Patent | Date |
---|
Methods For Pillar Connection On Frontside And Passive Device Integration On Backside Of Die App 20220208758 - Alcorn; Terry ;   et al. | 2022-06-30 |
High electron mobility transistors having improved drain current drift and/or leakage current performance Grant 11,355,600 - Lee , et al. June 7, 2 | 2022-06-07 |
Field Effect Transistor With Enhanced Reliability App 20220130985 - Bothe; Kyle ;   et al. | 2022-04-28 |
Field Effect Transistor With At Least Partially Recessed Field Plate App 20220130966 - Bothe; Kyle ;   et al. | 2022-04-28 |
Semiconductor Device With Isolation And/Or Protection Structures App 20220102294 - Zhao; Lei ;   et al. | 2022-03-31 |
Die-to-die Isolation Structures For Packaged Transistor Devices App 20220037464 - Zhao; Lei ;   et al. | 2022-02-03 |
Integrated Doherty Amplifier with Added Isolation Between the Carrier and the Peaking Transistors App 20210399694 - Zhao; Lei ;   et al. | 2021-12-23 |
Methods For Pillar Connection On Frontside And Passive Device Integration On Backside Of Die App 20210375856 - Alcorn; Terry ;   et al. | 2021-12-02 |
Group III-Nitride High-Electron Mobility Transistors Configured with Recessed Source and/or Drain Contacts for Reduced On State Resistance and Process for Implementing the Same App 20210359118 - Radulescu; Fabian ;   et al. | 2021-11-18 |
Semiconductor Having a Backside Wafer Cavity for Radio Frequency (RF) Passive Device Integration and/or Improved Cooling and Process of Implementing the Same App 20210257320 - Radulescu; Fabian | 2021-08-19 |
Stepped field plates with proximity to conduction channel and related fabrication methods Grant 11,075,271 - Jones , et al. July 27, 2 | 2021-07-27 |
High Electron Mobility Transistors And Power Amplifiers Including Said Transistors Having Improved Performance And Reliability App 20210175351 - Bothe; Kyle ;   et al. | 2021-06-10 |
High Electron Mobility Transistors Having Improved Drain Current Drift And/or Leakage Current Performance App 20210134966 - Lee; Kyoung-Keun ;   et al. | 2021-05-06 |
Stepped Field Plates With Proximity To Conduction Channel And Related Fabrication Methods App 20210111254 - Jones; Evan ;   et al. | 2021-04-15 |
High electron mobility transistors and power amplifiers including said transistors having improved performance and reliability Grant 10,971,612 - Bothe , et al. April 6, 2 | 2021-04-06 |
High electron mobility transistors having improved drain current drift and/or leakage current performance Grant 10,937,873 - Lee , et al. March 2, 2 | 2021-03-02 |
High electron mobility transistors having improved contact spacing and/or improved contact vias Grant 10,923,585 - Bothe , et al. February 16, 2 | 2021-02-16 |
Semiconductor Die With Improved Ruggedness App 20210043530 - Hardiman; Chris ;   et al. | 2021-02-11 |
Packaged Electronic Circuits Having Moisture Protection Encapsulation And Methods Of Forming Same App 20210028127 - Bothe; Kyle ;   et al. | 2021-01-28 |
Semiconductor die with improved ruggedness Grant 10,886,189 - Hardiman , et al. January 5, 2 | 2021-01-05 |
High Electron Mobility Transistors Having Improved Contact Spacing And/or Improved Contact Vias App 20200395474 - Bothe; Kyle ;   et al. | 2020-12-17 |
High Electron Mobility Transistors And Power Amplifiers Including Said Transistors Having Improved Performance And Reliability App 20200395475 - Bothe; Kyle ;   et al. | 2020-12-17 |
Semiconductor die with improved ruggedness Grant 10,840,162 - Hardiman , et al. November 17, 2 | 2020-11-17 |
Packaged electronic circuits having moisture protection encapsulation and methods of forming same Grant 10,811,370 - Bothe , et al. October 20, 2 | 2020-10-20 |
High Electron Mobility Transistors Having Improved Drain Current Drift And/or Leakage Current Performance App 20200219987 - Lee; Kyoung-Keun ;   et al. | 2020-07-09 |
Packaged Electronic Circuits Having Moisture Protection Encapsulation And Methods Of Forming Same App 20190326230 - Bothe; Kyle ;   et al. | 2019-10-24 |
Semiconductor Die With Improved Ruggedness App 20190259682 - Hardiman; Chris ;   et al. | 2019-08-22 |
