Quiazon; Robinson

Patent Applications and Registrations

Patent applications and USPTO patent grants for Quiazon; Robinson.The latest application filed is for "semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof".

Company Profile

0.7.6

Quiazon; Robinson - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof Grant 8,405,230 - Lee , et al. March 26, 2	2013-03-26
Semiconductor Flip Chip Package Having Substantially Non-collapsible Spacer And Method Of Manufacture Thereof App 20110108970 - Lee; Jae Soo ; et al.	2011-05-12
Semiconductor flip chip package having substantially non-collapsible spacer Grant 7,880,313 - Lee , et al. February 1, 2	2011-02-01
Integrated circuit encapsulation system with vent Grant 7,482,683 - Dimaano, Jr. , et al. January 27, 2	2009-01-27
Integrated circuit package system with downset lead Grant 7,443,015 - Punzalan , et al. October 28, 2	2008-10-28
Etched leadframe flipchip package system Grant 7,414,318 - Shim , et al. August 19, 2	2008-08-19
Integrated Circuit Encapsulation System With Vent App 20070262423 - Dimaano; Antonio B. JR. ; et al.	2007-11-15
Etched Leadframe Flipchip Package System App 20070241432 - Shim; Il Kwon ; et al.	2007-10-18
Etched leadframe flipchip package system Grant 7,250,685 - Shim , et al. July 31, 2	2007-07-31
Integrated Circuit Package System With Downset Lead App 20070108624 - Punzalan; Jeffrey D. ; et al.	2007-05-17
Etched Leadframe Flipchip Package System App 20070108565 - Shim; Il Kwon ; et al.	2007-05-17
Semiconductor package flip chip interconnect having spacer App 20060192295 - Lee; Jae Soo ; et al.	2006-08-31

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