - Datta; Suman ; et al. | 2010-09-30 |
Metal-metal Bonding Of Compliant Interconnect
App 20100237505 - Muthukumar; Sriram ; et al. | 2010-09-23 |
Portable NMR device and method for making and using the same
Grant 7,800,371 - Park , et al. September 21, 2 | 2010-09-21 |
Nanoscale Oxide Coatings
App 20100227083 - Ramanathan; Shriram ; et al. | 2010-09-09 |
Metal-metal bonding of compliant interconnect
Grant 7,750,487 - Muthukumar , et al. July 6, 2 | 2010-07-06 |
Stacked wafer or die packaging with enhanced thermal and device performance
Grant 7,723,759 - Baskaran , et al. May 25, 2 | 2010-05-25 |
Forming a hybrid device
Grant 7,692,310 - Park , et al. April 6, 2 | 2010-04-06 |
Methods of forming channels on an integrated circuit die and die cooling systems including such channels
Grant 7,663,230 - Ramanathan , et al. February 16, 2 | 2010-02-16 |
Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
Grant 7,589,417 - Ramanathan , et al. September 15, 2 | 2009-09-15 |
Three-dimensional stacked substrate arrangements
App 20090174070 - Ramanathan; Shriram ; et al. | 2009-07-09 |
Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
Grant 7,537,954 - Ramanathan , et al. May 26, 2 | 2009-05-26 |
Micro-scale Energy Conversion Devices And Methods
App 20090087697 - Ramanathan; Shriram ; et al. | 2009-04-02 |
3D integrated circuits using thick metal for backside connections and offset bumps
Grant 7,410,884 - Ramanathan , et al. August 12, 2 | 2008-08-12 |
Methods of forming channels on an integrated circuit die and die cooling systems including such channels
App 20080185714 - Ramanathan; Shriram ; et al. | 2008-08-07 |
Method of forming self-passivating interconnects and resulting devices
Grant 7,402,509 - Kobrinsky , et al. July 22, 2 | 2008-07-22 |
Methods of forming channels on an integrated circuit die and die cooling systems including such channels
Grant 7,358,201 - Ramanathan , et al. April 15, 2 | 2008-04-15 |
Portable NMR device and method for making and using the same
Grant 7,345,479 - Park , et al. March 18, 2 | 2008-03-18 |
Method of forming a stacked device filler
Grant 7,320,928 - Kloster , et al. January 22, 2 | 2008-01-22 |
Device and method using magnetic pattern on disk
Grant 7,319,323 - Park , et al. January 15, 2 | 2008-01-15 |
Portable Nmr Device And Method For Making And Using The Same
App 20070296413 - Park; Chang-Min ; et al. | 2007-12-27 |
Highly Compliant Plate For Wafer Bonding
App 20070287263 - Kobrinsky; Mauro J. ; et al. | 2007-12-13 |
Highly Compliant Plate For Wafer Bonding
App 20070284409 - Kobrinsky; Mauro ; et al. | 2007-12-13 |
Wafer bonding with highly compliant plate having filler material enclosed hollow core
Grant 7,307,005 - Kobrinsky , et al. December 11, 2 | 2007-12-11 |
Method of making a substrate having thermally conductive structures and resulting devices
App 20070235847 - Ramanathan; Shriram ; et al. | 2007-10-11 |
Device and method using magnetic pattern on disk
App 20070229078 - Park; Chang-Min ; et al. | 2007-10-04 |
Forming a hybrid device
App 20070221961 - Park; Chang-Min ; et al. | 2007-09-27 |
Integrated on-chip NMR and ESR device and method for making and using the same
Grant 7,274,191 - Park , et al. September 25, 2 | 2007-09-25 |
Method for wafer stacking using copper structures of substantially uniform height
Grant 7,268,015 - RamachandraRao , et al. September 11, 2 | 2007-09-11 |
Optical magnetometer array and method for making and using the same
App 20070167723 - Park; Chang-Min ; et al. | 2007-07-19 |
Integrated On-chip Nmr And Esr Device And Method For Making And Using The Same
App 20070152669 - Park; Chang-Min ; et al. | 2007-07-05 |
Portable NMR device and method for making and using the same
App 20070152670 - Park; Chang-Min ; et al. | 2007-07-05 |
Device, method, and system for separation and detection of biomolecules and cells
App 20070114180 - Ramanathan; Shriram ; et al. | 2007-05-24 |
3D integrated circuits using thick metal for backside connections and offset bumps
App 20070117348 - Ramanathan; Shriram ; et al. | 2007-05-24 |
Deposition of diffusion barrier
Grant 7,214,605 - Ramanathan , et al. May 8, 2 | 2007-05-08 |
Integrating thermoelectric elements into wafer for heat extraction
Grant 7,211,890 - Ramanathan , et al. May 1, 2 | 2007-05-01 |
Stacked wafer or die packaging with enhanced thermal and device performance
App 20070093066 - Baskaran; Rajashree ; et al. | 2007-04-26 |
Microelectronic package having direct contact heat spreader and method of manufacturing same
App 20070075420 - Lu; Daoqiang ; et al. | 2007-04-05 |
Method of bonding semiconductor devices
