Rajagopalan; Nagarajan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Rajagopalan; Nagarajan.The latest application filed is for "modified stacks for 3d nand".
Company Profile
4.23.34
- Rajagopalan; Nagarajan - Santa Clara CA
Patent Activity
| Patent | Date |
|---|---|
| Modified Stacks For 3d Nand App 20210040607 - Han; Xinhai ; et al. | 2021-02-11 |
| Pecvd Process App 20200399756 - RAJAGOPALAN; Nagarajan ; et al. | 2020-12-24 |
| PECVD process Grant 10,793,954 - Rajagopalan , et al. October 6, 2 | 2020-10-06 |
| Dielectric-metal stack for 3D flash memory application Grant 10,475,644 - Han , et al. Nov | 2019-11-12 |
| Pecvd Process App 20180258535 - RAJAGOPALAN; Nagarajan ; et al. | 2018-09-13 |
| Dielectric-metal Stack For 3d Flash Memory Application App 20180247808 - HAN; Xinhai ; et al. | 2018-08-30 |
| PECVD process Grant 10,060,032 - Rajagopalan , et al. August 28, 2 | 2018-08-28 |
| PECVD apparatus and process Grant 10,030,306 - Rajagopalan , et al. July 24, 2 | 2018-07-24 |
| Dielectric-metal stack for 3D flash memory application Grant 9,972,487 - Han , et al. May 15, 2 | 2018-05-15 |
| Pecvd Process App 20180066364 - RAJAGOPALAN; Nagarajan ; et al. | 2018-03-08 |
| FCVD line bending resolution by deposition modulation Grant 9,896,326 - Liang , et al. February 20, 2 | 2018-02-20 |
| PECVD process Grant 9,816,187 - Rajagopalan , et al. November 14, 2 | 2017-11-14 |
| Pecvd Process App 20170016118 - RAJAGOPALAN; Nagarajan ; et al. | 2017-01-19 |
| Gate stack materials for semiconductor applications for lithographic overlay improvement Grant 9,490,116 - Tsiang , et al. November 8, 2 | 2016-11-08 |
| PECVD process Grant 9,458,537 - Rajagopalan , et al. October 4, 2 | 2016-10-04 |
| Adhesion Improvements For Oxide-silicon Stack App 20160260602 - SREEKALA; Subbalakshmi ; et al. | 2016-09-08 |
| Gate Stack Materials For Semiconductor Applications For Lithographic Overlay Improvement App 20160203971 - TSIANG; Michael ; et al. | 2016-07-14 |
| Fcvd Line Bending Resolution By Deposition Modulation App 20160181089 - LIANG; Jingmei ; et al. | 2016-06-23 |
| Pecvd Process App 20160017497 - RAJAGOPALAN; NAGARAJAN ; et al. | 2016-01-21 |
| PECVD process Grant 9,157,730 - Rajagopalan , et al. October 13, 2 | 2015-10-13 |
| Pecvd Apparatus And Process App 20150226540 - Rajagopalan; Nagarajan ; et al. | 2015-08-13 |
| Dielectric-metal Stack For 3d Flash Memory Application App 20150206757 - HAN; XINHAI ; et al. | 2015-07-23 |
| High Throughput Multi-layer Stack Deposition App 20140287593 - HAN; Xinhai ; et al. | 2014-09-25 |
| Methods For Maintaining Clean Etch Rate And Reducing Particulate Contamination With Pecvd Of Amorphous Silicon Filims App 20140272184 - SREEKALA; Subbalakshmi ; et al. | 2014-09-18 |
| Pecvd Process App 20140118751 - RAJAGOPALAN; Nagarajan ; et al. | 2014-05-01 |
| Silicon nitride passivation layer for covering high aspect ratio features Grant 8,563,095 - Rajagopalan , et al. October 22, 2 | 2013-10-22 |
| Adhesion Improvement For Low K Dielectrics To Conductive Materials App 20130230986 - RAJAGOPALAN; NAGARAJAN ; et al. | 2013-09-05 |
| Zero Shrinkage Smooth Interface Oxy-nitride And Oxy-amorphous-silicon Stacks For 3d Memory Vertical Gate Application App 20130161629 - HAN; XINHAI ; et al. | 2013-06-27 |
| Fabrication of through-silicon vias on silicon wafers Grant 8,329,575 - Rajagopalan , et al. December 11, 2 | 2012-12-11 |
| High mobility monolithic p-i-n diodes Grant 8,298,887 - Han , et al. October 30, 2 | 2012-10-30 |
