| Patent | Date |
|---|
Method For Patterning A Dielectric Layer
App 20220293419 - Lu; Yen-Tien ; et al. | 2022-09-15 |
Forming a semiconductor feature using atomic layer etch
Grant 11,424,123 - Liu , et al. August 23, 2 | 2022-08-23 |
Methods for Forming Self-Aligned Contacts Using Spin-on Silicon Carbide
App 20220262679 - Sun; Junling ; et al. | 2022-08-18 |
Protective layers and methods of formation during plasma etching processes
Grant 11,410,852 - Lutker-Lee , et al. August 9, 2 | 2022-08-09 |
Platform and method of operating for integrated end-to-end self-aligned multi-patterning process
Grant 11,398,379 - Clark , et al. July 26, 2 | 2022-07-26 |
Radiation of Substrates During Processing and Systems Thereof
App 20220189764 - Edley; Michael ; et al. | 2022-06-16 |
Method of patterning a metal film with improved sidewall roughness
Grant 11,322,364 - Joy , et al. May 3, 2 | 2022-05-03 |
Radiation of substrates during processing and systems thereof
Grant 11,289,325 - Edley , et al. March 29, 2 | 2022-03-29 |
Method For Critical Dimension (cd) Trim Of An Organic Pattern Used For Multi-patterning Purposes
App 20220076942 - Lutker-Lee; Katie ; et al. | 2022-03-10 |
Plasma Pre-Treatment Method To Improve Etch Selectivity And Defectivity Margin
App 20220037152 - Raley; Angelique ; et al. | 2022-02-03 |
Ald (atomic Layer Deposition) Liner For Via Profile Control And Related Applications
App 20220020642 - Sun; Xinghua ; et al. | 2022-01-20 |
Critical dimension trimming method designed to minimize line width roughness and line edge roughness
Grant 11,227,767 - Raley , et al. January 18, 2 | 2022-01-18 |
Radiation of Substrates During Processing and Systems Thereof
App 20210407790 - Edley; Michael ; et al. | 2021-12-30 |
Method For Dry Etching Silicon Carbide Films For Resist Underlayer Applications
App 20210358763 - Raley; Angelique ; et al. | 2021-11-18 |
Systems and Methods to Control Critical Dimension (CD) Shrink Ratio through Radio Frequency (RF) Pulsing
App 20210343502 - Sun; Junling ; et al. | 2021-11-04 |
ALD (atomic layer deposition) liner for via profile control and related applications
Grant 11,164,781 - Sun , et al. November 2, 2 | 2021-11-02 |
Method Of Patterning A Metal Film With Improved Sidewall Roughness
App 20210313192 - Joy; Nicholas ; et al. | 2021-10-07 |
In-situ Encapsulation of Metal-Insulator-Metal (MIM) stacks for Resistive Random Access Memory (RERAM) Cells
App 20210313513 - Lutker-Lee; Katie ; et al. | 2021-10-07 |
Manufacturing methods for mandrel pull from spacers for multi-color patterning
Grant 11,127,594 - Sun , et al. September 21, 2 | 2021-09-21 |
Dielectric Etch Stop Layer For Reactive Ion Etch (rie) Lag Reduction And Chamfer Corner Protection
App 20210265205 - Lu; Yen-Tien ; et al. | 2021-08-26 |
Forming A Semiconductor Feature Using Atomic Layer Etch
App 20210265164 - Liu; Eric Chih-Fang ; et al. | 2021-08-26 |
Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same
Grant 11,101,173 - Clark , et al. August 24, 2 | 2021-08-24 |
Selective Deposition Of Conductive Cap For Fully-aligned-via (fav)
App 20210242074 - Lu; Yen-Tien ; et al. | 2021-08-05 |
Multiple Patterning With Selective Mandrel Formation
App 20210217614 - Lutker-Lee; Katie ; et al. | 2021-07-15 |
Methods Of Patterning Small Features
App 20210183656 - Lutker-Lee; Katie ; et al. | 2021-06-17 |
Protective Layers And Methods Of Formation During Plasma Etching Processes
App 20210159082 - Lutker-Lee; Katie ; et al. | 2021-05-27 |
Split Ash Processes For Via Formation To Suppress Damage To Low-k Layers
App 20210151350 - Lu; Yen-Tien ; et al. | 2021-05-20 |
Atomic layer deposition for low-K trench protection during etch
Grant 10,964,587 - Lu , et al. March 30, 2 | 2021-03-30 |
Method utilizing using post etch pattern encapsulation