Grant 7,186,637 - Kloster , et al. March 6, 2 | 2007-03-06 |
Copper bump barrier cap to reduce electrical resistance
App 20070045833 - Zhong; Ting ; et al. | 2007-03-01 |
Method and apparatus for low temperature copper to copper bonding
Grant 7,183,648 - Ramanathan , et al. February 27, 2 | 2007-02-27 |
Stacked device underfill and a method of fabrication
Grant 7,180,180 - Kloster , et al. February 20, 2 | 2007-02-20 |
Method and apparatus for bonding wafers
App 20060292823 - Ramanathan; Shriram ; et al. | 2006-12-28 |
Metrology system and method for stacked wafer alignment
App 20060249859 - Eiles; Travis M. ; et al. | 2006-11-09 |
Gap-filling in electronic assemblies including a TEC structure
App 20060243315 - Chrysler; Gregory M. ; et al. | 2006-11-02 |
Method of forming vias on a wafer stack using laser ablation
Grant 7,118,989 - Ramanathan , et al. October 10, 2 | 2006-10-10 |
Method of forming self-passivating interconnects and resulting devices
App 20060220197 - Kobrinsky; Mauro J. ; et al. | 2006-10-05 |
Limiting net curvature in a wafer
App 20060202209 - Kelman; Maxim B. ; et al. | 2006-09-14 |
Method to fill the gap between coupled wafers
Grant 7,087,538 - Staines , et al. August 8, 2 | 2006-08-08 |
Method for wafer stacking using copper structures of substantially uniform height
App 20060138618 - RamachandraRao; Vijayakumar S. ; et al. | 2006-06-29 |
Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
App 20060097383 - Ramanathan; Shriram ; et al. | 2006-05-11 |
Wafer stacking using interconnect structures of substantially uniform height
Grant 7,038,324 - RamachandraRao , et al. May 2, 2 | 2006-05-02 |
Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
Grant 7,034,394 - Ramanathan , et al. April 25, 2 | 2006-04-25 |
Method of forming vias on a wafer stack using laser ablation
App 20060040471 - Ramanathan; Shriram ; et al. | 2006-02-23 |
Method to fill the gap between coupled wafers
App 20060035476 - Staines; David ; et al. | 2006-02-16 |
Metal-metal bonding of compliant interconnect
App 20060033172 - Muthukumar; Sriram ; et al. | 2006-02-16 |
Method of forming a stacked device filler
Grant 6,984,873 - Kloster , et al. January 10, 2 | 2006-01-10 |
Highly compliant plate for wafer bonding
App 20060003547 - Kobrinsky; Mauro J. ; et al. | 2006-01-05 |
Highly compliant plate for wafer bonding
App 20060003548 - Kobrinsky; Mauro J. ; et al. | 2006-01-05 |
Thermoelectric nano-wire devices
App 20050257821 - Ramanathan, Shriram ; et al. | 2005-11-24 |
Wafer stacking using copper structures of substantially uniform height
App 20050221581 - RamachandraRao, Vijayakumar S. ; et al. | 2005-10-06 |
Methods of forming channels on an integrated circuit die and die cooling systems including such channels
App 20050215058 - Ramanathan, Shriram ; et al. | 2005-09-29 |
Stacked device underfill and a method of fabrication
Grant 6,946,384 - Kloster , et al. September 20, 2 | 2005-09-20 |
Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
App 20050178423 - Ramanathan, Shriram ; et al. | 2005-08-18 |
Methods of forming channels on an integrated circuit die and die cooling systems including such channels
Grant 6,919,231 - Ramanathan , et al. July 19, 2 | 2005-07-19 |
Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
App 20050077619 - Ramanathan, Shriram ; et al. | 2005-04-14 |
Deposition of diffusion barrier
App 20050079685 - Ramanathan, Shriram ; et al. | 2005-04-14 |
Integrating thermoelectric elements into wafer for heat extraction
App 20050067692 - Ramanathan, Shriram ; et al. | 2005-03-31 |
Method of bonding semiconductor devices
App 20050025942 - Kloster, Grant ; et al. | 2005-02-03 |
Method and apparatus for low temperature copper to copper bonding
App 20050003664 - Ramanathan, Shriram ; et al. | 2005-01-06 |
Method and apparatus for low temperature copper to copper bonding
App 20050003652 - Ramanathan, Shriram ; et al. | 2005-01-06 |
Three-dimensional stacked substrate arrangements
App 20050003650 - Ramanathan, Shriram ; et al. | 2005-01-06 |
Methods for bonding wafers using a metal interlayer
App 20040262772 - Ramanathan, Shriram ; et al. | 2004-12-30 |
Method of forming a stacked device filler
App 20040256736 - Kloster, Grant M. ; et al. | 2004-12-23 |
Method of forming a stacked device filler
App 20040256724 - Kloster, Grant M. ; et al. | 2004-12-23 |
Stacked device underfill and a method of fabrication
App 20040245616 - Kloster, Grant M. ; et al. | 2004-12-09 |
Stacked device underfill and a method of fabrication
App 20040245634 - Kloster, Grant M. ; et al. | 2004-12-09 |
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