Ramachandran; Koushik

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ramachandran; Koushik.The latest application filed is for "microelectronics package with ultra-low-k dielectric region between stacked antenna elements".

Company Profile

4.4.4

Ramachandran; Koushik - Wappingers Falls NY
Ramachandran; Koushik - Wappigners Falls NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Microelectronics Package With Ultra-low-k Dielectric Region Between Stacked Antenna Elements App 20210273323 - Bulumulla; Selaka B. ; et al.	2021-09-02
Multi-layered Substrates Of Semiconductor Devices App 20210249442 - FASANO; BENJAMIN VITO ; et al.	2021-08-12
Microelectronics package with ultra-low-K dielectric region between stacked antenna elements Grant 11,075,453 - Bulumulla , et al. July 27, 2	2021-07-27
Photonic die fan out package with edge fiber coupling interface and related methods Grant 10,598,860 - Ramachandran , et al.	2020-03-24
Chip-to-chip and chip-to-substrate interconnections in multi-chip semiconductor devices Grant 10,438,894 - Farooq , et al. O	2019-10-08
Photonic Die Fan Out Package With Edge Fiber Coupling Interface And Related Methods App 20190285804 - Ramachandran; Koushik ; et al.	2019-09-19
PIC die packaging using magnetics to position optical element Grant 10,409,014 - Ramachandran , et al. Sept	2019-09-10
Fan-out Circuit Packaging With Integrated Lid App 20180166356 - Butt; Shahid A. ; et al.	2018-06-14

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