Grant 10,950,460 - Raley , et al. March 16, 2 | 2021-03-16 |
Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same
Grant 10,916,472 - Clark , et al. February 9, 2 | 2021-02-09 |
Method For Using Ultra Thin Ruthenium Metal Hard Mask For Etching Profile Control
App 20210028017 - Lu; Yen-Tien ; et al. | 2021-01-28 |
Method and Structure for Smoothing Substrate Patterns or Surfaces
App 20210020448 - Lou; Qiaowei ; et al. | 2021-01-21 |
Double plug method for tone inversion patterning
Grant 10,867,854 - Raley December 15, 2 | 2020-12-15 |
Methods and systems for patterning of low aspect ratio stacks
Grant 10,748,769 - Franke , et al. A | 2020-08-18 |
Platform and method of operating for integrated end-to-end self-aligned multi-patterning process
Grant 10,727,057 - Clark , et al. | 2020-07-28 |
Double Plug Method For Tone Inversion Patterning
App 20200219767 - Raley; Angelique | 2020-07-09 |
Self-aware And Correcting Heterogenous Platform Incorporating Integrated Semiconductor Processing Modules And Method For Using S
App 20200081423 - Clark; Robert ; et al. | 2020-03-12 |
Self-aware And Correcting Heterogenous Platform Incorporating Integrated Semiconductor Processing Modules And Method For Using S
App 20200083074 - Clark; Robert ; et al. | 2020-03-12 |
Ald (atomic Layer Deposition) Liner For Via Profile Control And Related Applications
App 20200051859 - Sun; Xinghua ; et al. | 2020-02-13 |
Method Utilizing Using Post Etch Pattern Encapsulation
App 20200051832 - Raley; Angelique ; et al. | 2020-02-13 |
Self-aware And Correcting Heterogenous Platform Incorporating Integrated Semiconductor Processing Modules And Method For Using S
App 20200043764 - Clark; Robert ; et al. | 2020-02-06 |
Self-aware And Correcting Heterogenous Platform Incorporating Integrated Semiconductor Processing Modules And Method For Using S
App 20200006100 - Clark; Robert ; et al. | 2020-01-02 |
Atomic Layer Deposition For Low-K Trench Protection During Etch
App 20190355617 - O'Meara; David ; et al. | 2019-11-21 |
Methods And Systems For Patterning Of Low Aspect Ratio Stacks
App 20190348288 - Franke; Elliott ; et al. | 2019-11-14 |
Critical Dimension Trimming Method Designed To Minimize Line Width Roughness and Line Edge Roughness
App 20190341257 - Raley; Angelique ; et al. | 2019-11-07 |
In-situ spacer reshaping for self-aligned multi-patterning methods and systems
Grant 10,453,686 - Liu , et al. Oc | 2019-10-22 |
Platform And Method Of Operating For Integrated End-to-end Self-aligned Multi-patterning Process
App 20190295906 - Clark; Robert ; et al. | 2019-09-26 |
Platform And Method Of Operating For Integrated End-to-end Self-aligned Multi-patterning Process
App 20190295846 - Clark; Robert ; et al. | 2019-09-26 |
Organic mandrel protection process
Grant 10,354,873 - Ko , et al. July 16, 2 | 2019-07-16 |
Manufacturing Methods For Mandrel Pull From Spacers For Multi-color Patterning
App 20190189444 - Sun; Xinghua ; et al. | 2019-06-20 |
Trim method for patterning during various stages of an integration scheme
Grant 10,049,875 - Raley , et al. August 14, 2 | 2018-08-14 |
In-situ Spacer Reshaping For Self-aligned Multi-patterning Methods And Systems
App 20180061640 - Liu; Eric Chih-Fang ; et al. | 2018-03-01 |
Organic Mandrel Protection Process
App 20170358450 - Ko; Akiteru ; et al. | 2017-12-14 |
Trim Method For Patterning During Various Stages Of An Integration Scheme
App 20170256395 - Raley; Angelique ; et al. | 2017-09-07 |
Method for increasing pattern density in self-aligned patterning integration schemes
Grant 9,673,059 - Raley , et al. June 6, 2 | 2017-06-06 |
Method For Increasing Pattern Density In Self-aligned Patterning Integration Schemes
App 20160225640 - Raley; Angelique ; et al. | 2016-08-04 |
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