| Fabrication of through-silicon vias on silicon wafers Grant 8,283,237 - Rajagopalan , et al. October 9, 2 | 2012-10-09 |
| Fabrication Of Through-silicon Vias On Silicon Wafers App 20120164829 - Rajagopalan; Nagarajan ; et al. | 2012-06-28 |
| Fabrication Of Through-silicon Vias On Silicon Wafers App 20120164827 - RAJAGOPALAN; Nagarajan ; et al. | 2012-06-28 |
| PECVD oxide-nitride and oxide-silicon stacks for 3D memory application Grant 8,076,250 - Rajagopalan , et al. December 13, 2 | 2011-12-13 |
| Silicon Nitride Passivation Layer For Covering High Aspect Ratio Features App 20110223765 - RAJAGOPALAN; Nagarajan ; et al. | 2011-09-15 |
| High Mobility Monolithic P-i-n Diodes App 20110136327 - Han; Xinhai ; et al. | 2011-06-09 |
| Method of improving initiation layer for low-k dielectric film by digital liquid flow meter Grant 7,947,611 - Ho , et al. May 24, 2 | 2011-05-24 |
| Reduction of hillocks prior to dielectric barrier deposition in Cu damascene Grant 7,723,228 - Rajagopalan , et al. May 25, 2 | 2010-05-25 |
| High Temperature Bd Development For Memory Applications App 20100087062 - Lakshmanan; Annamalai ; et al. | 2010-04-08 |
| Methods and apparatuses promoting adhesion of dielectric barrier film to copper App 20090011148 - Rajagopalan; Nagarajan ; et al. | 2009-01-08 |
| Method Of Improving Initiation Layer For Low-k Dielectric Film By Digital Liquid Flow Meter App 20080280457 - Ho; Dustin W. ; et al. | 2008-11-13 |
| Method of improving initiation layer for low-k dielectric film by digital liquid flow meter Grant 7,410,916 - Ho , et al. August 12, 2 | 2008-08-12 |
| Method Of Improving Initiation Layer For Low-k Dielectric Film By Digital Liquid Flow Meter App 20080119058 - HO; DUSTIN W. ; et al. | 2008-05-22 |
| Reduction of hillocks prior to dielectric barrier deposition in Cu damascene Grant 7,371,427 - Rajagopalan , et al. May 13, 2 | 2008-05-13 |
| Reduction Of Hillocks Prior To Dielectric Barrier Deposition In Cu Damascene App 20080075888 - Rajagopalan; Nagarajan ; et al. | 2008-03-27 |
| Method to reduce gas-phase reactions in a PECVD process with silicon and organic precursors to deposit defect-free initial layers Grant 7,297,376 - Yim , et al. November 20, 2 | 2007-11-20 |
| Adhesion improvement for low k dielectrics to conductive materials Grant 7,229,911 - Rajagopalan , et al. June 12, 2 | 2007-06-12 |
| High-power dielectric seasoning for stable wafer-to-wafer thickness uniformity of dielectric CVD films App 20060093756 - Rajagopalan; Nagarajan ; et al. | 2006-05-04 |
| Adhesion improvement for low k dielectrics to conductive materials App 20060046479 - Rajagopalan; Nagarajan ; et al. | 2006-03-02 |
| Adhesion improvement for low k dielectrics to conductive materials App 20050233555 - Rajagopalan, Nagarajan ; et al. | 2005-10-20 |
| Methods and apparatuses promoting adhesion of dielectric barrier film to copper App 20050186339 - Rajagopalan, Nagarajan ; et al. | 2005-08-25 |
| Reduction of hillocks prior to dielectric barrier deposition in Cu damascene App 20040231795 - Rajagopalan, Nagarajan ; et al. | 2004-11-25 |
| Reduction of hillocks prior to dielectric barrier deposition in Cu damascene App 20040235292 - Rajagopalan, Nagarajan ; et al. | 2004-11-25 |
| Method for forming silicon containing layers on a substrate Grant 6,656,840 - Rajagopalan , et al. December 2, 2 | 2003-12-02 |
| Method For Forming Silicon Containing Layers On A Substrate App 20030203614 - Rajagopalan, Nagarajan ; et al. | 2003-10-30 |
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