QUERCIA; Fabien

Patent Applications and Registrations

Patent applications and USPTO patent grants for QUERCIA; Fabien.The latest application filed is for "integrated circuit package with heat sink and manufacturing method thereof".

Company Profile

7.5.11

QUERCIA; Fabien - Saint Marcelin FR
Quercia; Fabien - Isere FR
Quercia; Fabien - Echirolles FR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated Circuit Package With Heat Sink And Manufacturing Method Thereof App 20220157683 - BOUTALEB; Younes ; et al.	2022-05-19
Electronic Chip Support Device And Corresponding Manufacturing Method App 20210328403 - QUERCIA; Fabien ; et al.	2021-10-21
Electronic Device Comprising A Transparent Encapsulation Structure Housing An Electronic Chip And Corresponding Production Method App 20210320473 - QUERCIA; Fabien ; et al.	2021-10-14
Electronics Unit With Integrated Metallic Pattern App 20210242115 - COFFY; Romain ; et al.	2021-08-05
Electronic device comprising an electronic component mounted on a support substrate and assembly method Grant 10,897,822 - Quercia , et al. January 19, 2	2021-01-19
Electronic Device Comprising An Electronic Component Mounted On A Support Substrate And Assembly Method App 20200305283 - QUERCIA; Fabien ; et al.	2020-09-24
Method For Forming An Electrical Connection Between An Electronic Chip And A Carrier Substrate And Electronic Device App 20200227382 - AUCHERE; David ; et al.	2020-07-16
Method For Mounting Component App 20200196433 - Auchere; David ; et al.	2020-06-18
Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device Grant 10,643,970 - Auchere , et al.	2020-05-05
Method For Forming An Electrical Connection Between An Electronic Chip And A Carrier Substrate And Electronic Device App 20190148334 - AUCHERE; David ; et al.	2019-05-16
Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device Grant 10,224,306 - Auchere , et al.	2019-03-05
Method For Forming An Electrical Connection Between An Electronic Chip And A Carrier Substrate And Electronic Device App 20180122770 - Auchere; David ; et al.	2018-05-03
Copper wire receiving pad Grant 9,337,160 - Veychard , et al. May 10, 2	2016-05-10
Copper Wire Receiving Pad App 20130001777 - Veychard; Damien ; et al.	2013-01-03
Method Of Electrically Connecting A Wire To A Pad Of An Integrated Circuit Chip And Electronic Device App 20110018135 - Coffy; Romain ; et al.	2011-01-27

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