| Patent | Date |
|---|
Multicomponent Module Design And Fabrication
App 20220308564 - Peterson; Kirk D. ; et al. | 2022-09-29 |
Direct attachment of capacitors to flip chip dies
Grant 11,404,365 - Arvin , et al. August 2, 2 | 2022-08-02 |
Thin film capacitors for core and adjacent build up layers
Grant 11,388,821 - Arvin , et al. July 12, 2 | 2022-07-12 |
Enlarged conductive pad structures for enhanced chip bond assembly yield
Grant 11,282,773 - Tunga , et al. March 22, 2 | 2022-03-22 |
Mitigating thermal-mechanical strain and warpage of an organic laminate substrate
Grant 11,239,183 - Sinha , et al. February 1, 2 | 2022-02-01 |
Enlarged Conductive Pad Structures For Enhanced Chip Bond Assembly Yield
App 20210320056 - Tunga; Krishna R. ; et al. | 2021-10-14 |
Flip chip packaging rework
Grant 11,121,101 - Arvin , et al. September 14, 2 | 2021-09-14 |
Mitigating Thermal-mechanical Strain And Warpage Of An Organic Laminate Substrate
App 20210242139 - Sinha; Tuhin ; et al. | 2021-08-05 |
Flip Chip Packaging Rework
App 20210242146 - Arvin; Charles Leon ; et al. | 2021-08-05 |
Stacked capacitors for use in integrated circuit modules and the like
Grant 11,004,614 - Arvin , et al. May 11, 2 | 2021-05-11 |
Bridge support structure
Grant 10,957,650 - Arvin , et al. March 23, 2 | 2021-03-23 |
Bridge Support Structure
App 20210057341 - Arvin; Charles L. ; et al. | 2021-02-25 |
Multiple chip carrier for bridge assembly
Grant 10,916,507 - Arvin , et al. February 9, 2 | 2021-02-09 |
Carrier and integrated memory
Grant 10,892,249 - Arvin , et al. January 12, 2 | 2021-01-12 |
Carrier and integrated memory
Grant 10,840,214 - Arvin , et al. November 17, 2 | 2020-11-17 |
Direct Attachment Of Capacitors To Flip Chip Dies
App 20200357737 - Arvin; Charles L. ; et al. | 2020-11-12 |
Connected plane stiffener within integrated circuit chip carrier
Grant 10,770,385 - Call , et al. Sep | 2020-09-08 |
Decoupling capacitor stiffener
Grant 10,756,031 - Arvin , et al. A | 2020-08-25 |
Thin Film Capacitors For Core And Adjacent Build Up Layers
App 20200245466 - Kind Code | 2020-07-30 |
Stacked Capacitors For Use In Integrated Circuit Modules And The Like
App 20200185156 - Arvin; Charles L. ; et al. | 2020-06-11 |
Multiple Chip Carrier For Bridge Assembly
App 20200176383 - Arvin; Charles L. ; et al. | 2020-06-04 |
Lead-free Solder Joining Of Electronic Structures
App 20200161272 - ARVIN; CHARLES L. ; et al. | 2020-05-21 |
Thin film capacitors for core and adjacent build up layers
Grant 10,660,209 - Arvin , et al. | 2020-05-19 |
Multi terminal capacitor within input output path of semiconductor package interconnect
Grant 10,622,299 - Arvin , et al. | 2020-04-14 |
Reduction of laminate failure in integrated circuit (IC) device carrier
Grant 10,607,928 - Call , et al. | 2020-03-31 |
Lead-free solder joining of electronic structures
Grant 10,586,782 - Arvin , et al. | 2020-03-10 |
Element place on laminates
Grant 10,566,275 - Arvin , et al. Feb | 2020-02-18 |
Connected Plane Stiffener Within Integrated Circuit Chip Carrier
App 20200035593 - Call; Anson J. ; et al. | 2020-01-30 |
Carrier and integrated memory
Grant 10,515,929 - Arvin , et al. Dec | 2019-12-24 |
Carrier And Integrated Memory
App 20190378816 - Arvin; Charles L. ; et al. | 2019-12-12 |
Carrier And Integrated Memory
App 20190312011 - Arvin; Charles L. ; et al. | 2019-10-10 |
Carrier And Integrated Memory
App 20190312010 - Arvin; Charles L. ; et al. | 2019-10-10 |
Carrier And Integrated Memory
App 20190312009 - Arvin; Charles L. ; et al. | 2019-10-10 |
Carrier and integrated memory
Grant 10,431,563 - Arvin , et al. O | 2019-10-01 |
Multi Terminal Capacitor Within Input Output Path Of Semiconductor Package Interconnect
App 20190172784 - Arvin; Charles L. ; et al. | 2019-06-06 |
Element Place On Laminates
App 20190148283 - Arvin; Charles L. ; et al. | 2019-05-16 |
Thin Film Capacitors For Core And Adjacent Build Up Layers
App 20190150287 - Arvin; Charles L. ; et al. | 2019-05-16 |
Element place on laminates
Grant 10,224,269 - Arvin , et al. | 2019-03-05 |
Multi terminal capacitor within input output path of semiconductor package interconnect
Grant 10,224,273 - Arvin , et al. | 2019-03-05 |
Multi terminal capacitor within input output path of semiconductor package interconnect
Grant 10,224,274 - Arvin , et al. | 2019-03-05 |
Lead-free Solder Joining Of Electronic Structures
App 20190006312 - ARVIN; CHARLES L. ; et al. | 2019-01-03 |
Multi Terminal Capacitor Within Input Output Path Of Semiconductor Package Interconnect
App 20180068945 - Arvin; Charles L. ; et al. | 2018-03-08 |
Multi Terminal Capacitor Within Input Output Path Of Semiconductor Package Interconnect
App 20180053717 - Arvin; Charles L. ; et al. | 2018-02-22 |
Multi terminal capacitor within input output path of semiconductor package interconnect
Grant 9,899,313 - Arvin , et al. February 20, 2 | 2018-02-20 |
Multi Terminal Capacitor Within Input Output Path Of Semiconductor Package Interconnect
App 20180012838 - Arvin; Charles L. ; et al. | 2018-01-11 |
Wiring board with stacked embedded capacitors and method of making
Grant 9,743,526 - Blackshear , et al. August 22, 2 | 2017-08-22 |
Wiring Board With Stacked Embedded Capacitors And Method Of Making
App 20170231094 - Blackshear; Edmund ; et al. | 2017-08-10 |
Element Place On Laminates
App 20170179015 - Arvin; Charles L. ; et al. | 2017-06-22 |
Protection Of Elements On A Laminate Surface
App 20170179042 - Arvin; Charles L. ; et al. | 2017-06-22 |
Under die surface mounted electrical elements
Grant 9,601,423 - Arvin , et al. March 21, 2 | 2017-03-21 |
UV-curable solvent free compositions and use thereof in ceramic chip defect repair
Grant 7,329,439 - Sachdev , et al. February 12, 2 | 2008-02-12 |
UV-curable solvent free compositions and use thereof in ceramic chip defect repair
App 20060069177 - Sachdev; Krishna G. ; et al. | 2006-03-30 |
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