Rakow; Bernd
Patent Applications and Registrations
Patent applications and USPTO patent grants for Rakow; Bernd.The latest application filed is for "method for fabricating a semiconductor flip-chip package".
- Rakow; Bernd - Regensburg DE
| Patent | Date |
|---|---|
| Method for fabricating a semiconductor flip-chip package Grant 11,393,742 - Meyer , et al. July 19, 2 | 2022-07-19 |
| Method for Fabricating a Semiconductor Flip-Chip Package App 20200388561 - Meyer; Thorsten ; et al. | 2020-12-10 |
| Diffusion solder bonding using solder preforms Grant 9,683,278 - Heinrich , et al. June 20, 2 | 2017-06-20 |
| Diffusion Solder Bonding Using Solder Preforms App 20160358890 - Heinrich; Alexander ; et al. | 2016-12-08 |
| Semiconductor device Grant 8,642,408 - Otremba , et al. February 4, 2 | 2014-02-04 |
| Electronic device Grant 8,030,741 - Bemmerl , et al. October 4, 2 | 2011-10-04 |
| Semiconductor Device App 20110189821 - Otremba; Ralf ; et al. | 2011-08-04 |
| External contact material for external contacts of a semiconductor device and method of making the same Grant 7,893,532 - Bauer , et al. February 22, 2 | 2011-02-22 |
| Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier Grant 7,868,465 - Otremba , et al. January 11, 2 | 2011-01-11 |
| Electronic Device App 20100213587 - Bemmerl; Thomas ; et al. | 2010-08-26 |
| Electronic device Grant 7,737,537 - Bemmerl , et al. June 15, 2 | 2010-06-15 |
| Electronic device App 20090152694 - Bemmerl; Thomas ; et al. | 2009-06-18 |
| Semiconductor Device App 20080296782 - Otremba; Ralf ; et al. | 2008-12-04 |
| External contact material for external contacts of a semiconductor device and method of making the same App 20070057372 - Bauer; Michael ; et al. | 2007-03-15 |
| Electronic component and electronic configuration App 20070018308 - Schott; Albert ; et al. | 2007-01-25 |
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