Raghavan; Prasanna

Patent Applications and Registrations

Patent applications and USPTO patent grants for Raghavan; Prasanna.The latest application filed is for "die back side structures for warpage control".

Company Profile

4.4.5

Raghavan; Prasanna - Chandler AZ
Raghavan; Prasanna - US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Die back side structures for warpage control Grant 11,322,456 - Eid , et al. May 3, 2	2022-05-03
Coreless package architecture for multi-chip opto-electronics Grant 10,845,552 - Liff , et al. November 24, 2	2020-11-24
Die Back Side Structures For Warpage Control App 20200066655 - EID; Feras ; et al.	2020-02-27
Coreless Package Architecture For Multi-chip Opto-electronics App 20190317285 - LIFF; Shawna M. ; et al.	2019-10-17
Methods of forming trenches in packages structures and structures formed thereby Grant 10,231,338 - Yagnamurthy , et al.	2019-03-12
Electronic assembly that includes stacked electronic devices Grant 9,633,937 - Fei , et al. April 25, 2	2017-04-25
Methods Of Forming Trenches In Packages Structures And Structures Formed Thereby App 20160381800 - Yagnamurthy; Naga Sivakumar ; et al.	2016-12-29
Electronic Assembly That Includes Stacked Electronic Devices App 20160225707 - FEI; Huiyang ; et al.	2016-08-04
Low stress stacked die packages App 20070152314 - Manepalli; Rahul ; et al.	2007-07-05

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