Semiconductor die with improved ruggedness Grant 10,332,817 - Hardiman , et al. | 2019-06-25 |
Semiconductor Die With Improved Ruggedness App 20190172769 - Hardiman; Chris ;   et al. | 2019-06-06 |
Recessed field plate transistor structures Grant 9,847,411 - Sriram , et al. December 19, 2 | 2017-12-19 |
Cascode structures for GaN HEMTs Grant 9,679,981 - Sriram , et al. June 13, 2 | 2017-06-13 |
Semiconductor device with improved field plate Grant 9,608,078 - Hagleitner , et al. March 28, 2 | 2017-03-28 |
Wafer-level die attach metallization Grant 9,536,783 - Radulescu , et al. January 3, 2 | 2017-01-03 |
Tunnel junction field effect transistors having self-aligned source and gate electrodes and methods of forming the same Grant 9,356,129 - Radulescu , et al. May 31, 2 | 2016-05-31 |
Semiconductor device with self-aligned ohmic contacts Grant 9,343,561 - Radulescu May 17, 2 | 2016-05-17 |
Gate contact for a semiconductor device and methods of fabrication thereof Grant 9,343,543 - Radulescu , et al. May 17, 2 | 2016-05-17 |
Semiconductor Device With Improved Field Plate App 20160111503 - Hagleitner; Helmut ;   et al. | 2016-04-21 |
Tunnel Junction Field Effect Transistors Having Self-Aligned Source and Gate Electrodes and Methods of Forming the Same App 20160087088 - Radulescu; Fabian ;   et al. | 2016-03-24 |
Using stress reduction barrier sub-layers in a semiconductor die Grant 9,269,662 - Ring , et al. February 23, 2 | 2016-02-23 |
Method of manufacturing precise semiconductor contacts Grant 9,245,890 - Radulescu January 26, 2 | 2016-01-26 |
Gate Contact For A Semiconductor Device And Methods Of Fabrication Thereof App 20150364569 - Radulescu; Fabian ;   et al. | 2015-12-17 |
Tunnel junction field effect transistors having self-aligned source and gate electrodes and methods of forming the same Grant 9,202,903 - Radulescu , et al. December 1, 2 | 2015-12-01 |
Ni-rich Schottky contact Grant 9,202,703 - Hagleitner , et al. December 1, 2 | 2015-12-01 |
Method Of Manufacturing Precise Semiconductor Contacts App 20150236017 - Radulescu; Fabian | 2015-08-20 |
Wafer-level Die Attach Metallization App 20150140806 - Radulescu; Fabian ;   et al. | 2015-05-21 |
Dielectric solder barrier for semiconductor devices Grant 8,994,182 - Hagleitner , et al. March 31, 2 | 2015-03-31 |
Wafer-level die attach metallization Grant 8,970,010 - Radulescu , et al. March 3, 2 | 2015-03-03 |
Gate contact for a semiconductor device and methods of fabrication thereof Grant 8,969,927 - Radulescu , et al. March 3, 2 | 2015-03-03 |
CASCODE STRUCTURES FOR GaN HEMTs App 20140361341 - Sriram; Saptharishi ;   et al. | 2014-12-11 |
Recessed Field Plate Transistor Structures App 20140361342 - Sriram; Saptharishi ;   et al. | 2014-12-11 |
Semiconductor Device With Self-aligned Ohmic Contacts App 20140264381 - Radulescu; Fabian | 2014-09-18 |
Gate Contact For A Semiconductor Device And Methods Of Fabrication Thereof App 20140264713 - Radulescu; Fabian ;   et al. | 2014-09-18 |
Wafer-level Die Attach Metallization App 20140264868 - Radulescu; Fabian ;   et al. | 2014-09-18 |
Tunnel Junction Field Effect Transistors Having Self-aligned Source And Gate Electrodes And Methods Of Forming The Same App 20140246699 - Radulescu; Fabian ;   et al. | 2014-09-04 |
Dielectric Solder Barrier For Semiconductor Devices App 20140175664 - Hagleitner; Helmut ;   et al. | 2014-06-26 |
Ni-rich Schottky Contact App 20140124792 - Hagleitner; Helmut ;   et al. | 2014-05-08 |
Using Stress Reduction Barrier Sub-layers In A Semiconductor Die App 20140103363 - Ring; Zoltan ;   et al. | 2014-04-17 |
Methods of forming semiconductor contacts Grant 8,357,571 - Radulescu , et al. January 22, 2 | 2013-01-22 |
Methods of Forming Semiconductor Contacts and Related Semiconductor Devices App 20120119260 - Radulescu; Fabian ;   et al. | 2012-05-17 |
Thin film resistor and method of making the same Grant 7,276,777 - Radulescu October 2, 2 | 2007-10-02 |
Thin film resistor and method of making the same App 20070023863 - Radulescu; Fabian | 2007-02-01 |