Questad; David

Patent Applications and Registrations

Patent applications and USPTO patent grants for Questad; David.The latest application filed is for "electronic components on trenched substrates and method of forming same".

Company Profile

0.9.10

Questad; David - Hopewell Junction NY
Questad; David - Hoewell Junction NY
Questad; David - Vestal NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic components on trenched substrates and method of forming same Grant 9,508,789 - Questad , et al. November 29, 2	2016-11-29
Electronic Components On Trenched Substrates And Method Of Forming Same App 20140151849 - Questad; David ; et al.	2014-06-05
Electronic components on trenched substrates and method of forming same Grant 8,659,119 - Kharma , et al. February 25, 2	2014-02-25
Electronic components on trenched substrates and method of forming same Grant 8,054,630 - Questad , et al. November 8, 2	2011-11-08
Electronic components on trenched substrates and method of forming same Grant 7,855,430 - Questad , et al. December 21, 2	2010-12-21
Electronic Components On Trenched Substrates And Method Of Forming Same App 20100276784 - Questad; David ; et al.	2010-11-04
Electronic components on trenched substrates and method of forming same Grant 7,777,301 - Questad , et al. August 17, 2	2010-08-17
Electronic components on trenched substrates and method of forming same Grant 7,732,894 - Questad , et al. June 8, 2	2010-06-08
Electronic Components On Trenched Substrates And Method Of Forming Same App 20090085161 - Questad; David ; et al.	2009-04-02
Electronic Components On Trenched Substrates And Method Of Forming Same App 20080226875 - Questad; David ; et al.	2008-09-18
Electronic Components On Trenched Substrates And Method Of Forming Same App 20080218990 - Questad; David ; et al.	2008-09-11
Electronic Components On Trenched Substrates And Method Of Forming Same App 20080205023 - Khanna; Vijayeshwar D. ; et al.	2008-08-28
Electronic Components On Trenched Substrates And Method Of Forming Same App 20080205024 - Questad; David ; et al.	2008-08-28
Electronic package with optimized lamination process Grant 7,329,816 - Farquhar , et al. February 12, 2	2008-02-12
Electronic Package With Optimized Lamination Process App 20080022519 - Farquhar; Donald S. ; et al.	2008-01-31
Electronic package with optimized lamination process Grant 7,059,049 - Farquhar , et al. June 13, 2	2006-06-13
Electronic package with optimized lamination process App 20050224961 - Farquhar, Donald S. ; et al.	2005-10-13
Electronic package with optimized lamination process App 20030020156 - Farquhar, Donald S. ; et al.	2003-01-30

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