Quah; Guan Keng
Patent Applications and Registrations
Patent applications and USPTO patent grants for Quah; Guan Keng.The latest application filed is for "semiconductor package structure and method of manufacture".
- Quah; Guan Keng - Gilbert AZ
| Patent | Date |
|---|---|
| Semiconductor Package Structure And Method Of Manufacture App 20080054420 - Quah; Guan Keng ; et al. | 2008-03-06 |
| Method for making a direct chip attach device and structure Grant 7,144,538 - Lee , et al. December 5, 2 | 2006-12-05 |
| Structure and method of direct chip attach Grant 7,098,051 - Quah August 29, 2 | 2006-08-29 |
| Method Of Forming A Leadframe For A Semiconductor Package App 20050037544 - Quah, Guan Keng ; et al. | 2005-02-17 |
| Method of forming a leadframe for a semiconductor package Grant 6,852,574 - Quah , et al. February 8, 2 | 2005-02-08 |
| Method for making a direct chip attach device and structure App 20040262811 - Lee, Yeu Wen ; et al. | 2004-12-30 |
| Direct Chip Attach Structure And Method App 20040266037 - Knapp, James ; et al. | 2004-12-30 |
| Direct chip attach structure and method Grant 6,835,580 - Knapp , et al. December 28, 2 | 2004-12-28 |
| Structure and method of direct chip attach App 20040219718 - Quah, Guan Keng | 2004-11-04 |
| Structure and method of direct chip attach Grant 6,787,392 - Quah September 7, 2 | 2004-09-07 |
| Structure and method of direct chip attach App 20040048413 - Quah, Guan Keng | 2004-03-11 |
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