Radhakrishnan; Satish
Patent Applications and Registrations
Patent applications and USPTO patent grants for Radhakrishnan; Satish.The latest application filed is for "cover wafer for semiconductor processing chamber".
- Radhakrishnan; Satish - San Jose CA
- Radhakrishnan; Satish - Hillsboro OR
| Patent | Date |
|---|---|
| Apparatus and method for controlling a flow process material to a deposition chamber Grant 11,393,703 - Lerner , et al. July 19, 2 | 2022-07-19 |
| Cover Wafer For Semiconductor Processing Chamber App 20220122822 - Parimi; Venkata Sharat Chandra ; et al. | 2022-04-21 |
| Systems And Methods For Substrate Support Temperature Control App 20210320027 - Huang; Zubin ; et al. | 2021-10-14 |
| Thermally Controlled Lid Stack Components App 20210320018 - Chandrasekar; Siva ; et al. | 2021-10-14 |
| Targeted Heat Control Systems App 20210202218 - Parimi; Venkata Sharat Chandra ; et al. | 2021-07-01 |
| Radiation Shield Modification For Improving Substrate Temperature Uniformity App 20210166921 - Neville; Elizabeth ; et al. | 2021-06-03 |
| Evaporator Chamber For Forming Films On Substrates App 20210025048 - LERNER; Alexander N. ; et al. | 2021-01-28 |
| Methods And Systems For Forming Films On Substrates App 20200378000 - Lerner; Alexander N. ; et al. | 2020-12-03 |
| Heated Pedestal Design For Improved Heat Transfer And Temperature Uniformity App 20200234932 - PARIMI; Venkata Sharat Chandra ; et al. | 2020-07-23 |
| Segmented Showerhead For Uniform Delivery Of Multiple Precursors App 20200087790 - LERNER; ALEXANDER ; et al. | 2020-03-19 |
| Showerhead For Providing Multiple Materials To A Process Chamber App 20200048767 - KOTHNUR; PRASHANTH ; et al. | 2020-02-13 |
| Apparatus And Method For Controlling A Flow Process Material To A Deposition Chamber App 20190382890 - LERNER; ALEXANDER ; et al. | 2019-12-19 |
| Debond interconnect structures Grant 9,461,010 - Ma , et al. October 4, 2 | 2016-10-04 |
| Debond Interconnect Structures App 20160133596 - Ma; Qing ; et al. | 2016-05-12 |
| Debond interconnect structures Grant 9,269,686 - Ma , et al. February 23, 2 | 2016-02-23 |
| Debond Interconnect Structures App 20140106560 - Ma; Qing ; et al. | 2014-04-17 |
| Debond interconnect structures Grant 8,637,778 - Ma , et al. January 28, 2 | 2014-01-28 |
| Debond Interconnect Structures App 20110247872 - Ma; Qing ; et al. | 2011-10-13 |
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