loadpatents
name:-0.061032056808472
name:-0.0030791759490967
name:-0.00034809112548828
Rachapalli; Harinath Patent Filings

Rachapalli; Harinath

Patent Applications and Registrations

Patent applications and USPTO patent grants for Rachapalli; Harinath.The latest application filed is for "system and method for providing maximum fill link via bonded services".

Company Profile
0.3.4
  • Rachapalli; Harinath - WoodRidge IL
  • Rachapalli; Harinath - Naperville IL
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
System And Method For Providing Maximum Fill Link Via Bonded Services
App 20160262073 - Muley; Praveen Vasant ;   et al.
2016-09-08
Handling of NRS and BCM in PCRF and GW
Grant 8,855,125 - Xue , et al. October 7, 2
2014-10-07
Handling Of Nrs And Bcm In Pcrf And Gw
App 20140177533 - Xue; Xiong ;   et al.
2014-06-26
Method of supporting quality-of-service application session continuity during inter-technology handover using a common packet data function
Grant 7,920,523 - Grinshpun , et al. April 5, 2
2011-04-05
Method Of Supporting Quality-of-service Application Session Continuity During Inter-technology Handover Using A Common Packet Data Function
App 20090175239 - Grinshpun; Edward ;   et al.
2009-07-09

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