Raffetto; Mark

Patent Applications and Registrations

Patent applications and USPTO patent grants for Raffetto; Mark.The latest application filed is for "ultra-thin ohmic contacts for p-type nitride light emitting devices".

Company Profile

0.8.6

Raffetto; Mark - Santa Barbara CA
Raffetto; Mark - Raleigh NC

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Ultra-thin ohmic contacts for p-type nitride light emitting devices Grant 8,759,868 - Raffetto , et al. June 24, 2	2014-06-24
Ultra-thin Ohmic Contacts For P-type Nitride Light Emitting Devices App 20120080688 - Raffetto; Mark ; et al.	2012-04-05
Ultra-thin ohmic contacts for p-type nitride light emitting devices Grant 8,089,090 - Raffetto , et al. January 3, 2	2012-01-03
Light emitting devices suitable for flip-chip bonding Grant 7,608,860 - Slater, Jr. , et al. October 27, 2	2009-10-27
Bonding of light emitting diodes having shaped substrates Grant 7,341,175 - Slater, Jr. , et al. March 11, 2	2008-03-11
Light Emitting Devices Suitable For Flip-chip Bonding App 20070241360 - Slater, Jr.; David B. ; et al.	2007-10-18
Flip-chip bonding of light emitting devices Grant 7,259,033 - Slater, Jr. , et al. August 21, 2	2007-08-21
Ultra-thin ohmic contacts for p-type nitride light emitting devices and methods of forming App 20060046328 - Raffetto; Mark ; et al.	2006-03-02
Flip-chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding Grant 6,888,167 - Slater, Jr. , et al. May 3, 2	2005-05-03
Bonding Of Light Emitting Diodes Having Shaped Substrates App 20040200882 - Slater, David B. JR. ; et al.	2004-10-14
Collets for bonding of light emitting diodes having shaped substrates Grant 6,747,298 - Slater, Jr. , et al. June 8, 2	2004-06-08
Bonding of light emitting diodes having shaped substrates and collets for bonding of light emitting diodes having shaped substrates App 20030042507 - Slater, David B. JR. ; et al.	2003-03-06
Flip-chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding App 20030045015 - Slater, David B. JR. ; et al.	2003-03-06

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