Quinones; Maria Clemens Y.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Quinones; Maria Clemens Y..The latest application filed is for "semiconductor die package including low stress configuration".
- Quinones; Maria Clemens Y. - Cebu PH
- Quinones; Maria Clemens Y. - Cebu City PH
| Patent | Date |
|---|---|
| Semiconductor die package including low stress configuration Grant 9,583,454 - Quinones , et al. February 28, 2 | 2017-02-28 |
| SiP substrate Grant 8,372,690 - Quinones , et al. February 12, 2 | 2013-02-12 |
| Semiconductor Die Package Including Low Stress Configuration App 20120083071 - Quinones; Maria Clemens Y. ; et al. | 2012-04-05 |
| Semiconductor die package including low stress configuration Grant 8,106,501 - Quinones , et al. January 31, 2 | 2012-01-31 |
| Package Assembly For Semiconductor Devices App 20110244633 - Madrid; Ruben P. ; et al. | 2011-10-06 |
| SiP SUBSTRATE App 20110133318 - Quinones; Maria Clemens Y. ; et al. | 2011-06-09 |
| SiP substrate Grant 7,893,548 - Quinones , et al. February 22, 2 | 2011-02-22 |
| Flex chip connector for semiconductor device Grant 7,824,966 - Quinones , et al. November 2, 2 | 2010-11-02 |
| Package Assembly For Semiconductor Devices App 20100164078 - Madrid; Ruben ; et al. | 2010-07-01 |
| Semiconductor Die Package Including Low Stress Configuration App 20100148346 - Quinones; Maria Clemens Y. ; et al. | 2010-06-17 |
| Optical coupler package Grant 7,659,531 - Choi , et al. February 9, 2 | 2010-02-09 |
| Flex Chip Connector For Semiconductor Device App 20090311832 - Quinones; Maria Clemens Y. ; et al. | 2009-12-17 |
| Flex clip connector for semiconductor device Grant 7,626,249 - Quinones , et al. December 1, 2 | 2009-12-01 |
| SiP SUBSTRATE App 20090236702 - Quinones; Maria Clemens Y. ; et al. | 2009-09-24 |
| Optical Coupler Package App 20080251739 - Choi; Yoon Hwa ; et al. | 2008-10-16 |
| Surface mount multi-channel optocoupler Grant 7,196,313 - Quinones , et al. March 27, 2 | 2007-03-27 |
| Flip clip attach and copper clip attach on MOSFET device Grant 7,052,938 - Estacio , et al. May 30, 2 | 2006-05-30 |
| Surface mount multi-channel optocoupler App 20050218300 - Quinones, Maria Clemens Y. ; et al. | 2005-10-06 |
| Flip clip attach and copper clip attach on MOSFET device App 20050130350 - Estacio, Maria Cristina B. ; et al. | 2005-06-16 |
| Flip clip attach and copper clip attach on MOSFET device Grant 6,870,254 - Estacio , et al. March 22, 2 | 2005-03-22 |
| Semiconductor die package including drain clip Grant 6,777,800 - Madrid , et al. August 17, 2 | 2004-08-17 |
| Method of packaging a plurality of devices utilizing a plurality of lead frames coupled together by rails Grant 6,762,067 - Quinones , et al. July 13, 2 | 2004-07-13 |
| Semiconductor die package including drain clip App 20040063240 - Madrid, Ruben ; et al. | 2004-04-01 |
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