Raj; Pulugurtha Markondeya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Raj; Pulugurtha Markondeya.The latest application filed is for "second level interconnect structures and methods of making the same".

Company Profile

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Raj; Pulugurtha Markondeya - Tucker GA
Raj; Pulugurtha Markondeya - Atlanta GA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Interconnect structures and methods of making the same Grant 9,173,282 - Raj , et al. October 27, 2	2015-10-27
Stress relieving second level interconnect structures and methods of making the same Grant 8,970,036 - Raj , et al. March 3, 2	2015-03-03
Second Level Interconnect Structures and Methods of Making the Same App 20130270695 - Raj; Pulugurtha Markondeya ; et al.	2013-10-17
Interconnect Structures And Methods Of Making The Same App 20130107485 - Raj; Pulugurtha Markondeya ; et al.	2013-05-02
Lead-free bonding systems Grant 7,556,189 - Aggarwal , et al. July 7, 2	2009-07-07
High-aspect-ratio metal-polymer composite structures for nano interconnects Grant 7,557,448 - Aggarwal , et al. July 7, 2	2009-07-07
High-aspect-ratio Metal-polymer Composite Structures For Nano Interconnects App 20080136035 - Aggarwal; Ankur ; et al.	2008-06-12
High-aspect-ratio metal-polymer composite structures for nano interconnects Grant 7,262,075 - Aggarwal , et al. August 28, 2	2007-08-28
Lead-free bonding systems App 20050274227 - Aggarwal, Ankur ; et al.	2005-12-15
High-aspect-ratio metal-polymer composite structures for nano interconnects App 20050191842 - Aggarwal, Ankur ; et al.	2005-09-01

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